30results about How to "Reduce packaging steps" patented technology

The invention provides an integrally cut and impressed double-layer packaging box which comprises a box body and a box cover. An upper inner box body and a drawer-type lower inner box body are arranged in the box body. A box holder is placed in the upper inner box body and / or the lower inner box body. The upper surface of the box holder is provided with box slot impressing marks. The invention further provides an anti-counterfeit packaging method. The anti-counterfeit packaging method comprises the steps that the box body and the box cover are manufactured at first; then the box holder is manufactured, and the box slot impressing marks are formed on the upper surface of the box holder through a mold in cutting and impressing modes; anti-counterfeit ink is printed on the box slot impressingmarks, and an article box is put on the box holder before the anti-counterfeit ink is dry, and is pressed down after the anti-counterfeit ink is completely dry, so that a box slot is formed, and finally the article box sinks into the box slot; and finally packaging is conducted. The integrally cut and impressed double-layer packaging box is novel in structure and can be manufactured through simple technical steps, the manufacturing cost is reduced, the box can be used for anti-counterfeit packaging at the same time, and the value of non-commercial behavior recycling can be improved.

The invention discloses a packaging device capable of packaging multiple bundles of cables. The packaging device comprises a rack, a swing rod is connected to the upper left end of the rack in a swinging mode, a rotating shaft is rotationally connected to the left end of the swing rod, a connecting rod is hinged to the lower end of the swing rod, a sliding block is hinged to the right end of the connecting rod, and the sliding block is rotationally connected to a driven lead screw; and the left end of the driven lead screw is rotationally connected to the rack, the right end of the driven leadscrew is fixedly connected with a driven bevel gear, the driven bevel gear is engaged and connected with a driving bevel gear, the lower end of the driving bevel gear is fixedly connected with a driving shaft, the lower end of the driving shaft is fixedly connected with a right belt wheel, and the lower left end of the rack is fixedly connected with a motor box. By means of the packaging device,the multiple bundles of cables can be placed at the same time, and all the placed cables are packaged into a barrel shape, so that the packaging steps are reduced, the efficiency and the packaging speed are improved, the packaging cloth can be automatically cut off in a fixed-length mode, and waste caused by excessive packaging is reduced.

The invention discloses a packaging structure of a UVLED lamp, which includes a fixing frame and a mounting frame, and relates to the technical field of UVLED lamps. The packaging structure of the UVLED lamp is connected by connecting the docking slider of the previous UVLED lamp with the docking slide rail of the latter UVLED lamp, and at the same time moving the slider of the latter UVLED lamp to the top of the first slide rail. When the positioning block inside a UVLED lamp moves to the position of the positioning hole inside the previous UVLED lamp, the elastic force of the spring will move the positioning block to the inside of the positioning hole, and then slide the slider of the latter UVLED lamp from the top of the first slide rail Move down and cover the second rail of the previous UVLED lamp on the inside of the slider, so that multiple UVLED lamps can be connected together.

The invention relates to a preparation method of a three-dimensional paper chip, in particular to a preparation method of a novel magnetic self-assembled three-dimensional paper chip. The preparationmethod comprises the following steps: with hydrophobic magnetic ink, carrying out screen printing to obtain a channel layer, a pretreatment reagent layer and a detection layer of the paper chip separately; printing a pretreatment agent on the pretreatment reagent layer with a squeegee through patterned reagent printing silk screen; printing a detection agent in a detection area on the detection layer with a squeegee through the patterned reagent printing silk screen; and stacking the channel layer, the pretreatment reagent layer and the detection layer in sequence on a pad made of a magnetic material, so as to obtain the three-dimensional paper chip. The preparation method of the novel magnetic self-assembled three-dimensional paper chip provided by the invention adopts a screen printing technology, an additional bonding layer or a glue spraying or printing step is avoided by improving a printing material, and a magnetic material and a hydrophobic material are both used for printing tosimplify the preparation steps and eliminate the risk that glue permeates to block hydrophilic channels.

The invention discloses a waterproof packaging structure and a packaging method of a large-dimensional photomultiplier. The waterproof packaging structure comprises a tray matched with the bottom shape of a glass shell of the photomultiplier, a sleeve, a cable waterproof connector and a bottom cover, wherein a hole is formed in the tray; the bore diameter of the hole is consistent to the inner diameter of the sleeve; the tray is connected with one end of the sleeve in a sealing manner through the hole; the other end of the sleeve is fixedly connected with the bottom cover; the tray and the bottom of the glass shell of the photomultiplier are connected in a sealing manner; and one end of the cable waterproof connector is connected with the cable inlet of the sleeve in a sealing manner while the other end is connected with a cable. According to the waterproof packaging structure and the packaging method, the packaging steps are less and the demand on an operator is relatively low; and more importantly, the waterproof packaging structure can be detached, so that problem checking and changing and upgrading of a PMT voltage divider can be realized.