In one aspect, the present invention is a technique of, and a
system and sensor for measuring, inspecting, characterizing and / or evaluating optical lithographic equipment, methods, and / or materials used therewith, for example, photomasks. In one embodiment, the
system, sensor and technique measures, collects and / or detects an
aerial image produced or generated by the interaction between the
photomask and lithographic equipment. An
image sensor unit may measure, collect, sense and / or detect the
aerial image in situ—that is, the
aerial image at the
wafer plane produced, in part, by a product-type
photomask (i.e., a
wafer having integrated circuits formed during the
integrated circuit fabrication process) and / or by associated lithographic equipment used, or to be used, to manufacture of integrated circuits. In this way, the aerial image used, generated or produced to measure, inspect, characterize and / or evaluate the
photomask is the same aerial image used, generated or produced during
wafer exposure in
integrated circuit manufacturing. In another embodiment, the
system, sensor and technique characterizes and / or evaluates the performance of the optical lithographic equipment, for example, the optical sub-system of such equipment. In this regard, in one embodiment, an
image sensor unit measures, collects, senses and / or detects the aerial image produced or generated by the interaction between lithographic equipment and a photomask having a known, predetermined or fixed pattern (i.e., test
mask). In this way, the system, sensor and technique collects, senses and / or detects the aerial image produced or generated by the test
mask—lithographic equipment in order to inspect, evaluate and / or characterize the performance of the lithographic equipment.