31results about How to "Satisfactory shape" patented technology

A die set for press-forming a blank of thin metallic sheet. The die set has a punch and a blank holder. The blank holder has a first bead for restraining an edge of the blank with a constant force. The first bead is disposed further to an inside than a second bead for restraining the edge of the blank with a force that varies during pressing of the blank.

In a developing processing of a wafer having a resist film low in the dissolving rate in a developing solution formed thereon and subjected to an exposure treatment, a developing solution of a low concentration is supplied first onto a wafer and the wafer is left to stand for a prescribed time to permit a developing reaction to proceed, followed by further supplying a developing solution having a concentration higher than that of the developing solution supplied first onto the wafer, leaving the substrate to stand and subsequently rinsing the wafer, thereby improving the uniformity of the line width in the central portion and the peripheral portion of the wafer.

The positive tone photosensitive composition of the invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound producing an acid by light, a thermal crosslinking agent and an acrylic resin. It is possible to provide a positive tone photosensitive composition that can be developed with an aqueous alkali solution, has sufficiently high sensitivity and resolution, and can form a resist pattern with excellent adhesiveness and thermal shock resistance.

A photosensitive resin composition comprising: (A) a binder polymer having a divalent group represented by formula (I), (II) and (III); (B) a photopolymerizing compound; and (C) a photopolymerization initiator.[In formulas (I), (II) and (III), R1, R2, R4 each independently represents a hydrogen atom or a methyl group, R3 is C1-C3 alkyl group, etc., m is an integer of 0-5, R5, R6 and R7 each independently represents a hydrogen atom or a C1-C5 alkyl group, and at least two among R5, R6 and R7 are C1-C5 alkyl groups.]

The system and methods of the present invention are directed to an optical pickup. The optical includes at least a light source, a lens for focusing and irradiating light from the light source on a recording medium, and an optical pickup element. The optical pickup element includes a lens base plate in which a lens made of a material having a high refractive index is embedded within a transparent base plate to pass incident light. The optical element further includes an aberration correction base plate formed of a transparent parallel flat plate-like base plate to pass light and correcting a comatic aberration produced on the lens. The lens base plate and the aberration correction base plate are integrated such that the lens base plate and the aberration correction base plate are parallel to each other. Moreover, the aberration correction base plate is located on the side of a point at which incident light is focused by the lens.. The optical element can reduce the diameter of the lens, increase the radius of curvature of the lens, and correct a comatic aberration produced when an optical axis of incident light is inclined relative to the lens.

A lens pad includes a blank, first adhesive layer, and release sheet. The first adhesive layer is formed on one surface of the blank. The release sheet comes into tight contact with the surface of the first adhesive layer to protect this surface. The arithmetic average roughness of the surface of the release sheet on the side of the first adhesive layer is 0.1 μm or less. The surface of the first adhesive layer from which the release sheet is peeled off is attached onto a lens as an edging target. A lens pad, a lens pad manufacturing method, a lens manufacturing method, and an adhesive member are also disclosed.

A light amount adjusting device includes an opening forming member configured to form an opening portion through which light passes, a blade group configured to move on the opening forming member and form a part of a light passing opening in the opening portion, and a power transmission member arranged outside the opening portion and engaging with the blade group to transmit power. The blade group includes a straight blade configured to move linearly and a swing blade configured to swing from both sides in a straight-ahead operation of the straight blade toward a center of the light passing opening. An edge portion of the light passing opening on a side of the power transmission member or an edge portion on a side opposite to the side of the power transmission member is formed by the blade group.

A subject for the invention is to provide a process for ceramic bead production in which ceramic beads with smooth surfaces are obtained by a simpler method without using a complicated process involving, for example, a DC plasma / radio-frequency plasma combination or a two-stage radio-frequency plasma. Another subject is to provide such ceramic beads. The invention relates to a technique in which a preheated raw ceramic material is introduced into a laminar-flow thermal plasma obtained using a high-voltage type direct-current (DC) plasma gun and is cooled and solidified and the resultant ceramic beads are collected. It is preferred that the raw ceramic material should be preheated by passing the raw material through a refractory tube which runs through a furnace, while sending the raw ceramic material with a carrier gas, and that the preheated raw-material powder should be introduced into and treated with the thermal plasma under such conditions that the resultant ceramic beads are discharged from the thermal plasma at a discharge angle of 60° or larger with the thermal plasma. Thus, satisfactory ceramic beads which have smooth surfaces and have few crack defects and few internal void defects are obtained.

A three-dimensional shape processing method processes a workpiece into a predetermined three-dimensional shape by cutting work and additive manufacturing. The method includes forming a target surface for the additive manufacturing to be larger than a shape dimension of the three-dimensional shape, performing the additive manufacturing on the target surface that has been largely formed, and performing the cutting work on a region where the additive manufacturing has been performed to complete the three-dimensional shape.

A resin-encapsulated semiconductor device includes a semiconductor element mounted on a die pad portion, a plurality of lead portions arranged so that leading end portions thereof are opposed to the die pad portion, and thin metal wires connecting electrodes of the semiconductor element to the lead portions. An encapsulation resin encapsulates the die pad portion, semiconductor element and lead portions in such a manner that a bottom surface part of the die pad portion and a lead bottom surface part, lead outer surface part, and lead upper end part of the lead portions are exposed from the encapsulation resin. A plating layer is formed on the lead bottom surface parts and the lead upper end parts. The encapsulation resin has cutouts on a side surface thereof vertically above the portions of the lead upper end parts on which the plating layer is formed.