Electrically conductive adhesive film and dicing die bonding film

Abstract

The purpose of the present invention is to provide a means which exhibits excellent heat resistance and mounting reliability when joining a semiconductor power element to a metal lead frame, and which is lead free and places little burden on the environment. Specifically, the present invention provides an electrically conductive adhesive film that contains metal particles, a thermosetting resin and a compound having Lewis acid properties or a heat acid generator, wherein the compound having Lewis acid properties or the heat acid generator is characterized by being selected from among boron fluoride or a complex thereof, a protic acid having a pKa value of -0.4 or lower, or a salt or acid obtained by combining the same anion as the salt of the protic acid with a hydrogen ion or other cation. In addition, the present invention provides a dicing and die bonding film obtained by bonding the electrically conductive adhesive film to a pressure-sensitive adhesive tape.

Description

technical field [0001] The present invention relates to a dicing die bonding film formed by bonding a conductive adhesive film and an adhesive tape together. Background technique [0002] In the past, semiconductor power devices such as IGBT (Insulated Gate Bipolar Transistor, Insulated Gate Bipolar Transistor), MOS-FET (Metal-Oxide-Semiconductor Field-Effect Transistor, Metal-Oxide-Semiconductor Field-Effect Transistor) and metal lead frames were bonded At that time, lead-free solder was widely used, but the harmfulness of lead has recently been discovered. [0003] In addition, in recent years, with the background of seeking higher-density energy control, research on power devices using wide-bandgap semiconductors such as SiC and GaN that can withstand junction temperatures above 200°C has been conducted. However, due to the eutectic of lead solder The melting point is low, so the lack of heat resistance of the junction becomes a bottleneck. [0004] Based on the above b...

AI Technical Summary

Problems solved by technology

However, even diffusion sintered solders are slightly less wettable than lead-free solders, so when joining 5mm 2 For the above large-area devices, there is still a risk of solder leakage, and the sintered body is hard and brittle, and the stress relaxation is low, so there are disadvantages of low thermal fatigue resistance and shortened device life.

[0006] In addition to the lead-free solder mentioned above, Ag paste, etc. are also used, but the material cost is very high, and pollution caused by the migration of Ag ions has become a problem.

[0007] In addition, it is known that in most lead solders or lead-free solders, in order to remove metal oxide films, fluxes such as rosin or alcohol are usually added (Patent Document 3), but these flux components tend to ooze out after moisture absorption , and the ability of these existing types of fluxes to remove the metal oxide film is not too high, so sometimes it is necessary to add a large amount, resulting in a large amount of exudation, so it will bring adverse effects on the reflow resistance reliability of the semiconductor device joint. In the past, it was necessary to clean the flux after the solder was attached, but it was troublesome and the disposal of the cleaning waste liquid became a problem

Even so, when reducing the amount of flux added to reduce bleeding, the ability to remove the oxide film is insufficient, and it is difficult to express other properties such as conductivity

Images