The invention discloses a method for detecting the
process capability of inner and outer
layers of a circuit board. In the method, a testing plate is needed to be used, and a method for manufacturing the testing plate comprises the following steps of: preparing a
copper-free substrate and
copper foils with different thicknesses; integrating the prepared
copper foils with the copper-free substrate; pressing a circuit board, and
cutting the pressed circuit board; then drilling a plurality of tool holes by a
drill point; performing V-
CUT processing on the upper and lower surfaces in the middle of a short side of the circuit board on which the tool holes are drilled in a direction parallel to a long side of the circuit board, so that
etching can be carried out in partitions; when the
process capability of the inner and outer
layers of the circuit board is needed to be detected, forming a pattern on the testing plate in a diaphragm,
exposure, developing mode to perform the evaluation and check of the
process capability; and then dividing the plate into two blocks along a V-
CUT line for
etching, and grasping an
etching factor and the amount of lateral
erosion. By the method for detecting the process capability of the inner and outer
layers of the circuit board various wiring
modes, the process capability of the copper foils with the different thicknesses, the amount of the lateral
erosion and the etching factor of the wiring
modes and the like can be detected precisely and efficiently.