The invention relates to a ball-planting device of semiconductor packaging equipment, which comprises a stander, a net plate, two guide rails, a ball-planting mechanism and a driving mechanism. The net plate is fixed on the stander; the ball planting mechanism is positioned above the net plate and fixed in sliding fit with the two guide rails, and the ball-planting mechanism comprises a tin ball container, a pair of limit pieces, a scraper, a connecting plate, a plurality of springs, a plurality of dial indicators and a sensor; wherein the bottom of the tin ball container is provided with gaps, the pair of limit pieces is fixed on the tin ball container, the longitudinal section of the scraper has a cone shape with wide upside and narrow underside, the lower ends of the plurality of springs are fixed to the upper end of the scraper, the upper ends of the springs are connected with the plurality of dial indicators through the connecting plate, and the sensor is arranged in the tin ballcontainer; and the driving mechanism is in transmission connection with the ball-planting mechanism. The ball-planting device of the semiconductor packaging equipment has the advantages of low cost, simple and convenient control and debugging, wide applicability, little damage to tin balls, high success rate, high utilization rate, and the like.