57results about How to "Reduce loop area" patented technology

One embodiment of the present invention provides an apparatus that reduces voltage noise for an integrated circuit (IC) device. This apparatus includes an interposer, which is configured to be sandwiched between the IC device and a circuit board. This interposer has a bottom surface, which is configured to receive electrical connections for power, ground and other signals from the circuit board, and a top surface, which is configured to provide electrical connections for power, ground and the other signals to the IC device. A plurality of bypass capacitors are integrated into the interposer and are coupled between the power and ground connections for the IC device, so that the plurality of bypass capacitors reduce voltage noise between the power and ground connections for the IC device.

The invention discloses a radiation source screening and positioning method based on STFT time frequency analysis. According to the method, an independent component analysis ICA algorithm is in combination with STFT, and a systematic, comprehensive, standardized radiated EMI analysis and diagnosis method is proposed. Firstly, radiation noise of EUT is separated through an ICA algorithm, and multiple radiation noise sources are screened out; secondly, short-time rapid Fourier transform and time frequency analysis on exceeding-standard frequency ranges of the overall radiation noise are carried out, and signal characteristics causing exceeding-standard radiation are extracted; lastly, the extracted signal characteristics and the multiple radiation noise sources screened out by the ICA are contrasted, positioning diagnosis on the noise sources causing exceeding-standard radiation noise is carried out, and pertinent rectification inhibition measures are adopted. The method can rapidly and effectively inhibit exceeding-standard noise of equipment through searching the corresponding device causing exceeding-standard radiation.

A flexible printed circuit improves data transfer rates by disposing ground wires in a ground plane proximate to signal wires disposed in a signal channel plane. One or more ground wires is associated with each signal wire pair or each signal wire for imaging of the return currents of the signal pairs. An overlapping alignment minimizes loop area between a ground wire and its associated signal wire. An offset alignment provides a reduced loop area and reduced breakage risk since movement of the flexible-circuit does result in compression of the signal wire and its associated ground wire. A combination of overlapping and offset alignment balances signal transfer effectiveness with breakage risk by offsetting ground and signal wires is stress sensitive regions and overlapping ground and signal wires in stress tolerant regions. In one embodiment, the flexible circuit interfaces a portable computer with a display lid to support high-speed display signals with reduced breakage risk from cycling the display lid between an open and closed position.

The invention relates to an A-typed capacitor plate of an input rectifier / filter circuit in a large-power switch power, consisting of a capacitor cathode plate and a capacitor anode plate; the capacitor cathode plate takes the shape of inverted-U, the upper half part of which has a parallel capacitor, the left lower half part of which is connected with the output cathode of a rectifier bridge and the right lower half part of which is connected with an IGBT cathode; the capacitor plate anode takes the hilt shape, the left folding part of which is connected with a filter resistor, the right lower-half part of which is connected with the IGBT anode; the capacitor cathode plate is connected with the capacitor anode plate by a cushion column. The cathode of the capacitor plate and the anode of the capacitor plate are respectively two copper plates which are superposed upwards and downwards, close to each other, and connected with each other by the cushion column; therefore, the capacitor plate reduces the inductance of the current circuit, overcomes the defects of shortening the service life of the capacitor, increasing the corrugation of output voltage and ESL-induced electromagnetic interference, as the conductive wires with the flat rectangular section have close distance, the corrugated current passing by the capacitor is large, and the heating is severer.

According to a semiconductor device (101), a first switching active element (103) of a normally-on type and a second switching active element (104) of a normally-off type are cascode-connected to each other. This causes an electric current path to be formed. The first and second switching active elements (103, 104) are provided and connected so that loop area of the electric current path is a minimum area in a plan view of the semiconductor device (101).

A power-supply apparatus is provided which includes a transformer, a primary semiconductor unit, a secondary semiconductor unit, and a secondary electronic device. Each of the primary semiconductor unit and the secondary semiconductor units has a plurality of semiconductor devices installed therein. The transformer, the primary semiconductor unit, the secondary semiconductor unit, and the secondary electronic device are electrically joined through connecting conductors. The transformer is laid on the primary semiconductor unit to make a first stack. Similarly, the secondary electronic device is laid on the secondary semiconductor unit. This permits the power-supply apparatus to be reduced in overall size thereof and minimizes adverse effects of electromagnetic noise to ensure the high efficiency in power supply operation.

The invention discloses an electric control board and a refrigerating apparatus. The electric control board comprises a strong current component, a weak current component, a printed substrate and a refrigerant radiator sleeve, wherein the strong current component comprises an electric reactor and a cooled element needing to be cooled; the cooled element is arranged in the refrigerant radiator sleeve; the electric reactor and the weak current component are arranged on the two sides of the refrigerant radiator sleeve respectively; the strong current component, the weak current component and the refrigerant radiator sleeve are all arranged on the printed substrate; and the refrigerant radiator sleeve performs cooling of the cooled element through a refrigerant. By virtue of the technical scheme, circuit connection of the electric control board is simplified and electromagnetic interference is reduced.

