99results about How to "Satisfactory accuracy" patented technology

A coil component includes a core formed by a magnetic material, a coil embedded in the core, a part of a terminal portion of the coil protruded from a side surface of the core, and a tabular terminal, a part thereof protruded from the side surface of the core and partly connected with the protruded part of the terminal portion of the coil. The protruded part of the terminal portion of the coil and the protruded part of the tabular terminal are respectively bent toward the bottom surface side of the core along the side surface of the core, and the protruded and bent part of the terminal portion of the coil is arranged between the protruded and bent part of the tabular terminal and the core.

An apparatus for providing an estimate for a 3D camera pose relative to a scene from 2D image data of 2D image frame provided by said camera. A candidate 2D key points detector determines candidate 2D key points from the 2D image frame. A detected 3D observations detector determines detected 3D observations from pre-recorded scene data and the candidate 2D key points. A detected 3D camera pose estimator determines a detected 3D camera pose estimate from the camera data, the detected 3D observations and the candidate 2D key points. A first storage stores the detected 2D candidate key points and the 2D image data, and outputs in response to a 3D camera pose estimate output previous 2D image data and candidate 2D key points related to a previous 3D camera pose estimate output. A second storage stores and outputs a previous 3D camera pose estimate. A tracked 3D observations detector determines tracked 3D observations from the 2D image data, the candidate 2D key points, the camera data, the previous 2D image data and candidate 2D key points, the previous 3D camera pose estimate and 3D scene model data. A pose estimate selector outputs a selected one of the detected camera pose estimate and the previous 3D camera pose estimate. A 3D camera pose estimator computes and outputs the 3D camera pose estimate from the camera data, the detected 3D observations, the tracked 3D observations and the selected 3D camera pose estimate.

This invention aims to create a three-dimensional model of satisfactory accuracy even when adopting a method of performing three-dimensional measurement by arbitrarily changing a positional relationship between an actual model and a camera, and aligning and integrating three-dimensional information restored by each measurement. A polygonal mark M having a shape in which a direction can be uniquely specified is attached to a predetermined area of an actual model WM of a work to be three-dimensionally recognized. A process of changing the orientation of the actual model WM such that a state in which the mark M is contained in the view of each camera is maintained, and then performing the three-dimensional measurement is executed over a plurality of times. A predetermined number of, or two or more pieces of three-dimensional information is selected from the three-dimensional information restored by each measurement, these pieces of three-dimensional information are aligned and integrated, the information corresponding to the mark is deleted or invalidated from the integrated three-dimensional information, and the three-dimensional information after such a process is set as a three-dimensional model.

A plurality of semiconductor chips (14) each having a first main surface (14b) formed with electrode pads (21) and a second main surface (14c) opposite to the first main surface are respectively mounted on a chip mounting surface (12a) larger in area than the second main surface, of a wafer-shaped mounting substrate (12) at equal intervals so as to extend along first and second trenches (18a, 18b) defined in the chip mounting surface with these trenches as target lines. Thereafter, solder balls (25) electrically connected to the electrode pads of the semiconductor chips are disposed on their corresponding wiring patterns 34 that extend from above first regions (100) located above the semiconductor chips, of a surface region of an encapsulating layer (32) covering the semiconductor chips to above second regions (200) that surround the first regions. Afterwards, the encapsulating layer and the mounting substrate are cut and thereby fractionized into semiconductor devices each having a fan-out structure.

A shower head structure disposed in a device 2 for processing a semiconductor while supplying processing gas to a processing space S for storing a heated processed substrate W, comprising a shower head 12 having a plurality of gas injection holes 20B for supplying the processing gas and a light introducing rod 68 of a radiation thermometer 66 inserted into at least one of the gas injection holes 20B.

A method includes performing first and second measurements with a turbid medium to be examined placed in a receiving volume of a device for examining the interior of turbid media. The second measurement is performed after a time interval has passed after the first measurement. Each of the first and second measurements includes subsequently irradiating the turbid medium with light from a light source from a plurality of different source positions and detecting light emanating from the turbid medium in a plurality of different detection positions for each source position, and storing the detected values as measurement results. The method also includes detecting inhomogeneities in the interior of the turbid medium by using the measurement results of one of the first and second measurements as a reference and the measurement results of the respective other of the first and second measurements to determine deviations from the reference.

A control device and measurement system for a living body applies lights of at least one wavelength in a visible-infrared region to a plurality of incident positions on a surface of the living body, and a light detector detects lights transmitted through the living body at a plurality of detection positions on the surface of the living body. An operation unit determines a type of output signal, based on an intensity of the transmitted light and pre-stored reference data, and outputs a signal indicative thereof as the type of output signal. An external equipment executes a functional operation according to the type of output signal from the operation unit. The incident positions and the detection positions are alternately disposed in square lattice form and middle points between the incident positions and detection positions adjacent to one another are defined as measurement positions.