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Flame retarded epoxy resin composite material

A technology of epoxy resin and composition, which is applied in the direction of electrical components, circuits, electric solid devices, etc., can solve the problems of punching, insufficient filling, high price, etc., and achieve excellent adhesion, good flame retardant effect, low hygroscopic effect

Active Publication Date: 2012-02-15
ETERNAL ELECTRONICS MATERIALS (KUNSHAN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the increase in the content of silicon powder leads to defects such as insufficient filling and punching when the client performs packaging that requires high fluidity, and has disadvantages such as high price

Method used

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  • Flame retarded epoxy resin composite material
  • Flame retarded epoxy resin composite material
  • Flame retarded epoxy resin composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Embodiment 1 and Comparative Examples 1-6

[0038] The flame-retardant epoxy resin compositions of Example 1 and Comparative Examples 1-6 were prepared according to the methods described below, and their compositions are listed in Table 1.

[0039] The components are mixed in the parts by weight listed in Table 1 at room temperature with a mixer, the temperature is controlled at 60-120° C., and melted and kneaded at high temperature with a twin-shaft mixer to obtain a flame-retardant epoxy resin composition.

[0040] Table 1 Embodiment 1 and Comparative Examples 1-6

[0041]

[0042]

[0043] The ingredients in Table 1 are as follows:

[0044] Epoxy resin 1: CNE-200ELA, softening point: 65°C, epoxy equivalent: 200g / eq, purchased from Changchun Chemical.

[0045]

[0046] Phenolic resin 1: TD-2131, softening point: 80° C., OH equivalent: 102 g / eq, purchased from DIC, Japan.

[0047]

[0048] Spherical fused silica: SS-0183R, purchased from KOSEM, Korea.

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Abstract

The invention relates to a flame retarded epoxy resin composite material and is characterized in that the composite material comprises: (a) epoxide resin, (b) a hardening agent, (c) a flame retardant, (d) a hardening promoter and (e) an inorganic filling material. The flame retardant contains melamine cyanurate and cyclic phosphazene, wherein cyclic phosphazene has a following formula (I), in which R and m are defined as shown in the text. The flame retarded epoxy resin composite material of the invention not only has an excellent flame-retardant effect, but also can promote the adhersion, reflow soldering resistance and electric stability of epoxy resin materials, and is suitable for packaging of various components.

Description

technical field [0001] The invention relates to a flame-retardant epoxy resin composition and its application. technical background [0002] Epoxy molding compound has excellent mechanical, heat resistance, acid and alkali resistance and electrical properties after curing, which makes epoxy resin very important in composite materials such as sports equipment, automobiles and aerospace industries. Due to its easy curing, low curing shrinkage, and good adhesion, mechanical properties and chemical resistance, epoxy resin has been widely used in the 3C industry (computer, communication, consumer electronics) in recent years. IC packaging materials. The main purpose of IC packaging is to protect the chip, wires and circuits from moisture, dust and other external forces in the air, so as to improve the service life and reliability of the chip. The requirements for the reliability and safety of epoxy resins are increasing day by day, and the requirements for the flame retardancy ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K13/02C08K5/3492C08K5/5399C08G59/62H01L23/29H01L21/56
CPCH01L2924/0002
Inventor 李进王殿年
Owner ETERNAL ELECTRONICS MATERIALS (KUNSHAN) CO LTD
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