864results about "Circuit lead arrangements/relief" patented technology

A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the MEMS sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers.

A fully integrated, low cost, amplified electro-acoustic loudspeaker is disclosed in which an amplifier circuit (30, 130, 230, 330, 930, 1030), radio-frequency receiver amplifier circuit (430, 530), optical receiver amplifier circuit (630, 730), or network based amplifier circuit (830) is directly mounted on the loudspeaker's magnetic assembly (105, 505, 705, 805), contained within the loudspeaker's moving assembly (20, 29, 629, 42, 45, 50, 65), or a combination thereof. The amplified loudspeaker's magnetic assembly (5, 105, 405, 505, 705, 805, 905, 1005) is utilized as an electro-magnetic interference shield and / or a heat dissipating element for the attached electronic circuitry. In selected embodiments of the amplified loudspeaker system, the former (42) containing voice coil (45) is additionally utilized for convection cooling of the amplifier circuit (30, 230) or receiver / amplifier circuit combination (430, 630).

Disclosed are a silicon based condenser microphone and a packaging method for the silicon based condenser microphone. The silicon based condenser microphone comprises a metal case, and a board which is mounted with a MEMS microphone chip and an ASIC chip having an electric voltage pump and a buffer IC and is formed with a connecting pattern for bonding with the metal case, wherein the connecting pattern is welded to the metal case. The method for packaging a silicon based condenser microphone includes the steps of inputting a board which is mounted with a MEMS chip and an ASIC chip and is formed with a connecting pattern; inputting a metal case, aligning the metal case on the connecting pattern of the board, and welding an opened end of the metal case to the connecting pattern of the board. Thus, the metal case is welded to the board by the laser.

A MEMS microphone includes a cover, a housing engaging with the cover for forming a cavity, at least one transducer accommodated in the cavity, and a conductive case covering the cover and the sidewall of the housing. The housing includes a cover and a sidewall extending from the base. The conductive case defines a first part covering the cover, a second part extending from the first part for covering the sidewall and a third part perpendicularly extending from the second part for covering a periphery part of the base, the third part forming an opening.

An earphone arrangement comprises a microphone (109) which generates a microphone signal and a sound transducer (101) which radiates a first sound component to a user's ear (103) in response to a drive signal. An acoustic channel (111) is further provided for channeling external sound so as to provide a second sound component to the user's ear (103). An acoustic valve (117) allows the attenuation of the acoustic channel (111) to be controlled in response to a valve control signal. A control circuit (105) generates the valve control signal in response to the microphone signal to provide a variable attenuation resulting in a mixed sound of the first sound component and the second sound component reaching the user's ear (103). The combined use of acoustic and e.g. electric signal paths allows improved performance and in particular allows a dynamic trade-off between open and closed earphone design characteristics with respect to external sounds.

An earphone that possesses an outer ear canal insertion member for which at least a portion can be inserted into the outer ear canal, a housing onto which the outer ear canal insertion member is installed, a driver unit which is disposed within the housing and which generates sound, a first retention member through the interior of which passes a cable connected at one end to the driver unit and which is itself directly installed to the housing, and a second retention member through the interior of which passes the cable and which is itself installed to the first retention member; and when the second retention member is installed to the first retention member, the first retention member grasps the cable.

In an electroacoustic transducer, a pair of coil terminals elongating from a voice coil are electrically connected to a pair of terminal members attached to a frame via a flexible printed circuit board, respectively. According to the configuration, even in a case where an electroacoustic transducer is used at a high sound pressure, breakage of the coil terminals hardly occurs. In the flexible printed circuit board, the width of an intermediate portion is set to be smaller than the widths of an end portion on the side of the coil terminals and an end portion on the side of the terminal members. Therefore, the flexibility of the intermediate portion can be enhanced, whereby transmission of characteristic vibration of the flexible printed circuit board to a diaphragm, and stress concentration in the vicinity of the end portions are effectively suppressed.

A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the MEMS sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers.

A voltage supply circuit comprises a voltage control circuit for outputting a bias voltage control signal according to a set value based on a bias voltage of a sensor and a voltage generation circuit for generating the bias voltage to be applied to the sensor based on the bias voltage control signal.

