Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Curable epoxy resin composition

An epoxy resin, curable technology, used in electrical solid devices, semiconductor/solid state device parts, circuits, etc., can solve problems such as luminosity reduction, and achieve high quality and durability, and excellent reflow resistance. Effect

Inactive Publication Date: 2013-06-19
DAICEL CHEM IND LTD
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even when the above-mentioned composition is used as a sealing resin for high-output blue and white optical semiconductors, there is still a problem that coloring proceeds due to light and heat emitted from the optical semiconductor element, and the light that should be output is absorbed, and as a result, the luminosity of the light output from the optical semiconductor device decreases

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Curable epoxy resin composition
  • Curable epoxy resin composition
  • Curable epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

manufacture example 1

[0139] (manufacture of rubber particles)

[0140] 500 g of ion-exchanged water and 0.68 g of sodium dioctyl sulfosuccinate were placed in a 1 L polymerization vessel equipped with a reflux cooler, and the temperature was raised to 80° C. while stirring under a nitrogen stream. Here, a monomer mixture containing 9.5 g of butyl acrylate, 2.57 g of styrene, and 0.39 g of divinylbenzene corresponding to about 5% by weight of the amount required to form a core portion was added at once, and stirred for 20 minutes. After emulsification, 9.5 mg of potassium peroxodisulfate was added, followed by stirring for 1 hour to conduct initial seed polymerization. Next, 180.5 mg of potassium peroxodisulfate was added, followed by stirring for 5 minutes. Here, 180.5 g of butyl acrylate and 48.89 g of styrene were added continuously for 2 hours to dissolve 0.95 g of dioctyl sodium sulfosuccinate in the amount required to form a core part (about 95% by weight). g. The monomer mixture formed in ...

manufacture example 2

[0145] (Manufacture of rubber particle dispersed epoxy compound)

[0146] In the state of heating 10 parts by weight of the rubber particles obtained in Production Example 1 to 60° C. under nitrogen flow, it was dispersed in the product name “CELLOXIDE 2021P” (3,4-epoxycyclohexyl In 70 parts by weight of methyl (3,4-epoxy) cyclohexane carboxylate, manufactured by Daicel Co., Ltd., vacuum defoaming was carried out to obtain a rubber particle-dispersed epoxy compound (viscosity at 25° C.: 624 mPa s).

[0147] It should be noted that using a digital viscometer (trade name "DVU-EII type", manufactured by Tokimec) to measure the rubber particle-dispersed epoxy compound (10 wt. Viscosity (viscosity at 25° C.) of the substance obtained from rubber particles in 10 parts.

manufacture example 3

[0149] (Manufacture of epoxy resin: Examples 1 to 7, Comparative Examples 2 and 3)

[0150] According to the formula shown in Table 1 (mixing ratio) (unit: parts by weight), monoallyl diglycidyl isocyanurate (trade name "MA-DGIC", manufactured by Shikoku Chemical Industry Co., Ltd.) , alicyclic epoxy compound (trade name "CELLOXIDE2021P", manufactured by Daicel Co., Ltd.), rubber particle-dispersed epoxy resin obtained in Production Example 2, bisphenol A epoxy resin (trade name "YD-128" , Nippon Steel Chemical Co., Ltd.) were mixed, stirred at 80°C for 1 hour to dissolve monoallyl diglycidyl isocyanurate, and then, according to the formula shown in Table 1 (unit : parts by weight), polycarbonate diol (trade name "CD220PL", manufactured by Daicel Corporation) was mixed, and stirred at 60° C. for 1 hour to obtain an epoxy resin (mixture). In addition, "-" in Table 1 shows that the compounding of this component was not performed, and it is the same in Table 2 and Table 3.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
viscosityaaaaaaaaaa
Login to View More

Abstract

The purpose of the present invention is to provide a curable epoxy resin composition capable of yielding a cured product which has high transparency, heat resistance, light resistance and crack resistance and which exhibits excellent reflow-resistant properties (excellent heat resistance during reflow operations). This curable resin composition is characterized by comprising (A) an alicyclic epoxy compound, (B) a monoallyl diglycidyl isocyanurate compound represented by formula (1), (C) a polycarbonate polyol, and (D) a curing agent or (E) a curing catalyst. In formula (1), R1 and R2 are each a hydrogen atom or C1-8 alkyl.

Description

technical field [0001] The present invention relates to a curable epoxy resin composition, a cured product obtained by curing the curable epoxy resin composition, a resin composition for encapsulating an optical semiconductor containing the curable epoxy resin composition, and an optical semiconductor using the curable epoxy resin composition. An optical semiconductor device obtained by sealing an optical semiconductor element with a resin composition for sealing. Background technique [0002] In recent years, the output of optical semiconductor devices has been increasing, and high heat resistance and light resistance are required for resins used in optical semiconductor devices. For example, in blue and white optical semiconductor sealing materials (sealing resins), yellowing of the sealing resin due to light and heat emitted from the optical semiconductor element becomes a problem. Since the yellowed sealing resin absorbs light emitted from the optical semiconductor elem...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/26C08G59/24C08L53/00C08L63/00C08L69/00H01L23/29H01L23/31H01L33/00
CPCC08J2363/00H01L33/56H01L23/293C08G59/226C08G59/26C08L63/00H01L2224/32245H01L2224/48091H01L2224/48247H01L2224/73265C08L69/00H01L2924/00014H01L2924/00C08G59/18C08L53/00H01L23/29H01L23/31C08G59/00
Inventor 巽淳郎铃木弘世
Owner DAICEL CHEM IND LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com