56results about How to "Excellent reflow resistance" patented technology

The present invention relates to an adhesive composition for encapsulating connection parts in a semiconductor device in which respective connection parts of a semiconductor chip and a wiring circuit board are electrically connected with each other or alternatively in a semiconductor device in which respective connection parts of a plurality of semiconductor chips are electrically connected with each other. The adhesive composition contains an epoxy resin, a curing agent and an acrylic surface-treated filler.

The present invention is to provide an epoxy resin composition for encapsulating a semiconductor having a high flame resistance without using a flame retarder and having an excellent solder reflow resistance, and a semiconductor device using the same for encapsulating a semiconductor element. An epoxy resin composition for encapsulating a semiconductor of each of the first, second and third aspects essentially comprises (A) a phenol aralkyl type epoxy resin having a phenylene structure, (B) a phenol aralkyl type phenolic resin having a biphenylene structure and (D) an inorganic filler as common components, wherein (D) the inorganic filler is contained at the rate of 84 wt % or more and 92 wt % or less of the total amount of the epoxy resin composition.

The present invention relates to an epoxy resin composition for semiconductor encapsulation and a semiconductor device using the same. The composition includes following components (A) to (E): (A) a bifunctional epoxy resin, (B) a curing agent, (C) an imidazole compound represented by the formula (1), in which R1 and R2 each independently represent an alkyl group or an alkylol group, in which at least one of R1 and R2 represents an alkylol group, and R3 represents an alkyl group or an aryl group, (D) a linear saturated carboxylic acid having a number average molecular weight of 550 to 800, and (E) an inorganic filler.

A multilayer anisotropic conductive adhesive a plurality of adhesive layers that are laminated, each of which contains an insulating resin and a hardening agent. The conductive particles are contained either in a first plurality of adhesive layers or in a second plurality of adhesive layers, and at least the top or bottom adhesive layer has the DSC (differential scanning calorimetry) exothermic peak temperature of 130° C. or more and 180° C. or less. Also, a connection structure is constructed in which a first electronic component having an electrode and an insulating film on the surface thereof and a second electronic component that has an electrode on the surface thereof are electrically connected through the multilayer anisotropic conductive adhesive.

The present invention relates to an epoxy resin composition for optical semiconductor element encapsulation, the epoxy resin composition including following components (A) to (C):(A) an epoxy resin represented by the following structural formula (1):in which n is a positive number,(B) an epoxy resin except for the epoxy resin represented by the structural formula (1), and(C) a curing agent.

The invention relates to an epoxy molding compound for packaging a tantalum capacitor and a manufacturing method for the epoxy molding compound, and belongs to the technical field of epoxy molding compounds. The epoxy molding compound for packaging the tantalum capacitor is characterized by comprising the following components in percentage by mass: 3 to 10 percent of multifunctional epoxy resin, 1 to 5 percent of multifunctional phenolic resin, 0.5 to 3 percent of reactive diluent, 0.5 to 2 percent of stress-releasing agent, 0.1 to 1 percent of accelerant and 70 to 90 percent of mineral filler. The manufacturing method comprises the following steps of: adding the components of the epoxy molding compound into a mixer, mixing the components uniformly, extruding the mixture by using a twin-screw extruder at the temperature of between 100 and 150 DEG C, cooling, crushing and performing pre-press molding to obtain the epoxy molding compound for packaging the tantalum capacitor. The epoxy molding compound for packaging the tantalum capacitor is halogen-free and antimony-free, can package tantalum capacitors at low temperature and under low pressure, and is low in stress, and high in moldability, relux resistance, wet resistance and reliability; the manufacturing method is convenient to operate, high in production efficiency, safe and reliable, and product quality is stable; and the epoxy molding compound is particularly suitable for packaging a polymer solid chip tantalum capacitor.

Provided is a curable resin composition capable of forming a cured product which has excellent heat resistance, transparency, and flexibility and particularly excels in reflow resistance and barrier properties to a corrosive gas. The curable resin composition includes a ladder-type polyorganosilsesquioxane and an isocyanurate compound such as a triglycidyl isocyanurate compound, a monoallyl diglycidyl isocyanurate compound, a diallyl monoglycidyl isocyanurate compound, or a triallyl isocyanurate compound.

The curable resin composition according to the present invention includes a polyorganosiloxane (A), a silsesquioxane (B), an isocyanurate compound (C), and a silane coupling agent (D). The polyorganosiloxane (A) is a polyorganosiloxane approximately devoid of aryl groups. The silsesquioxane (B) includes a ladder-like silsesquioxane. The curable resin composition has excellent heat resistance, transparency and flexibility. It offers superior reflow resistance and barrier properties to a corrosive gas.

The present invention provides a resin-encapsulated semiconductor apparatus comprising a semiconductor device having a ferroelectric film and a surface-protective film, and an encapsulant member comprising a resin; the surface-protective film being formed of a polyimide. The present invention also provides a process for fabricating a resin-encapsulated semiconductor apparatus, comprising the steps of forming a film of a polyimide precursor composition on the surface of a semiconductor device having a ferroelectric film; heat-curing the polyimide precursor composition film to form a surface-protective film formed of a polyimide; and encapsulating, with an encapsulant resin, the semiconductor device on which the surface-protective film has been formed. The polyimide may preferably have a glass transition temperature of from 240° C. to 400° C. and a Young's modulus of from 2,600 MPa to 6 GPa. The curing may preferably be carried out at a temperature of from 230° C. to 300° C.

The invention relates to an environment-friendly epoxy molding compound and a preparation thereof, and belongs to the technical field of epoxy molding compounds. The environment-friendly epoxy molding compound is characterized in that: the epoxy molding compound contains a dicyclopentadiene phosphorus-containing epoxy resin, a curing agent, a curing accelerator, an inorganic filler and a polyphosphazene compound; and the mass content of the dicyclopentadiene phosphorus-containing epoxy resin is between 1 and 20 percent. The preparation method is simple in process, convenient in processing, easy in control, low in production cost and high in production efficiency; the epoxy molding compound has good mouldability, reflux resistance and moisture resistance; and a product, namely the epoxy molding compound has the advantages of environmental protection, convenience in use, safety and reliability, good compatibility, good flame retardance and the like.

A polyimide resin containing a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), a content ratio of the repeating structural unit of formula (1) with respect to the total of the repeating structural unit of formula (1) and the repeating structural unit of formula (2) being 20 mol % or more and less than 40 mol %, and the polyimide resin satisfying predetermined conditions:wherein R1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R2 represents a divalent chain aliphatic group having from 5 to 16 carbon atoms; and X1 and X2 each independently represent a tetravalent group having from 6 to 22 carbon atoms containing at least one aromatic ring.