73results about How to "Damage can be suppressed" patented technology

In fabrication of a light guiding unit, a half mirror layer as a reflection film for folding light is covered by a light transmission main body part as a coating member, i.e., a light transmission member, and a hard coating layer is deposited thereon. Therefore, even when the surfaces of a light guide main body part and the light transmission main body part forming the light guiding unit are cleansed as pre-processing of the deposition of the hard coating layer, the situations such that the half mirror layer is separated thereby may be avoided and optical properties of the half mirror layer may not be lost.

In fabrication of a light guiding unit, a half mirror layer as a reflection film for folding light is covered by a light transmission main body part as a coating member, i.e., a light transmission member, and a hard coating layer is deposited thereon. Therefore, even when the surfaces of a light guide main body part and the light transmission main body part forming the light guiding unit are cleansed as pre-processing of the deposition of the hard coating layer, the situations such that the half mirror layer is separated thereby may be avoided and optical properties of the half mirror layer may not be lost.

A substrate storage container comprises: a container casing having an aperture through which a plurality of substrates are placed in or taken out; a cover adapted to fit into the aperture of the container casing; a sealing gasket capable of elastic deformation provided between the container casing and the cover; and a retainer, mounted on the cover, capable of retaining the periphery of the substrates. The retainer has: a supporting body mounted on the inside face of the cover; a plurality of elastic pieces provided in elastically deformable fashion on the supporting body; and a block provided on each of the elastic pieces, the block retaining the periphery of one of the substrates. A relation 10.8×w<y<34.3×w is satisfied when a substrate retaining force of each of the elastic pieces is y [unit: N] and a weight per the substrate is w [unit: kg].

A wiring electrically connected to a terminal to which a high power supply potential is applied and a wiring electrically connected to a terminal to which a low power supply potential is applied are formed adjacent to each other and are formed so as to surround the integrated circuit. Thus, wiring resistance can be added between the terminals and the integrated circuit and capacitance can be added between the two wirings. Even if overvoltage is applied to the terminals due to ESD or the like, the energy of the overvoltage is consumed by the wiring resistance and the added capacitor, so that damage of the integrated circuit can be suppressed.

A substrate storage container comprises: a container casing having an aperture through which a plurality of substrates are placed in or taken out; a cover adapted to fit into the aperture of the container casing; a sealing gasket capable of elastic deformation provided between the container casing and the cover, and a retainer, mounted on the cover, capable of retaining the periphery of the substrates. The retainer has: a supporting body mounted on the inside face of the cover; a plurality of elastic pieces provided in elastically deformable fashion on the supporting body; and a block provided on each of the elastic pieces, the block retaining the periphery of one of the substrates. A relation 10.8×w<y<34.3×w is satisfied when a substrate retaining force of each of the elastic pieces is y [unit: N] and a weight per the substrate is w [unit: kg].

To provide a photosensitive resin composition in which a hardened film obtained from the photosensitive resin composition has properties comparable to those of a film hardened at a high temperature, a method for manufacturing a patterned hardened film using the photosensitive resin composition, and an electronic part. The photosensitive resin composition includes (a) a polybenzoxazole precursor having a repeating unit represented by a general formula (I):wherein U and V represent a divalent organic group, and at least one of U and V is a group containing an aliphatic chain structure having 1 to 30 carbon atoms; (b) a photosensitizer; (c) a solvent; and (d) a crosslinking agent capable of causing crosslinking or polymerization by heating.

A semiconductor laser device includes a substrate and a semiconductor layer formed on a surface of the substrate and having a waveguide extending in a first direction parallel to the surface, wherein the waveguide is formed on a region approaching a first side from a center of the semiconductor laser device in a second direction parallel to the surface and intersecting with the first direction, a first region separated from the waveguide on a side opposite to the first side of the waveguide and extending parallel to the first direction and a first recess portion separated from the waveguide on an extension of a facet of the waveguide, intersecting with the first region and extending in the second direction are formed on an upper surface of the semiconductor laser device, and a thickness of the semiconductor layer on the first region is smaller than a thickness of the semiconductor layer on a region other than the first region.