The invention provides a signal interconnector which is applicable to the field of signal transmission. The signal interconnector comprises a first ground pin unit and one or a plurality of clock signal pins for transmitting clock signals, wherein the first ground pin unit comprises one or a plurality of first ground pins, and at least one first ground pin is arranged adjacent to one clock signal pin. The first ground pin arranged adjacent to the clock signal pin is used for controlling the transmission impedance of the clock signal pin and reducing the area of a return circuit of the clock signals. The signal interconnector controls the effective transmission of the clock signals by arranging the ground pin in the adjacent position of the clock signal pin, so that the clock signals have a low-impedance return circuit. The area of the return circuit is reduced, the mutual crosstalk of the signals is avoided, and the seamless connection as well as the integrity and the compatibility of the signals are realized.

An electrical assembly (300, 400) includes a power IC such as a MOSFET (112, 412) attached to a substrate module (114, 214). The MOSFET includes a top surface comprising first and second conductive device surfaces (A, B), associated with first and second device ports, and a bottom surface comprising a third conductive device surface C associated with a third device port. A first foil element is bonded to the first conductive device surface(s) A and to each of the first conductive substrate surfaces (A1, A2) and provides a continuous conductive pathway from each conductive surface (A) to each other conductive surface (A) and to each conductive surface (A1, A2). A second foil element is bonded to the second conductive device surface(s) B and to the second conductive substrate surface B1 and provides a continuous conductive pathway from each device conductive surface (B) to the substrate conductive surface (B1). A third foil element may be installed to electrically interconnect the discrete second device surfaces (B). The foil elements reduce interconnection parasitics and reduce charge and thermal energy density at device conductive surfaces as compared to wire bonded electrical interconnections. The foil elements may be comprised of formed metal elements that are flexible but sufficiently rigid to hold a formed shape or flexible foils supported on a flexible dielectric substrate.

A modular power conversion system is provided which includes a plurality of building blocks comprised of transformers and power conversion bridges, and a high frequency AC link that transfers power and provides galvanic isolation between the building blocks. The high frequency link includes an insulating tube separating an AC link conductor and the building blocks. The insulating tube is further provided with conductive or semiconductive layers on its inner and outer surfaces for referencing them to the electric potentials of the adjacent conductors and windings, thereby placing the high electric fields substantially directly across the tube and reducing electric fields and partial discharge or corona in the adjoining space or media. The building blocks may be arranged in multiple stacks for DC or AC interface, preferably with neutral or lower voltage connections at the outer edges of the stacks and higher voltage terminals at the centers of the stack.

An electrical assembly (300, 400) includes a power IC such as a MOSFET (112, 412) attached to a substrate module (114, 214). The MOSFET includes a top surface comprising first and second conductive device surfaces (A, B), associated with first and second device ports, and a bottom surface comprising a third conductive device surface C associated with a third device port. A first foil element is bonded to the first conductive device surface(s) A and to each of the first conductive substrate surfaces (A1, A2) and provides a continuous conductive pathway from each conductive surface (A) to each other conductive surface (A) and to each conductive surface (A1, A2). A second foil element is bonded to the second conductive device surface(s) B and to the second conductive substrate surface B1 and provides a continuous conductive pathway from each device conductive surface (B) to the substrate conductive surface (B1). A third foil element may be installed to electrically interconnect the discrete second device surfaces (B). The foil elements reduce interconnection parasitics and reduce charge and thermal energy density at device conductive surfaces as compared to wire bonded electrical interconnections. The foil elements may be comprised of formed metal elements that are flexible but sufficiently rigid to hold a formed shape or flexible foils supported on a flexible dielectric substrate.

The invention relates to a variable frequency controller, which comprises a PCB, wherein the PCB comprises a first side edge and a second side edge which are opposite to each other, a first semiconductor circuit, a second semiconductor circuit and a bridge rectifier are sequentially arranged on the PCB close to the first side edge, the first semiconductor circuit is arranged close to a first connecting edge connecting the first side edge and the second side edge, an EMI circuit is further arranged on the PCB, the input end of the EMI circuit is connected with the input end of an alternating current power supply, the output end of the EMI circuit is connected with the input end of the bridge rectifier, and the EMI circuit is arranged close to a second connecting edge opposite to the first connecting edge. By arranging one side of the bridge rectifier close to the second connecting edge, the length of the alternating current input side routing can be effectively reduced, so that the loop area of the alternating current input side routing is reduced, the interference of the loop area on peripheral circuits, especially low-voltage circuits such as an MCU control circuit is reduced, the PCB area occupied by the alternating current routing is also reduced, and then the cost is reduced while the working reliability is enhanced.