The present invention relates to a
hybrid adhesive, in particular for use in the production of
engineered wood such as particle boards,
fiber boards, plywood or glued-laminated timber, comprising at least one polycondensation
adhesive, at least one polyaddition
adhesive, and at least one particle, in particular a
nanoparticle smaller than 500 nm, wherein the at least one particle is modified with at least one compound of the general formula (I) RaSiX(4-a) (I), or the general formula (II) ObXc(OH)dReSiO(4-b-c-d-e) / 2 (II), where - X is H, OH or a hydrolyzable group selected from the group consisting of
halogen, alkoxy, carboxy, amino, monoalkylamino or dialkylamino, aryloxy, acyloxy, alkylcarbonyl, - R is a non-hydrolyzable
organic group R selected from the group consisting of substituted and non-substituted
alkyl, substituted and non-substituted
aryl, substituted and non-substituted alkenyl, substituted and non-substituted alkinyl, substituted and non-substituted cycloalkyl, which can be interrupted by -O- or -NH-, and where R comprises at least one functional group Q selected from a group consisting of an
epoxy, hydroxy,
ether, amino, monoalkylamino, dialkylamino, substituted and non-substituted anilino,
amide, carboxy, alkinyl, acryl, acryloxy, methacryl, methacryloxy, mercapto, cyano, alkoxy, isocyanato,
aldehyde, alkylcarbonyl,
acid anhydride and / or
phosphoric acid group, - R and X can be identical or different from each other, and - a = 1, 2, 3, in particular 1, - b, c, d = 0 or 1, and - e = 1, 2, 3. The present invention also relates to the use of the adhesive in
engineered wood boards and to methods for the production thereof.