A thin film formed on a substrate is etched, without generating a plasma, with an etching gas containing a β-diketone and a gas containing water and / or alcohol, thereby exposing a surface of the substrate.

Plasma generated in water vapor bubbles present in a water-containing liquid is brought into contact, in the liquid, with an article having a contact angle with water of 90° or less. The plasma is contacted with an organic substance adhering to the article to thereby remove the organic substance from the article. By bringing the plasma into contact with the article, the surface of the article is etched without breaking the article. The article may comprise a material composed of both a hydrophobic part having a contact angle with water exceeding 90° and a hydrophilic part having a contact angle with water of 90° or less. In this case only the hydrophobic part is etched by bringing the plasma into contact with the article.

Provided is a semiconductor device including a substrate, and a first wiring layer, a second wiring layer, and a switch via formed on the substrate. The first wiring layer has first wiring formed therein and the second wiring layer has second wiring formed therein. The switch via connects the first wiring and the second wiring. The switch via includes at least at its bottom a switch element including a resistance change layer. A resistance value of the resistance change layer changes according to a history of an electric field applied thereto.

A semiconductor device has a planarizing layer that is made of an inorganic film, and has a recessed portion formed in a region thereof in which a conductive film is disposed. A first contact hole penetrating through at least an interlayer insulating film is formed on a first wiring layer, while a second contact hole penetrating through at least the interlayer insulating film is formed on the conductive film so as to run through the inside of the recessed portion.

A chuck table adhesively holds a rear face of a mount frame subject to a dicing process with a protective tape joined thereto, and a suction plate having a heater embedded therein contacts and heats the protective tape. Consequently, an adhesion layer of the protective tape reduces its adhesive force due to foaming and expansion. Thereafter, the suction plate moves upward while keeping its suction force to separate the protective tape from all of chips.

Provided is an electric power supply device in which exposure of a wire harness can be reduced in a slide door and interference with door trim can be minimized. When a slide door is half opened, a wire harness bends convexly downward, and one portion thereof is positioned lower than when the slide door is fully open or fully closed. Specifically, the wire harness is bent three-dimensionally. This makes it easier for the wire harness to be pulled out from a bottom end of door trim, and makes it possible for interference between the wire harness and the door trim to be minimized. The wire harness may be also bent three-dimensionally as appropriate in accordance with a shape of the door trim, reducing exposure of the wire harness in the slide door.

An organic light emitting diode (OLED) display device includes: a display panel including a display area and a non-display area provided in an external side of the display area; a set frame disposed on a rear surface of the display panel and supporting the display panel; a side frame surrounding a side surface of the display panel and covering the non-display area; and a cover window covering the display area disposed in an inner space surrounded by the side frame.

A punctured pneumatic tire in a tire-rim assembly is repaired by mounting on a vehicle the tire-rim assembly provided with an internal pressure alarm means, said tire comprising an auxiliary load-supporting structure satisfying a requirement that an deformation quantity of the tire in a radial direction thereof at a rim-assembled state under a load corresponding to 90% of a maximum load capacity at an internal tire pressure of zero is within a range of 30-60% of a section height of the tire under no load at the internal tire pressure of zero; detecting a puncture of the tire produced during the running of the tire by the internal pressure alarm means; unavoidably running the punctured tire to a relatively short-range safe place to quickly stop the vehicle; and refilling gas to a given internal pressure by a gas filling means equipped on the vehicle while occluding a punctured hole with a puncture repairing means equipped on the vehicle.

