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Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same

An epoxy resin and semiconductor technology, which is applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of resin fluidity reduction, metal wire deformation, etc., and achieve excellent adhesion and continuous forming performance , Excellent reflow resistance, good flame retardancy effect

Inactive Publication Date: 2010-12-08
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the fluidity of the resin is lowered to easily contain voids, resulting in problems such as deformation of metal wires

Method used

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  • Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
  • Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
  • Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1 to 16 and comparative example 1 to 28

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Abstract

The present invention relates to an epoxy resin composition for semiconductor encapsulation and a semiconductor device using the same. The composition includes following components (A) to (E): (A) a bifunctional epoxy resin, (B) a curing agent, (C) an imidazole compound represented by the formula (1), in which R1 and R2 each independently represent an alkyl group or an alkylol group, in which at least one of R1 and R2 represents an alkylol group, and R3 represents an alkyl group or an aryl group, (D) a linear saturated carboxylic acid having a number average molecular weight of 550 to 800, and (E) an inorganic filler.

Description

technical field The present invention relates to an epoxy resin composition for semiconductor encapsulation and a semiconductor device using the composition. Background technique In the process of manufacturing a semiconductor device, a semiconductor element after completion of adhesion to a substrate is usually encapsulated with a molding resin such as a thermosetting resin to avoid contact with the outside. Examples of molding resins used for this purpose include resins obtained by mixing and dispersing an inorganic filler mainly composed of silica particles in an epoxy resin. As for the encapsulation method using this molding resin, for example, a transfer molding method comprising the steps of placing a semiconductor element adhered to a substrate in a metal mold, press-feeding a molding resin thereinto, and curing and molding Resin molding. Conventionally, resin-encapsulated semiconductor devices obtained by encapsulating semiconductor elements with molding resins ar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K13/02C08K5/09C08G59/68C08G59/22C08G59/24H01L23/29
CPCC08L71/00C08G59/5073C08G59/686H01L23/295C08L63/00C08G59/245H01L23/293C08G59/621H01L2924/0002C08L2666/22H01L2924/00
Inventor 秋月伸也石坂刚田渊康子市川智昭
Owner NITTO DENKO CORP
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