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Thermal gap filler and its application for battery management system

A technology for thermal conductivity and electronic devices, which is applied in the field of thermally conductive silicone compositions to achieve the effects of excellent heat transfer, stable crack resistance and high dielectric properties

Active Publication Date: 2021-02-05
DOW SILICONES CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Unfortunately, none of the existing materials ideally meet the above requirements

Method used

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  • Thermal gap filler and its application for battery management system
  • Thermal gap filler and its application for battery management system
  • Thermal gap filler and its application for battery management system

Examples

Experimental program
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Embodiment

[0131] The present disclosure will be further clarified by the following examples, which are illustrative only and do not limit the scope of the present disclosure.

[0132] The thermally conductive silicone compositions of Practical Example 1 to Practical Example 2 and Comparative Example 1 to Comparative Example 2 were obtained by mixing the components listed in Table 1 and Table 2 below in the following manner. Specifically, components (A), (D) and (E) were mixed under full vacuum using a Turello mixer in the formulas listed in Table 1 and Table 2 (Practical Example 1 and Practical Example 2 and Comparative Example 1 and Comparative Example 2). The indicated ratios were mixed for 1 hour at 120°C. The mixture was cooled to room temperature. The other ingredients indicated in the table were then added to the mixture and blended uniformly.

[0133] [Preparation of thermally conductive silicone cured products]

[0134] A thermally conductive silicone cured product was prep...

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Abstract

The invention discloses a thermally conductive silicone composition which comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpoly siloxane having an average of two tofour silicon-bonded hydrogen mponent (B) is 0.2 to 5 moles per mole of the alkenyl groups in component (A), and at least two of the silicon-bonded hydrogen atoms are located on the side chains of themolecule; (C) a hydrosilylation reaction catalyst; (D) a thermally conductive filler; (E) an alkoxysilane having an alkyl group containing 6 or more carbon atoms in a molecule; and (F) glass beads. Athermally conductive member is produced from the thermally conductive silicone composition. An electronic device has the thermally conductive member and a manufacturing method of the electronic deviceincludes using the thermally conductive silicone composition.

Description

technical field [0001] The present disclosure relates to thermally conductive silicone compositions, thermally conductive members prepared therefrom. In addition, the present disclosure also relates to an electronic device having the thermally conductive member and a method of manufacturing an electronic device using the thermally conductive silicone composition. Background technique [0002] In recent years, vehicles that use electric power as all or part of their power (for example, electric vehicles (EV), hybrid electric vehicles (HEV), plug-in hybrid electric vehicles (PHEV), etc., collectively referred to as "electric vehicles") have become increasingly It has become increasingly popular due to its advantages in energy saving and environmental protection. Today, more and more electrical buses are powered by rechargeable lithium-ion batteries. However, lithium-ion batteries may be more susceptible to changes in battery temperature than similar NiMH batteries, therefore...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08K3/08
CPCC08K3/08C08K2201/005C08K2201/001C08K9/06C08K7/20Y02E60/10C08L83/04C08G77/20C08G77/12C08K2003/2227C08L83/00C08K5/56C08K5/5419C08K3/22C08K3/04C08K3/38C08K2003/385C08K2201/01C08L2205/025H01M10/625H01M10/66C08K3/042C08K3/40C08K5/005C08K7/18C08L2203/20H01M10/486
Inventor 郑艳曹忠伟黄强阳睿S·特谢拉谢录景
Owner DOW SILICONES CORP
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