66results about How to "Promote heat removal" patented technology

A cooling unit is provided to facilitate cooling of coolant passing through a coolant loop. The cooling unit includes one or more heat rejection units and an elevated coolant tank. The heat rejection unit(s) rejects heat from coolant passing through the coolant loop to air passing across the heat rejection unit. The heat rejection unit(s) includes one or more heat exchange assemblies coupled to the coolant loop for at least a portion of coolant to pass through the one or more heat exchange assemblies. The elevated coolant tank, which is elevated above at least a portion of the coolant loop, is coupled in fluid communication with the one or more heat exchange assemblies of the heat rejection unit(s), and facilitates return of coolant to the coolant loop at a substantially constant pressure.

Cooled electronic systems and cooling methods are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the electronic system. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into, for instance, one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink is configured and disposed to physically couple to the enclosure and facilitates rejection of heat from the fluid disposed within the compartment when the field-replaceable bank of electronic components is operatively inserted into the electronic system.

A cooled electronic system and cooling method are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the enclosure. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink facilitates rejection of heat from the fluid disposed within the compartment. In one embodiment, multiple thermal conductors project from an inner surface of the enclosure into the compartment to facilitate transfer of heat from the fluid to the heat sink.

A fiber bundle which has a pieced part formed by jetting a pressurized fluid against a fiber-bundle overlap formed either by directly superposing the ending part of a fiber bundle composed of many fibers on the beginning part of another fiber bundle composed of many fibers or by superposing the end part and the beginning part on a jointing fiber bundle composed of many fibers, whereby the many fibers of the fiber bundles are interlaced with one another to thereby piece up the fiber bundles. The pieced part comprises an opened-fiber part in which the fibers have been opened and interlaced-fiber parts respectively located on both sides thereof, each interlaced-fiber part being composed of a plurality of constituent interlaced parts located apart in the width direction for the fiber bundle. The fiber bundle having the pieced part, when fed to a process for producing a carbon fiber, is inhibited from suffering thermal damage to the pieced part, because the pieced part comprises the opened-fiber part and the interlaced-fiber parts.

Provided are an electronic device and a method of manufacturing the same. The device includes a plastic substrate, a transparent thermal conductive layer stacked on the plastic substrate, a polysilicon layer stacked on the thermal conductive layer; and a functional device disposed on the polysilicon layer. The functional device is any one of a transistor, a light emitting device, and a memory device. The functional device may be a thin film transistor including a gate stack stacked on the polysilicon layer.

The invention relates to a battery assembly (100) consisting of several battery cells (10) which are electrically connected to each other and which respectively comprise a preferably prismatic cell housing (16). Each cell housing (16) comprises at least one fastening projection (18) on the base of the cell (17), said fastening projection protruding through an opening (19) of a cooling element (12) embodied as a cooling plate (13) or as a cooling housing (35) for the cell housings (16). Said fastening projection (18) interacts with a tensioning element (22) which maintains the cell housing (16) against the cooling element (12).

The invention provides a thermal-insulation, heat-preservation and radiation-resistant garment material which comprises an inner layer, a sweat absorption layer, a thermal-insulation layer and a radiation-resistant layer from inside to outside in sequence, wherein the inner layer is formed in a way that main folded yarns and secondary folded yarns are woven in a mutually staggered and crossed mode, and a weaving structure is formed in a way that two secondary folded yarns are arranged between adjacent main folded yarns in a staggered mode; woolen silks which are made of wool fiber are arranged on the inner side of the inner layer, and the inner layer and the sweat absorption layer are wound to be connected by winding silk threads; the sweat absorption layer is formed in a way that bamboo charcoal fibers are woven; the thermal-insulation layer covers the sweat absorption layer; and the radiation-resistant layer which is made of waterproof or radiation-resistant materials coats the thermal-insulation layer. The thermal-insulation, heat-preservation and radiation-resistant garment material has the advantages that the inner layer is formed in a way that large folded yarns and small folded yarns are woven in a matched and crossed mode, so that the garment material is more comfortable during wearing; the woolen silks are adopted, so that the thermal-insulation performance of the garment material is enhanced; the sweat absorption layer is made of the bamboo charcoal fibers, so that the effects of sweat absorption and breathability are achieved; and the thermal-insulation layer and the radiation-resistant layer are favorable for heat extraction and are used in special industries.

Provided is an engine compartment heat removal structure capable of promoting heat removal of an engine compartment and suppressing an increase in air resistance when a vehicle is traveling. The engine compartment removal structure for removing heat from an engine compartment is provided with an engine compartment in which an engine in which a cylinder row is arranged in the front-rear direction of a vehicle is housed; a wheel cover which is arranged on the outer side of the engine compartment in the vehicle width direction; an exhaust gas purification device disposed between the engine and the wheel cover; a mudguard which is used for preventing water from entering the engine compartment from the wheel cover; and a wheel cover liner for protecting the inner wall of the wheel cover. The wheel cover is provided with: a discharge part provided to the rear of the mudguard than the exhaust purification device in order to discharge a part of cooling air that cools the exhaust purification device into the wheel cover; and a guide part provided in the wheel cover liner to guide the cooling air discharged into the wheel cover toward the lower side of the vehicle behind the wheel cover.

The subject of the invention is an energy storage module (10) comprising a plurality of energy storage assemblies (12) electrically connected to one another, the module comprising an external casing (40) in which are arranged the storage assemblies (12) and at least one heat exchanger (24), the module being characterized in that: the energy storage assemblies (12) are arranged side by side on at least two distinct levels (N1, N2), the or at least one of the heat exchangers (24) being positioned between two adjacent levels so as to be in thermal contact with at least one storage assembly of each of the two adjacent levels on two opposite respective contact faces (26A, 26B) of the exchanger, said or at least one of said exchangers (24) is fixed to the casing (40) of the module at least at a securing wall (28) that is distinct from the contact faces (26A, 26B), the securing walls of the exchanger and of the casing being configured in such a way that the module has a space between the corresponding securing walls (28; 44) of the exchanger and of the casing, at least at a location distinct from a securing site (70).

The invention discloses a thermally conductive silicone composition which comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpoly siloxane having an average of two tofour silicon-bonded hydrogen mponent (B) is 0.2 to 5 moles per mole of the alkenyl groups in component (A), and at least two of the silicon-bonded hydrogen atoms are located on the side chains of themolecule; (C) a hydrosilylation reaction catalyst; (D) a thermally conductive filler; (E) an alkoxysilane having an alkyl group containing 6 or more carbon atoms in a molecule; and (F) glass beads. Athermally conductive member is produced from the thermally conductive silicone composition. An electronic device has the thermally conductive member and a manufacturing method of the electronic deviceincludes using the thermally conductive silicone composition.

The invention relates to a cylinder head (1) for a compressor (2), comprising at least one coolant-conducting region (3a) and at least two air-conducting regions (4a, 4b), wherein the at least one coolant-conducting region (3a) is arranged at least partially around the at least two air-conducting regions (4a, 4b), wherein, furthermore, the at least two air-conducting regions (4a, 4b) have at least one air-feeding duct (5) for feeding the air to be compressed into the compressor (2) and at least one air-discharging duct (6) for outputting a compressed air which is compressed by the compressor (2). According to the invention, the at least one air-discharging duct (6) comprises an open-pore, metallic cell structure (7).