The description is given of an arrangement comprising at least one
semiconductor component (8; 101-1, 101-2, 101-3), in particular a power
semiconductor component for the
power control of high currents, in which the at least one
semiconductor component (8; 101-1, 101-2, 101-3) has in each case at least two
electrical connection pads arranged separately from one another and is arranged on a commoncarrier body (1) in a manner electrically insulated from the latter. Furthermore a first and a second
busbar (12, 13) are fixed on the carrier body (1) alongside the at least one semiconductor component (8; 101-1, 101-2, 101-3) and in a manner electrically insulated from the at least one semiconductor component (8; 101-1, 101-2, 101-3). One
electrical connection pad of the at least one semiconductor component (8; 101-1, 101-2, 101-3) is electrically connected to the first
busbar (12, 13) and another
electrical connection pad of said semiconductor component (8; 101-1, 101-2, 101-3) is electrically connected to the second
busbar (12, 13). The first and / or the second busbar (12, 13) have / has sections arranged at opposite sides of the semiconductor component (8; 101-1, 101-2, 101-3), wherein a current is applied to the connection pad electrically connected to the relevant busbar (12, 13) from both sections.