81results about How to "Reduce signal transmission loss" patented technology

Provided is a printed wiring board formed with a through-hole into which a press-fit pin is press-fitted. The printed wiring board includes at least one signal transmission layer, a signal transmission wiring pattern formed in the signal transmission layer, and an electrode portion of the signal transmission wiring pattern exposed at an inner circumferential surface of the through-hole. The electrode portion is not formed covering the entire inner circumferential surface of the through-hole but at a part of the inner circumferential surface of the through-hole.

A semiconductor device integrated with optoelectronic components includes a carrier board with at least two openings; a first and a second optoelectronic component disposed in the openings respectively, each of them having an active surface and an opposite non-active surface, wherein the active surface has a plurality of electrode pads and an optical active area; a dielectric layer formed on a surface of the carrier board and the active surfaces, and having a plurality of vias and openings to expose the electrode pads and the optical active areas respectively; and a circuit layer formed on a surface of the dielectric layer and electrically connected to the electrode pads directly. Then, at least one waveguide is formed on the surface of the semiconductor device integrated with the optoelectronic component to provide signal transmitting between the first and second optoelectronic components, therefore, shortens the signal transmission path, reduces the transmission loss and noise, and hence improves the signal transmission quality.

A circuit board structure with optoelectronic component embedded therein comprises a carrier board with at least two through openings; a first optoelectronic component and a second optoelectronic component disposed in the openings respectively, wherein a plurality of electrode pads and optical active areas are formed on the active surfaces of the optoelectronic components; a dielectric layer formed on a surface of the carrier board and the active surface of the optoelectronic components, wherein a plurality of vias for exposing the electrode pads and two holes for exposing the optical active areas are formed in the dielectric layer; a circuit layer formed on a surface of the dielectric layer and electrically connected to the electrode pads of the optoelectronic components; an insulating protecting layer formed on the dielectric layer and the circuit layer; and at least one optical transmission element formed on a surface of the insulating protecting layer.

To improve the transmission efficiency of a necessary transmission mode by providing an unnecessary-wave suppression groove that prevents an unnecessary transmission mode from being excited at a mode conversion part between a rectangular waveguide and a circular waveguide. A rectangular waveguide 2 is connected to a circular waveguide 4 at right angles, and an unnecessary-wave suppression groove 5 that extends along tube walls 2B, 2C, and 2D of the rectangular waveguide 2 and a tube wall 4A of the circular waveguide 4 is provided at a mode conversion part between the rectangular waveguide 2 and the circular waveguide 4. Thus, the unnecessary-wave suppression groove 5 can prevent an unnecessary TE 11 mode from being excited in the circular waveguide 4 due to electromagnetic waves of the TE 10 mode that transmit through the rectangular waveguide 2, thereby reducing conversion loss due to the TE 11 mode. Accordingly, electromagnetic waves of the TM 01 mode can be efficiently excited in the circular waveguide 4, and signals can be stably transmitted between the waveguides 2 and 4.

The invention discloses a printed circuit board and a manufacturing method thereof. The printed circuit board comprises a medium substrate and a transmission line, wherein the medium substrate is made of a prepreg with thickness larger than a set value, the transmission line is formed on the prepreg, a windowed solder mask is formed on the medium substrate at the position of the transmission line. By utilizing the technical scheme, the signal transmission loss can be reduced, the board cost can be reduced, the manufacturing process can be simplified and the production cost is lowered further.

A ceiling-mount omnidirectional antenna for indoor distribution system of mobile communication network and a method for manufacturing the same are provided. The antenna includes: a monopole consisting of a cone part and a columnar part; a reflecting plate consisting of a cone part and a platform part; and a feed connector. The monopole and the reflecting plate are arranged in such that the tips of cone parts are opposite to each other. The signal is fed into the antenna through the feed connector and radiated outward by the monopole and the reflecting plate. In high frequency band, the maximal gain appears at about 70°, so that the signal power focuses at radiating angles of 60°˜85°. Comparing to the existing antenna, the gain of the antenna increases 4.22 dB at a radiating angle of 85° and decreases 10 dB at a radiating angle of 30°. So, the maximal permissible value of antenna aperture power of mobile communication signal in high frequency band, such as 3G, is increased; and the field strength of signal covering the edge is increased. The antenna can increase the covering range of a single antenna, increase the signal quality, and cover 2G and 3G networks in the same time so as to reduce the difficulty and the cost for building and reconstructing an indoor distribution system in 3G.