A wireless speaker assembly is disclosed. The wireless speaker assembly comprises a housing and an electrical plug comprising one or more prongs, where those one or more prongs can be disposed within the housing. The wireless speaker assembly further comprises an AC adapter interconnected to the electrical plug, where that AC adapter can convert AC power to DC power. The wireless speaker assembly further comprises a receiver circuit disposed within the housing and an interconnected antenna disposed within said housing, where the antenna in combination with the receiver circuit can receive Bluetooth compliant wireless signals. The wireless speaker assembly further comprises at least one speaker disposed within the housing, where the at least one speaker receives an audio signal produced by the receiver circuit. Applicant's wireless speaker assembly does not comprise any wires or cables extending outwardly from the housing.

The invention relates to a micro-speaker with a second suspension made of highly resilient material installed inside of the speaker. The speaker is able to provide high level acoustic output with low distortion rate in a wide frequency range with a very small and slim structure and it may prevent a disconnection of a lead connecting the voice coil and the electrode. The speaker includes a yoke, a permanent magnet, a plate, a vibration plate integrated with a first suspension, a voice coil, a frame and a protector. The speaker further comprises a second suspension made of highly resilient material installed between the plate and the vibration plate, and is characterized in that the voice coil is attached to the lower surface of the second suspension and the vibration plate is attached to the upper surface of the second suspension and the vibration plate is attached to the upper surface of the second suspension and the outer periphery of the second suspension is fixed to the frame.

The present invention provides for a surface acoustic transducer optimally structured to produce sound within an aircraft cabin by vibrating the interior cabin walls. Specifically, the surface acoustic transducer comprises a primary assembly comprising a voice coil assembly having a voice coil former and wire, and a transducer housing for retaining said primary assembly and a magnet therein such in movable relations. The present surface acoustic transducer may further include a spider structured to provide an improved excursion. An external housing may additionally be provided comprising a rigid retaining wall for protecting the surface acoustic transducer from potential externally applied forces and a malleable excursion cover allowing for an excursion of the primary assembly thereof.

The invention aims to provide a woven / knitted fabric containing a conductive fiber preferably usable especially for a diagram for a speaker, and a diaphragm for a speaker and a speaker using the woven / knitted fabric. A woven / knitted fabric comprising a conductive fiber and a non-conductive fiber, wherein the woven / knitted fabric has a woven structure or a knitted structure of said non-conductive fiber and a continuous wiring forming a coil of the conductive fiber.

A speaker cabinet design for providing adjustability of the number of speaker cabinets contained in a speaker array comprises female connectors (50) along the front and back edges on the top and right sides. A user of the cabinet can attach a mating second cabinet to any side of the first cabinet by inserting male connector (40) in the pass through assembly and securing to the female connector at all locations on that side. A user can connect a second speaker cabinet in a series or parallel electrical connection. This allows the user to build up to the desired number of speakers without purchasing a full speaker array. Furthermore, once the desired array is complete the user can remove only the number needed for transport. A variety of different speakers can be preloaded in the cabinet at the factory, thus giving the user flexibility in sound without having to remove and install different speakers.

Disclosed are a silicon based condenser microphone and a packaging method for the silicon based condenser microphone. The silicon based condenser microphone comprises a metal case, and a board which is mounted with a MEMS microphone chip and an ASIC chip having an electric voltage pump and a buffer IC and is formed with a connecting pattern for bonding with the metal case, wherein the connecting pattern is welded to the metal case. The method for packaging a silicon based condenser microphone includes the steps of inputting a board which is mounted with a MEMS chip and an ASIC chip and is formed with a connecting pattern; inputting a metal case, aligning the metal case on the connecting pattern of the board, and welding an opened end of the metal case to the connecting pattern of the board. Thus, the metal case is welded to the board by the laser.

The disclosed embodiments relate to a technique for inductively charging an electronic device. This technique involves winding an audio cable for the electronic device around a charging mechanism multiple times so that one or more conductors in the audio cable form an inductive receiving coil. Next, a magnetic field is created through the charging mechanism to induce a current in the inductive receiving coil. Finally, the induced current in the inductive receiving coil is used to charge a rechargeable battery for the electronic device.

