The invention relates to a single-substrate multi-
chipset high-power LED (Light-Emitting
Diode) encapsulation one-step bonding method, belonging to the technical field of multi-
chipset high-power LED encapsulation. The invention solves the problem that the whole bonding time is too long as multiple chipsets are sequentially spliced in the traditional multi-
chipset high-power LED encapsulation technology. The method comprises the following steps of: cleaning a substrate, a
chip carrying platform, a multi-
chip suction
nozzle and a supporting platform; placing the substrate on the supporting platform; determining positions of chips to be bonded on the front of the substrate, and placing multiple chips to be bonded on the
chip carrying platform corresponding to the positions of the chips to be bonded; uniformly
coating soldering paste on the positions of the chips to be bonded by adopting
screen printing, and then simultaneously picking up multiple chips to be bonded with the multi-chip suction
nozzle; heating the back of the substrate, enabling multiple chips to align with the positions to be bonded and then attached to the
soldering paste, continuously heating for 5-10s, naturally cooling to
room temperature, and removing the multi-chip suction
nozzle, thus the
bonding process is completed. The invention provides an encapsulation bonding method.