Disclosed herein are a printed circuit board having a copper plated layer with an anchor shaped surface and roughness by forming the copper plated layer having an anisotropic crystalline orientation structure using a plating inhibitor at the time of forming the copper plated layer serving as a circuit wiring and using composite gas plasma and a dilute acid solution, and a method of manufacturing the same.

The invention relates to an acousto-optic adjustable light filter with broadband, which comprises an acousto-optic medium, wherein the acousto-optic medium is installed on a base; at least two transducers are installed on the surface of the acousto-optic medium; the surface of each transducer is plated with a surface electrode; each surface electrode is respectively connected with a matching network; the matching network is connected with a high-frequency socket; all the transducers are installed on the same surface of the acousto-optic medium through a linking layer; and the thicknesses of the transducers with each surface electrode are different. Because the two transducers are installed on the same side of the acousto-optic medium, the problem that the clamp is easy to damage the transducer which is installed in the front when the transducers are installed on the two surfaces of the traditional acousto-optic medium, thereby enhancing the finished product rate of products; and the transducers with different thicknesses drive the radio frequency signals with different frequencies, thereby obtaining the diffraction light with different wavelengths.

A circuit board structure with optoelectronic component embedded therein comprises a carrier board with at least two through openings; a first optoelectronic component and a second optoelectronic component disposed in the openings respectively, wherein a plurality of electrode pads and optical active areas are formed on the active surfaces of the optoelectronic components; a dielectric layer formed on a surface of the carrier board and the active surface of the optoelectronic components, wherein a plurality of vias for exposing the electrode pads and two holes for exposing the optical active areas are formed in the dielectric layer; a circuit layer formed on a surface of the dielectric layer and electrically connected to the electrode pads of the optoelectronic components; an insulating protecting layer formed on the dielectric layer and the circuit layer; and at least one optical transmission element formed on a surface of the insulating protecting layer.

A circuit board is provided in which a transmission loss is reduced. The circuit board includes a first layer; a transmission line disposed on the first layer; and a second layer stacked with the first layer. The second layer includes a first region, which is constructed of a first material, corresponding to a position of the transmission line, and a second region, which is constructed of a second material having a permittivity that is different from that of the first material, corresponding to the position of the transmission line.

The invention relates to a flexible circuit board, which comprises a base material layer, a conductive circuit layer, a film and a second base material layer, wherein the first base material layer and the second base material layer are located at two opposite sides of the conductive circuit layer; the second base material layer is bonded with the conductive circuit layer through the film; the conductive circuit layer comprises at least one linear signal line, at least two ground lines and at least two hollow areas; the ground lines and the linear signal lines are alternately arranged; each hollow area is located between one linear signal line and one ground line; a first opening corresponding to the linear signal lines and the hollow areas at two sides thereof is formed in the film; and the first opening communicates with the hollow areas to form an air barrier layer surrounding the linear signal lines. The invention further relates to a manufacturing method of the flexible circuit board.

A high-frequency-signal switching circuit includes a first high-frequency-signal path which includes first and second diodes connected in series with a high-frequency amplifier stage therebetween, and a second high-frequency-signal path formed of a third diode connected in parallel to the first high-frequency-signal path. A switching-voltage supply section switches the high-frequency amplifier stage and first and second diodes ON, and the third diode OFF, so that a high-frequency signal is transferred through the first high-frequency-signal path, or switches the high-frequency amplifier stage and first and second diodes OFF and the third diode ON, so that a high-frequency signal is transferred through the second high-frequency-signal path.

An antenna device includes an antenna element including a dielectric substrate including a first principal surface and a second principal surface, a built-in feed line provided on the first principal surface of the dielectric substrate, and a radiating element provided on the second principal surface of the dielectric substrate and along the built-in feed line so that the radiating element is fed from the built-in feed line, a triplate line including a first outer conductor and a second outer conductor parallel to each other, and a central conductor arranged therebetween to feed excitation power to the antenna element, a connecting member which electrically connects the central conductor and the built-in feed line, a projecting piece from one end of the dielectric substrate toward the second outer conductor, and a first hole and a second hole provided in the first outer conductor and in communication with each other. The first hole includes a first opposite surface to the connecting member with a specified space therebetween. The projecting piece is inserted in the second hole. The second hole includes an opposite regulating surface to the first principal surface of the projecting piece of the dielectric substrate, to regulate movement of the dielectric substrate toward the first opposite surface.

