Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Environment-friendly epoxy molding compound and preparation method thereof

An epoxy plastic encapsulant, an environmentally friendly technology, applied in chemical instruments and methods, other chemical processes, etc., can solve the problems affecting the electrical properties, heat resistance and reliability of products, and achieve low production costs, convenient use, and high compatibility. Good capacitive effect

Active Publication Date: 2012-08-22
天津凯华绝缘材料股份有限公司
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Adding phosphate ester flame retardant will easily cause hydrolysis and produce free phosphoric acid, which will affect the electrical properties, heat resistance and reliability of the product

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Environment-friendly epoxy molding compound and preparation method thereof
  • Environment-friendly epoxy molding compound and preparation method thereof
  • Environment-friendly epoxy molding compound and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example A

[0047] Add 50g of HP7200 (dicyclopentadiene epoxy resin, Japan Dai Ink Co.), 100g of ODOPB (phosphorous compound, Jiangsu Huihong) to a four-necked flask equipped with an electric stirrer, reflux condenser, thermocouple, and nitrogen inlet Jinpu Chemical Co., Ltd.), add 0.1g accelerator, react at 150 degrees for 6 hours to obtain dicyclopentadiene-type phosphorus-containing epoxy resin with a phosphorus content of 4.2%.

Synthetic example B

[0049]The synthesis procedure is the same as that of Synthesis Example A, except that 100g of HP7200 (dicyclopentadiene epoxy resin, Japan Dai Ink Co.), 100g of ODOPB (phosphorous compound, Jiangsu Huihong Jinpu Chemical Co., Ltd.) is added, and 0.15g of accelerator is added. , to obtain a phosphorus content of 3.6% dicyclopentadiene-type phosphorus-containing epoxy resin.

Synthetic example C

[0051] The synthesis procedure is the same as that of Synthesis Example A, except that 100g of HP7200 (dicyclopentadiene epoxy resin, Japan Dai Ink Co.), 50g of ODOPB (phosphorous compound, Jiangsu Huihong Jinpu Chemical Co., Ltd.) and 0.1g of accelerator are added. , to obtain a phosphorus content of 3.1% dicyclopentadiene-type phosphorus-containing epoxy resin.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

The invention relates to an environment-friendly epoxy molding compound and a preparation thereof, and belongs to the technical field of epoxy molding compounds. The environment-friendly epoxy molding compound is characterized in that: the epoxy molding compound contains a dicyclopentadiene phosphorus-containing epoxy resin, a curing agent, a curing accelerator, an inorganic filler and a polyphosphazene compound; and the mass content of the dicyclopentadiene phosphorus-containing epoxy resin is between 1 and 20 percent. The preparation method is simple in process, convenient in processing, easy in control, low in production cost and high in production efficiency; the epoxy molding compound has good mouldability, reflux resistance and moisture resistance; and a product, namely the epoxy molding compound has the advantages of environmental protection, convenience in use, safety and reliability, good compatibility, good flame retardance and the like.

Description

technical field [0001] The invention belongs to the technical field of epoxy molding compound, in particular to an environment-friendly epoxy molding compound and a preparation method thereof. Background technique [0002] At present, epoxy molding compound is mainly composed of epoxy resin, cross-linking curing agent, curing accelerator and additives. Because of its many outstanding characteristics, such as good thermal stability, insulation, adhesion, good mechanical properties, excellent molding process performance and low cost, it is widely used in the field of electronic component packaging, and then It has become one of the most important electronic chemical materials at present. Like many other organic polymer materials, epoxy resin is also easy to burn, so flame retardants are usually added during use. Most of the flame retardants currently used are halogen derivatives or antimony-containing flame retardants. The existence of halogenated flame retardants will caus...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L85/02C09K3/10B29C47/92B29C48/92
CPCB29C48/40B29C48/92B29C2948/92704B29C2948/92895
Inventor 任志军罗春晖
Owner 天津凯华绝缘材料股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com