The invention discloses a
laser electrochemical compound micromachining method and device for a
semiconductor material, and belongs to the field of special
machining. The method comprises the steps that the
semiconductor material is heated with
laser beams through the characteristic that the electric
conductivity of the
semiconductor material such as
monocrystalline silicon is significantly increased along with increasing of the temperature, the electric conduction property of the material near a
machining area is locally enhanced, an electric
conduction channel that currents pass preferentially is formed, on this basis, electrolytic
machining is introduced in a bias electro-hydraulic beam mode,
laser electrochemical self-
coupling combined machining near the machining area is achieved, tool setting is not needed, therefore, it is guaranteed that no surface residue adhesion occurs in the laser
machining process, the
cooling effect can be strengthened, and the purposes of reducing heat damage and
residual stress and improving the machining surface quality are achieved. The device comprises a laser, an external light path, an electrolytic power supply and a stable
jet flow generatingdevice. The device can generate stable low-
voltage electrolytic solution
jet flow and achieve
impact angle and position adjustment, and it is guaranteed that precise adjustment of the relative positions between the
laser beams and the
impact jet flow is achieved.