A semiconductor device integrated with opto-electric component and method for fabricating the same provides a wafer with a plurality of optical transmitter / receiver components, and each of the optical transmitter / receiver components having an active surface and an opposite non-active surface, wherein a plurality of connecting pads and an optical active area are formed on the active surface; a dielectric layer and a circuit layer formed on the active surface, wherein the circuit layer is electrically connected to the connecting pads through electrical conductive structures formed in the dielectric layer; and an opening formed through the dielectric layer to expose the optical active area on the active surface; then an insulating layer is further formed on the circuit layer. By performing a routing process on the wafer to form a plurality of integrated devices with the optical transmitter / receiver components and circuit structures to fulfill the small and lightweight requirements of the electronic device.

The invention discloses a manufacturing method of a high-frequency copper-silver mixed conducting circuit structure. The manufacturing method comprises the steps of: providing an insulating substrate, and evaporating a silver layer on one surface of the insulating substrate; manufacturing and forming copper conductive circuit patterns on the surface of the silver layer; etching to remove the silver layer on the surface of the insulating substrate and between the copper conductive circuit patterns; and forming silver coating layers on the surfaces of the copper conductive circuit patterns, so that the copper conductive circuit patterns are coated by the silver coating layers. The invention further relates to the high-frequency copper-silver mixed conducting circuit structure manufactured by adopting the manufacturing method.

A ceiling-mount omni-directional antenna for indoor distribution system of mobile communication network and a method for manufacturing the same are provided. The antenna includes: a monopole consisting of a cone part and a columnar part, and a reflecting plate consisting of a cone part and a platform part, and a feed connector. The monopole and the reflecting plate are arranged in such that the tips of cone parts are opposite to each other. The signal is fed into the antenna through the feed connector and radiated outward by the monopole and the reflecting plate. In high frequency band, the maximal gain appears at about 70°, so that the signal power focuses at radiating angles of 60°-85°. The gain of the antenna increases 4.22 dB at a radiating angle of 85° and decreases IOdB at a radiating angle of 30°.

The invention discloses a device internally including a plurality of isolated temperature control detection units. The device comprises a plurality of isolated temperature control detection units, a feedback signal selecting device, an output voltage control device, and a voltage adjuster. The isolated temperature control detection units are arranged at a plurality of positions, so as to conduct the temperature monitoring detection and integrate the monitored and detected temperature data with a signal, thereby enabling the signals of the isolated temperature control detection units, such as (T1) and (T2)...(TN), to be converted into output signals containing temperature information, such as (F1) and (F2)... (FN); the feedback signal selecting device is used for receiving the signals, (F1) and (F2)...(FN), which are output by the isolated temperature control detection units, and choosing a signal with the maximum temperature from the signals, such as (F1) and (F2)... (FN), to be output; the output voltage control device is used for receiving the signal with maximum temperature output by the signal selecting device and a voltage feedback signal, and outputting a control signal; and the voltage adjuster is used for receiving the control signal output by the output voltage control device and outputting a voltage used for controlling the speed of the fan.

A tri-band multiwell radome includes a dense polymeric strike plate that is configured on the outside of the radome, a capture layer and a tuning layer. The polymeric strike plate is a tough polymer, such as a polycarbonate and breaks a bullet into fragments that are more easily captured by the capture layer. The capture layer includes a number of fabric sheets of highly oriented fibers, such as polyethylene fibers, and a binder. The tuning layer may be a low density foam that is configured inside of the capture layer and provided to reduce reflective losses and improve ballistic performance. A tri-band radome cover may have a dB loss over a wavelength of 8 to 40 kHz of no more than 1 dB. A tri-band radome cover may be formed in a dome shape.

A transmission device for a near field communication (NFC) device includes a matching circuit, a connecting interface with a first width for connecting an operating circuit of the NFC device, a first transmission line electrically connected between an antenna of the NFC device and the matching circuit, and a second transmission line electrically connected between connecting interface and the matching circuit, including an increasing width portion and a constant width portion, wherein a width of the second transmission increases from the first width to a second width within the increasing width portion and keeps the second width within the constant width portion, wherein the second width is greater than and related to the first width.

