73results about How to "Damage can be suppressed" patented technology

In fabrication of a light guiding unit, a half mirror layer as a reflection film for folding light is covered by a light transmission main body part as a coating member, i.e., a light transmission member, and a hard coating layer is deposited thereon. Therefore, even when the surfaces of a light guide main body part and the light transmission main body part forming the light guiding unit are cleansed as pre-processing of the deposition of the hard coating layer, the situations such that the half mirror layer is separated thereby may be avoided and optical properties of the half mirror layer may not be lost.

A substrate storage container comprises: a container casing having an aperture through which a plurality of substrates are placed in or taken out; a cover adapted to fit into the aperture of the container casing; a sealing gasket capable of elastic deformation provided between the container casing and the cover; and a retainer, mounted on the cover, capable of retaining the periphery of the substrates. The retainer has: a supporting body mounted on the inside face of the cover; a plurality of elastic pieces provided in elastically deformable fashion on the supporting body; and a block provided on each of the elastic pieces, the block retaining the periphery of one of the substrates. A relation 10.8×w<y<34.3×w is satisfied when a substrate retaining force of each of the elastic pieces is y [unit: N] and a weight per the substrate is w [unit: kg].

A wiring electrically connected to a terminal to which a high power supply potential is applied and a wiring electrically connected to a terminal to which a low power supply potential is applied are formed adjacent to each other and are formed so as to surround the integrated circuit. Thus, wiring resistance can be added between the terminals and the integrated circuit and capacitance can be added between the two wirings. Even if overvoltage is applied to the terminals due to ESD or the like, the energy of the overvoltage is consumed by the wiring resistance and the added capacitor, so that damage of the integrated circuit can be suppressed.

Apparatus transfers a plate-shaped workpiece to / from a holding surface of a chuck table. The apparatus includes a holding unit and a moving mechanism. The holding unit includes at least two holding members for holding the outer edge of the workpiece, a support plate for supporting the holding members so as to allow movement of the holding members toward or away from the outer edge of the workpiece, and a moving unit for moving the holding members. Each holding member includes a rod portion vertically movably extending downward through the support plate, an engaging portion formed on the outer circumference of the rod portion at the lower end thereof for engaging the outer edge of the workpiece, and a nozzle portion for discharging a fluid from the lower surface of the rod portion toward the holding surface to thereby float the workpiece from the holding surface.

Provided is a semiconductor device including a substrate, and a first wiring layer, a second wiring layer, and a switch via formed on the substrate. The first wiring layer has first wiring formed therein and the second wiring layer has second wiring formed therein. The switch via connects the first wiring and the second wiring. The switch via includes at least at its bottom a switch element including a resistance change layer. A resistance value of the resistance change layer changes according to a history of an electric field applied thereto.

A capacitive sensor having a bending portion and a flat portion and bendable in the bending portion includes a plurality of first transparent electrodes, a plurality of second transparent electrodes, a coupling member, and a bridge wiring member. The first transparent electrodes are arranged in a first direction. The second transparent electrodes are arranged in a second direction crossing the first direction. The coupling member is provided integrally with either the first transparent electrodes or the second transparent electrodes. The bridge wiring member is provided separately from the first transparent electrodes or the second transparent electrodes, to which the coupling member is not provided, in a portion where the bridge wiring member crosses the coupling member. A direction in which the coupling member extends in the bending portion is different from a direction in which the coupling member extends in the flat portion.