Radar module packaging body and manufacturing method thereof

Abstract

The present invention relates to a radar module packaging body. The radar module packaging body comprises: a box cover having a metal layer arranged at the inner surface of the box cover, wherein a cavity is formed between the box cover and a box body; the box body, wherein the box body comprises a first insulation body connected with the box cover, the first insulation body is internally provided with a hole channel, one end of the hole channel corresponds to the position of an antenna, and the other end of the hole channel is communicate with the cavity, and the box body also comprises one or more than one chips which are arranged on a second insulation body in an inversion mode and are covered with the first insulation body, the second insulation body and a third insulation body; and the antenna and a conduction circuit which are arranged in the third insulation body and pass through the second insulation to connect with the bonding pads of the one or more than one chips, wherein the metal barrier layers are arranged between the antenna and the bonding pads and between the conduction circuit and the bonding pads, and the conduction circuit is exposed from the third insulation body for electric contact. The present invention further relates to the manufacturing method of the packaging body.

Description

technical field [0001] The present invention relates generally to the field of semiconductor manufacturing, and in particular to a radar component package and a method for manufacturing such a radar component package. Background technique [0002] As the functions of consumer products become more and more diverse, there is a need for wireless detection (such as detection of moving objects and their speed) in many fields such as automobiles, robots and smartphones, so the application of radar components is increasing. However, applications in many fields, such as smartphones, balloons, airships, etc., impose strict requirements on the size and weight of radar components, so technicians have been trying to improve the integration of radar component packages to reduce its weight and size. [0003] From the Chinese patent application 201510149446.5 titled "A device for four-sided flat leadless packaged radar transceiver assembly", a packaged radar transceiver assembly is disclo...

AI Technical Summary

Problems solved by technology

However, the disadvantage of this packaged radar transceiver assembly is that it uses wire bonding to arrange the chips, which not only causes the length of the line to be too long and thus causes a large loss, but also needs to reserve a certain height in the box for wire bonding. bonded wires, resulting in a larger thickness of the component

In addition, the manufacture of the packaged radar transceiver component adopts the traditional packaging process including patching, wire bonding, and substrate manufacturing steps, so that the thickness of the substrate and chip limits the further reduction of the thickness of the component

Images