The invention relates to the technical field of circuit board
processing, in particular to a dry film cover resin plug hole micro-
etching processing technology. The technology comprises the following steps: directly windowing on a graphic resin plug hole, pasting films on two sides of a board surface, exposing the two sides of the board surface, performing
copper reduction on a board at a micro-
etching line after determining that a dry film completely covers the position of the resin plug hole, determining that the resin hole plugging position is not corroded, after the plate surface is ground to be flat, developing an outer layer by adopting data of small-size
line width / line spacing, a positive film and double-sided
exposure data, and after determining that the
line width, the line spacing, the BGA, the IC and the MI are consistent, turning to the next process for production. According to the method, hole
copper of the resin plug hole can be effectively prevented from being etched in the micro-
etching copper reduction process by covering the hole covering dry film on the resin plug hole, the hole opening quality is good, the requirement for manufacturing a circuit board with small
line width / line distance can be met, and the effect is good.