A frame has an interior side and an exterior side. The frame is configured to extend around the back of a user's head. A first membrane is coupled to at least a portion of the interior side of the frame. In one embodiment, a second membrane is coupled to the first membrane. The first membrane and the second membrane define a receptacle and an opening that communicates with the receptacle. In one embodiment, a speaker is disposed in the receptacle. A first electrical wire has a first end electrically coupled to the speaker and a second end including a connector. The connector can be disposed proximate to the opening of the receptacle. The connector is configured to be electrically coupled to a second electrical wire.

Provided is an acoustic sensor capable of improving an S / N ratio of a sensor without preventing reduction in size of the sensor. A back chamber 45 is vertically opened in a silicon substrate 42. A thin film-like diaphragm 43 to serve as a movable electrode plate is formed on the top surface of the substrate 42 so as to cover the back chamber 45. The back plate 48 is fixed to the top surface of the substrate 42 so as to cover the diaphragm 43, and a fixed electrode plate 49 is provided on the under surface of the back plate 48. Further, the diaphragm 43 is divided into a plurality of areas by the slit 47, and the respective plurally divided diaphragms 43a, 43b and the fixed electrode plate 49 constitute a plurality of parallelly connected capacitors (acoustic sensing sections 60a, 60b).

The invention discloses a method and device for supplying power for an ANC earphone by utilization of a power source of electronic equipment. According to the power supplying method, power is supplied for a noise cancellation circuit of the ANC earphone and circuits related to the noise cancellation circuit of the ANC earphone through a microphone pin and a left sound channel pin or a right sound channel pin, wherein the microphone pin, the left sound channel pin and the right sound channel pin are arranged in an earphone socket of the electronic equipment. The power supplying device comprises the ANC earphone and the electronic equipment, wherein the ANC earphone comprises a detection and control module A and a switch module A, the detection and control module A is connected with an earphone plug, and both the noise cancellation circuit and a hand free microphone circuit are connected with the earphone plug through the switch module A. The electronic equipment comprises a detection and control module B and a switch module B, the detection and control module B is connected with the earphone socket, and both an audio module and a power source module are connected with the earphone socket through the switch module B. The method and device for supplying the power for the ANC earphone by utilization of the power source of the electronic equipment can enable the ANC to directly fetching power from the power source of the electronic equipment, and enables the earphone to have the advantages of being simple in structure, convenient to carry and suitable for mass production, reducing production cost, and being high in compatibility.

A Microelectromechanical system (MEMS) assembly includes a cover, a substrate, at least one wall disposed and between and attached to the cover and the substrate, a MEMS device disposed at the cover and an integrated circuit disposed at the substrate. The integrated circuit and the MEMS device are disposed one over the other and electrically connected together at least in part by conduits that extend through the walls. Alternatively, the MEMS device may be disposed on the substrate and the integrated circuit disposed on the base.

Provided is a silicon condenser microphone using a case in which a plating layer is formed on a body formed of resin. The silicon condenser microphone includes: a case having a can-shaped resin body with one side open, and a plating layer formed on the body; and a substrate on which a micro electro mechanical system (MEMS) microphone chip and an application-specific integrated circuit (ASIC) chip for processing an electrical signal are mounted, a connection pattern for attaching the case is formed, and the case is attached to the connection pattern using a conductive adhesive. The case may be formed in a cylindrical shape or a rectangular box shape. The plating layer may be formed on an inner surface, an outer surface, or an entire surface of the body and a step may be formed along an inner periphery on an end portion of an opening surface of the body.

An earphone and its method of making are disclosed. The earphone comprises a first shell and a second shell joined thereto to form a housing. A sound pressure releasing path is defined in the housing. A loudspeaker is disposed in the housing. A strain relief collar is securely clasped between the first and second shells, and the strain relief collar has an inner molded body and an outer molded body. The inner molded body having a hardness, and the outer molded body has a hardness lesser than that of the inner molded body. A cord has an end connected to the loudspeaker, a portion encompassed by the strain relief collar and a portion extended out of the strain relief collar, wherein the sound pressure releasing path allows sound air waves to exit the earphone to the atmosphere when the loudspeaker imposes sound to the ear.

