33 results about "Enthalpy of fusion" patented technology

Care and / or make-up cosmetic composition comprising: a liquid continuous fatty Phase structured with at least one structuring polymer (homopolymer or copolymer) having a weight-average molecular mass ranging from 500 to 500 000, containing at least one moiety comprising: at least one polyorganosiloxane group consisting of 1 to 1 000 organosiloxane units in the chain of the moiety or in the form of a graft, and at least two groups capable of establishing hydrogen interactions, Chosen from ester, amide, sulphonamide, carbamate, thiocarbamate, urea, urethane, thiourea, oxamido, guanidino and biguanidino groups, and combinations thereof, the polymer being solid at room temperature and soluble in the liquid fatty Phase at a temperature of 25 to 250° C., the Said liquid fatty Phase comprising at least one compound capable of reducing the enthalpy of fusion of the structuring polymer, and then the liquid fatty Phase, the structuring polymer and the compound capable of reducing the enthalpy of fusion of the structuring polymer forming a physiologically acceptable medium.

Polyamide blend molding compound, includes a polyamide blend content and at least one impact-resistant component, characterized in that the polyamide blend content includes the following polyamides: (A) 20 to 65% by weight of at least one semi-crystalline polyamide with an enthalpy of fusion >40 J / g and with an average of at least 8 C atoms per monomeric unit; (B) 8 to 25% by weight of at least one amorphous and / or microcrystalline polyamide, with the microcrystalline polyamide having an enthalpy of fusion in the range of 4 to 40 J / g, and (C) 1 to 20% by weight of at least one polyamide with an average of a maximum of 6 C atoms per monomeric unit. The impact-resistant component includes as follows: (D) 10 to 40% by weight of a polyamide elastomer which is composed of hard segments and soft segments, with the hard segments being based on lactams and / or amino-carboxylic acids, and (E) 0 to 35% by weight of a non-polyamide elastomer.

A hot melt adhesive for use on porous substrates, wherein the hot melt adhesive hasabout 10% to about 70% by weight of a polypropylene homopolymer having a DSC melting point of less than 100° C.;about 10% to about 60% of a first tackifying resin having a Ring & Ball Softening Point ofabout 95° C. to about 140° C.;about 0% to about 65% of a second tackifying resin that is different than the first tackifying resin;about 5% to about 50% of a plasticizer;about 1% to about 40% by weight of a secondary polymer which is either a semi crystalline polymer or wax with an enthalpy of fusion of greater than 30 Joules / gram;about 0.1% to about 5% of a stabilizer or antioxidant; wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 centipoise (cP) at 163° C. (325° F.).

The present invention relates to a polymer composition for the production of shaped objects via selective laser sintering, wherein the polymer composition comprises a thermoplastic material having: -≥30s and ≤12min below the peak melting temperature The semi-crystallization time when supercooled at 50°C, wherein the semi-crystallization time t 1 / 2,c Glass transition temperature T measured by differential scanning calorimetry according to ISO 11357‑1 (2009); -≥50°C g , determined according to ISO 11357‑2(2013); -≥200℃ peak melting temperature T p,m , according to ISO 11357‑3 (2011), measured in the first heating run; - at the extrapolated first cooling run crystallization end temperature T ef,c Above the extrapolated first heating run melting onset temperature T ≥ 5°C ei,m , determined according to ISO 11357-1 (2009), first heating and cooling operation; and- a degree of crystallinity ≥ 10.0% determined according to formula (I), where - D = crystallinity (%) of the thermoplastic material ;‑ΔH f = enthalpy of fusion of the thermoplastic material, determined according to ISO 11357-3 (2011); -ΔH f,100 = enthalpy of fusion of the thermoplastic material in the 100% crystalline state. Such polymer compositions have continuous use temperatures > 100°C and low molecular weight changes during exposure to selective laser sintering processing temperatures.

Provided is a resin composition from which a heat dissipation sheet having high effect to suppress temperature elevation due to heat generated by electronic parts (elements) can be obtained. Specifically provided is a resin composition containing: a polymer (1) whose enthalpy of fusion observed within a temperature range of 10° C. or higher and lower than 60° C. in differential scanning calorimetry is 30 J / g or more; and a thermally conductive material (3) whose thermal conductivity is 1 W / (m·K) or higher, wherein the content of the thermally conductive material (3) is 1 part by weight or more and 80 parts by weight or less, with respect to 100 parts by weight of the total amount of polymer components contained in the resin composition.