The invention relates to a cantilever part, a head gimbal assembly and a disc driving unit. The invention discloses the cantilever part which comprises a flexible member and a plurality of flexible circuits, wherein the flexible member is provided with a front part and a tail part opposite to the front part; the flexible circuits are formed on the flexible member and extend to the tail part of the flexible member from the front part of the flexible member; each flexible circuit is provided with a multilayer structure; each multilayer structure comprises a lower circuit layer, an upper circuit layer and an insulating layer sandwiched between the lower circuit layer and the upper circuit layer; both each lower circuit layer and each upper circuit layer comprise at least one positive writing circuit and at least one negative writing circuit which are arranged in a staggered way; and each positive writing circuit of each upper circuit layer is over against each negative writing circuit of the corresponding lower circuit layer. In the invention, stronger capacitive coupling can be generated between the positive and negative writing circuits of the upper circuit layers and the lower circuit layers and an electric field is uniformly distributed, so that the signal transmission loss is reduced, and thus, the impedance is reduced and the bandwidth of a frequency is improved.

The invention discloses a CMOS three-port amplifier applied to a TR assembly. The CMOS three-port amplifier comprises a driving amplifier and a low noise amplifier, the output end of the driving amplifier is directly connected with the input end of the low noise amplifier, during forward working, an input signal is connected with the input end of the driving amplifier and output by a common port,and during backward working, the input signal is connected with the common port and output by the output end of the low noise amplifier. The CMOS three-port amplifier has the advantages that receive-send switching is achieved without an additional receive-send switch, and impedance matching of the common port is achieved.

Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board including an adhesive promoter interposed between an insulating layer and a circuit layer on a substrate in order to improve adhesion therebetween; and a first metal layer formed between the adhesive promoter and the circuit layer has high adhesion between an insulating layer such as a resin and a circuit while having low roughness by including a polymer adhesive promoter, easily forms a fine circuit and has low signal transmission loss due to low roughness, and has high reliability due to the high adhesion.

The invention relates to a CMOS (Complementary Metal-Oxide-Semiconductor Transistor) contact type fluorescent homogeneous assay array sensing chip which comprises a chip body, wherein the chip body comprises a silicon gel substrate, an SU-8 thick adhesive, a signal processing circuit, a photoelectric sensing array, an active preprocessing amplifying array and an asynchronous time sequence control circuit; the SU-8 thick adhesive is fixed on the upper surface of the silicon substrate, at least one florescent reaction pool group is arranged on the SU-8 thick adhesive, each florescent reaction pool group comprises at least one micro-reaction pool, and the signal processing circuit, the photoelectric sensing array, the active preprocessing amplifying array and the asynchronous time sequence control circuit are correspondingly laid on the silicon gel substrate positioned just below the florescent reaction pool group; the signal output end of the signal processing circuit is connected with a pressure welding block. The CMOS contact type fluorescent homogeneous assay array sensing chip has the beneficial effects that a photoelectric PN junction diode is capable of converting fluorescent into a photoelectric current; the photoelectric PN junction diode is integrated with the active signal processing circuit monolithically, thus the signal transmission loss is reduced, and the detection microminiaturization is realized; the micro-reaction pool is capable of detecting one sample or simultaneously detecting a plurality of samples.

The invention relates to a rigid-flex board and a manufacturing method thereof, the rigid-flex board comprises a first flexible core board, a second flexible core board, a first circuit board and a second circuit board. One side surface of the first circuit board and one side surface of the second circuit board are connected with the first flexible core board, the other side surface of the first circuit board and the other side surface of the second circuit board are connected with the second flexible core board. In the rigid-flex board, regions, corresponding to an interval between the firstcircuit board and the second circuit board, on the first flexible core board and the second flexible core board are the regions which can be bent, thus, a bending function of the rigid-flex board is realized. Moreover, the first flexible core board and the second flexible core board have enough signal transmission lines for conducting electronic elements on the first circuit board and the second circuit board. Moreover, transmission signals of an external device are directly transmitted to the first flexible core board and the second flexible core board at an external surface, thus, the transmission signals are free from producing loss while passing through via holes.

A flexible circuit board comprises a substrate layer, a first conducting circuit layer, a second conducting circuit layer, a plurality of conducting holes, a sensitive film and an anti-electromagnetic interference layer. The first conducting circuit layer and the second conducting circuit layer are formed on opposite sides of the substrate layer respectively. The plurality of conducting holes are electrically connected with the first conducting circuit layer and the second conducting circuit layer. The sensitive film is formed on the surface of the first conducting circuit layer. The anti-electromagnetic interference layer is formed on the surface of the sensitive film. The first conducting circuit layer includes at least one linear signal line, the sensitive film is provided with at least one opening, and the linear signal line is located in the opening.

