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Packaging method, MEMS microphone and packaging structure thereof

A packaging structure and microphone technology, applied in the field of sensors, can solve the problems of lower product yield and low packaging efficiency

Pending Publication Date: 2020-10-30
东莞市瑞勤电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the process of packaging, if there are too many processes, not only will the equipment and process requirements for packaging be high, the packaging efficiency will be low, and the product yield may also be reduced.

Method used

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  • Packaging method, MEMS microphone and packaging structure thereof
  • Packaging method, MEMS microphone and packaging structure thereof
  • Packaging method, MEMS microphone and packaging structure thereof

Examples

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Embodiment Construction

[0027] Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. In the various figures, identical elements are indicated with similar reference numerals. For the sake of clarity, various parts in the drawings have not been drawn to scale. Also, some well-known parts may not be shown. For the sake of simplicity, the semiconductor structure obtained after several steps can be described in one figure.

[0028] It should be understood that when describing the structure of a device, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean being directly on another layer or another region, or Other layers or regions are also included between it and another layer or another region. And, if the device is turned over, the layer, one region, will be "below" or "beneath" the other layer, another region.

[0029] If it is intended to describe the situation of being directly on a...

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PUM

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Abstract

The invention discloses a packaging method, an MEMS microphone and a packaging structure thereof. The packaging structure comprises: a printed circuit board, a micro-electromechanical structure used for bearing the MEMS microphone, a chip structure, and a three-dimensional circuit structure, wherein the peripheral edge extends in the thickness direction of the three-dimensional circuit structure,the three-dimensional circuit structure forms an accommodating cavity, and the accommodating cavity is provided with an opening in the thickness direction, wherein the printed circuit board is fixed with the three-dimensional circuit structure, so that the opening is covered by the printed circuit board, the micro-electromechanical structure and the chip structure are accommodated in the accommodating cavity, and the packaging structure can reduce the packaging steps of the MEMS microphone, thereby improving the packaging efficiency and yield of the MEMS microphone.

Description

technical field [0001] The present application relates to the technical field of sensors, and more specifically, to a packaging method, a MEMS microphone and a packaging structure thereof. Background technique [0002] A microphone manufactured based on micro-electromechanical systems (Micro Electro Mechanical Systems, MEMS) is called a MEMS microphone, and generally includes a MEMS sensor chip and a functional integrated circuit (Application Specific Integrated Circuit, ASIC) chip electrically connected thereto. When packaging the MEMS microphone, the MEMS sensor chip and the ASIC chip need to be connected to a printed circuit board (Printed Circuit Board, PCB) first, and then the MEMS sensor chip and the ASIC chip are packaged inside the cavity. [0003] In the process of encapsulation, if there are too many processes, not only will the equipment and process requirements for encapsulation be high, the encapsulation efficiency will be low, and the yield rate of the product ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/01H04R19/04H04R31/00
CPCH04R19/016H04R19/04H04R31/00H04R2201/003
Inventor 王松陈为波
Owner 东莞市瑞勤电子有限公司
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