A wearable portable speaker system for mobile electronic devices having at least one speaker capable of connecting to a mobile electronic device and a fixture for housing the at least one speaker. The fixture is formed as a collar having an opening formed therein and the at least one speaker is housed in the fixture so that an output of the speakers is at least partially directed upwards from a top portion of the fixture.

A speaker system employs a first device and a second device where one of the first device and the second device is a speaker. The first device has a supporting surface, from which a positioning element protrudes and forms a distal end. The positioning element tapers from the supporting surface to a smaller dimension at the distal end. The second device has a cavity receiving the positioning element. In one embodiment, the first device has a first electrical contact positioned adjacent to the positioning element and the second device has a second electrical contact engaging the first electrical contact. In another embodiment, the first and second device are rotationally repositionable relative to one another, and an electrical connection is created between the first device and the second device when the cavity receives the positioning element at more than one relative rotational position between the first device and the second device.

A wearable malleable earphone case includes a main body having a front surface, back surface, bottom surface and a pair of opposing side surfaces forming a generally hollow interior space. A lid is hingedly secured along the top surface of the main body, and an elongated central post is positioned within the main body. A plurality of apertures function to receive a set of earphones and the central post secures the earphone cord within the device.

A microphone module is mounted on a mount portion of a circuit board incorporated in a portable electronic device, wherein it includes a housing having a hollow cavity and a sound hole for communicating the hollow cavity with the exterior, a microphone chip for detecting sound in the hollow cavity, a plurality of external connection terminals electrically connected to the microphone chip, and a plurality of extended portions that are horizontally extended from the housing in a direction perpendicular to the opening direction of the sound hole. The external connection terminals are formed on the surfaces of the extended portions; and the housing partially projects from the surfaces of the extended portions.

A condenser microphone and a method of mounting a condenser microphone on a main PCB are provided. The method includes assembling the condenser microphone by assembling elements of the condenser microphone such that a vibration plate including a diaphragm and a backplate is directed toward an opened surface of a casing of the condenser microphone. The casing has a closed bottom surface and an opened surface opposite to the closed bottom surface. A PCB includes a sound hole. The assembled condenser microphone is positioned on a main PCB such that the sound hole of the PCB is aligned in accordance with a through hole formed in the main PCB. According to the present invention, if necessary, the main PCB can be mounted such that its elements surface is directed toward an inside of an electronic product, thereby maintaining good sound quality due to a short delivery path of sound waves.

A Push-Pull-type electrostatic ultrasonic transducer includes a first electrode having a through hole, a second electrode having a through hole making a pair with the through hole of the first electrode, and a vibration film held between a pair of electrodes composed of the first and the second electrodes and having a conductive layer to which a direct-current bias voltage is applied, and holds the pair of electrodes and the vibration film. Assuming that λ is the wavelength of the carrier wave having a frequency shifted as a predetermined amount of frequency from the resonance frequency, which is the mechanical resonance frequency of the vibration film, the thickness t of each of the pair of electrodes is set to (λ / 4)·n or roughly (λ / 4)·n (where, λ is the wavelength of the ultrasonic wave, n is a positive odd number), and an alternating-current signal, which is a modulated wave obtained by modulating the carrier wave in the ultrasonic frequency band with a signal wave in an audible frequency band, is applied between the pair of electrodes.

An audio resonance vibrator includes a yoke defining a bottom and a sidewall extending vertically from the bottom, an elastic frame cooperatively with the yoke forming a housing defining a receiving space, a magnet disposed on the bottom of the yoke cooperatively with the sidewall of yoke forming a magnetic gap, a vibrating unit accommodated in the receiving space defining a vibrating plate and a coil assembly connected with the vibrating plate. The coil assembly is at least partially received in the magnetic gap, and the vibrating plate is positioned on the elastic frame. The audio resonance vibrator further includes an elastic member interposed between the magnet and the vibrating plate to support the magnet.