The invention belongs to the technical field of printed circuit boards and discloses a printed circuit board blind hole manufacturing method. The method comprises the steps of forming a blind hole in a printed circuit board manufactured on an inner line, manufacturing an organic film on the surface of the printed circuit board, forming a connection hole in the organic film on the bottom of the blind hole to enable the inner copper line to be exposed, conducting electroless copper plating on the printed circuit board to form an electroless copper plating layer, conducting electroplating on the electroless copper plating layer to form a porefilling metal electrode and an outer line, and etching the part, not electroplated, of the electroless copper plating layer and arranging an insulating material on the outer line in a press fit mode. According to the method, the surface smoothness of the copper line is improved by making the surface of the copper line coated with the organic film material.

The invention discloses a PCB manufacturing method, which relates to a manufacturing technology of a printed circuit board. The manufacturing method comprises the following steps of: manufacturing aninner layer circuit pattern on a daughter board, pasting a film material on the inner layer circuit pattern, superposing the daughter board with prepregs and other daughter boards, and pressing the daughter board, prepregs and other daughter boards into a multilayer board, forming a slotted hole in the multi-layer board to enable at least one part of the film material laminated on the inner layerto be exposed, and soaking the multilayer board in a liquid medicine, and removing the film material. According to the PCB manufacturing method disclosed in the invention, one surface of the inner layer circuit pattern of the PCB is coated with the dissoluble film material, and the film material is dissolved after lamination, so that the inner layer circuit is located in the built-in cavity to replace a high-loss resin dielectric layer, and the signal transmission loss is reduced; meanwhile, the cavities can be manufactured in different inner layers according to circuit distribution design, diversification of PCB products is facilitated, the PCB is suitable for more product requirements, the peripheries of the cavities are provided with enough supporting design, and the capacity of the cavities for resisting external pressure can be enhanced.

The invention relates to a CMOS (Complementary Metal-Oxide-Semiconductor Transistor) contact type fluorescent homogeneous assay array sensing chip which comprises a chip body, wherein the chip body comprises a silicon gel substrate, an SU-8 thick adhesive, a signal processing circuit, a photoelectric sensing array, an active preprocessing amplifying array and an asynchronous time sequence control circuit; the SU-8 thick adhesive is fixed on the upper surface of the silicon substrate, at least one florescent reaction pool group is arranged on the SU-8 thick adhesive, each florescent reaction pool group comprises at least one micro-reaction pool, and the signal processing circuit, the photoelectric sensing array, the active preprocessing amplifying array and the asynchronous time sequence control circuit are correspondingly laid on the silicon gel substrate positioned just below the florescent reaction pool group; the signal output end of the signal processing circuit is connected with a pressure welding block. The CMOS contact type fluorescent homogeneous assay array sensing chip has the beneficial effects that a photoelectric PN junction diode is capable of converting fluorescent into a photoelectric current; the photoelectric PN junction diode is integrated with the active signal processing circuit monolithically, thus the signal transmission loss is reduced, and the detection microminiaturization is realized; the micro-reaction pool is capable of detecting one sample or simultaneously detecting a plurality of samples.

The invention discloses a circuit rotating plate integrating a thin film circuit board and a spring needle. The circuit rotating plate comprises the thin film circuit board, a spring needle plate anda filling material; contacts with the relatively low distribution density on one side of the thin film circuit board are welded with an electric connecting part of the spring needle of the spring needle plate through unit conductors; the filling material is applied to a gap between a film sheet body of the thin film circuit board and a plate body of the spring needle plate, and is solidified and shaped; and the thin film circuit board is enabled to be in a flat state through the solidified filling material. Therefore, when the circuit rotating plate is applied to a probe card for wafer detection, the spring needle part of the spring needle plate of the circuit rotating plate can be directly connected with a relatively low-density circuit board of the probe card, so that the probe card canbe directly applied to the circuit conversion between the relatively low-density circuit board of the probe card and a relatively high-density probe head without assistance of an intermediate connector.

A tri-band multiwell radome includes a dense polymeric strike plate that is configured on the outside of the radome, a capture layer and a tuning layer. The polymeric strike plate is a tough polymer, such as a polycarbonate and breaks a bullet into fragments that are more easily captured by the capture layer. The capture layer includes a number of fabric sheets of highly oriented fibers, such as polyethylene fibers, and a binder. The tuning layer may be a low density foam that is configured inside of the capture layer and provided to reduce reflective losses and improve ballistic performance. A tri-band radome cover may have a dB loss over a wavelength of 8 to 40 kHz of no more than 1 dB. A tri-band radome cover may be formed in a dome shape.