Method for detecting process capability of inner and outer layers of circuit board

Abstract

The invention discloses a method for detecting the process capability of inner and outer layers of a circuit board. In the method, a testing plate is needed to be used, and a method for manufacturing the testing plate comprises the following steps of: preparing a copper-free substrate and copper foils with different thicknesses; integrating the prepared copper foils with the copper-free substrate; pressing a circuit board, and cutting the pressed circuit board; then drilling a plurality of tool holes by a drill point; performing V-CUT processing on the upper and lower surfaces in the middle of a short side of the circuit board on which the tool holes are drilled in a direction parallel to a long side of the circuit board, so that etching can be carried out in partitions; when the process capability of the inner and outer layers of the circuit board is needed to be detected, forming a pattern on the testing plate in a diaphragm, exposure, developing mode to perform the evaluation and check of the process capability; and then dividing the plate into two blocks along a V-CUT line for etching, and grasping an etching factor and the amount of lateral erosion. By the method for detecting the process capability of the inner and outer layers of the circuit board various wiring modes, the process capability of the copper foils with the different thicknesses, the amount of the lateral erosion and the etching factor of the wiring modes and the like can be detected precisely and efficiently.

Description

technical field [0001] The invention relates to a detection method of a circuit board, in particular to a method for detecting the process capability of the inner and outer layers of the circuit board. Background technique [0002] At present, in the circuit board production industry, there has not been a standard tool and method to test the process capability of the inner and outer layers. Different circuit board manufacturers adopt different process test methods, and most of them are randomly looking for a few pieces of 1OZ Copper-clad substrate, several groups of dense lines are etched on the copper surface. Generally, the dense lines are designed as parallel lines, and the line width / spacing is 2 / 2, 2.5 / 2.5, 3 / 3, 3.5 / 3.5, 4 / 4, 5 / 5 five types, and then evaluate its circuit production capacity, and define it for reference by the design department. [0003] The existing technical solutions have the following deficiencies: (1) The types of wiring methods of the test lines ...

AI Technical Summary

Problems solved by technology

[0003] The existing technical solutions have the following deficiencies: (1) The types of wiring methods of the test lines are too single to fully reflect the process capabilities of common wiring methods; (2) The range of process capabilities for the same wiring methods is too narrow; (3) . Only the process capability of the circuit is tested, and the etching factor and side erosion amount of the circuit are not monitored; (4). One test board can only be used for one copper thickness test. If you want to test several common copper thicknesses , the repeated test action needs to be repeated many times, the speed is slow, and the cost of making the test board is high; (5), the standard and method of the process capability test are not defined, resulting in differences in the process capability of the same process due to human differences in the test board. Can faithfully reflect the actual process level