The present invention relates to a method for producing a cell mass structure, which produces a cell mass structure (adhesion pad 4) in which a plurality of cell aggregates 2 arranged inside a culture container 3 accommodating a culture liquid are fused to each other by being cultured. A plurality of pins 16 are erected inside the above-described culture container 3, the above-described cell aggregates 2 are accommodated by the plurality of pins 16 with parts between the plurality of pins 16 and pins 16 as accommodating portions H, and the cell aggregates 2 are cultured in a state of being accommodated in the plurality of adjacent accommodating portions H. It is possible to obtain a required shape and dimension, and the cell mass structure can be obtained without giving damage to cells further.

An aqueous urea tank structure is provided for a construction machine, in which a temperature rise of the aqueous urea within the tank can be suppressed and the load applied to the tank due to vibration of a vehicle body can be reduced. The aqueous urea tank structure including an aqueous urea tank which is disposed within a revolving upperstructure of a hydraulic excavator to store aqueous urea that purifies the exhaust gas discharged from an engine, wherein the aqueous urea tank structure further includes a securing member which encloses the periphery of the aqueous urea tank to secure the aqueous urea tank within the revolving upperstructure, and heat insulating materials which are interposed between the securing member and the aqueous urea tank to hold the aqueous urea tank. The securing member contains a box.

A wiring electrically connected to a terminal to which a high power supply potential is applied and a wiring electrically connected to a terminal to which a low power supply potential is applied are formed adjacent to each other and are formed so as to surround the integrated circuit. Thus, wiring resistance can be added between the terminals and the integrated circuit and capacitance can be added between the two wirings. Even if overvoltage is applied to the terminals due to ESD or the like, the energy of the overvoltage is consumed by the wiring resistance and the added capacitor, so that damage of the integrated circuit can be suppressed.

A method for manufacturing a group III nitride crystal includes a step of mixing a group III source material and ammonia in a reactor including quartz, and growing a group III nitride crystal on a support substrate by a vapor deposition. The group III source material is an organic metal source material containing Al. The organic metal source material is mixed with a hydrogen halide gas and the mixture of the organic metal source material and the hydrogen halide gas is supplied to the reactor.

A lamp includes a light source, a projection lens in which light from the light source is incident on one surface and the light is emitted from the other surface, a lens holder to which the projection lens is fixed and which extends to a side opposite to the direction of the light emitted from the projection lens, and a base plate disposed on the side opposite to a side of the lens holder to which the projection lens is fixed and having an opening through which the light from the light source passes. The base plate has a light shielding portion which is provided between the projection lens and the lens holder and extends toward the projection lens, and the light shielding portion is formed by bending a portion of the base plate.

An electronic circuit unit in which a mold exclusion part, having a rear surface side covered by mold resin and a front surface side exposed from an outer case, is provided at a part of a plate surface of a circuit board which is mounted with electronic components and is covered by the outer case formed by the mold resin. The outer case is multi-material molded using plural kinds of resin having different fluidities. A rear wall of the outer case located on the rear surface side of the mold exclusion part is made of one of the plural kinds of the resin having a fluidity higher than a fluidity of another one of the plural kinds of the resin constituting the other portion of the outer case.

A capacitive sensor having a bending portion and a flat portion and bendable in the bending portion includes a plurality of first transparent electrodes, a plurality of second transparent electrodes, a coupling member, and a bridge wiring member. The first transparent electrodes are arranged in a first direction. The second transparent electrodes are arranged in a second direction crossing the first direction. The coupling member is provided integrally with either the first transparent electrodes or the second transparent electrodes. The bridge wiring member is provided separately from the first transparent electrodes or the second transparent electrodes, to which the coupling member is not provided, in a portion where the bridge wiring member crosses the coupling member. A direction in which the coupling member extends in the bending portion is different from a direction in which the coupling member extends in the flat portion.

Apparatus transfers a plate-shaped workpiece to / from a holding surface of a chuck table. The apparatus includes a holding unit and a moving mechanism. The holding unit includes at least two holding members for holding the outer edge of the workpiece, a support plate for supporting the holding members so as to allow movement of the holding members toward or away from the outer edge of the workpiece, and a moving unit for moving the holding members. Each holding member includes a rod portion vertically movably extending downward through the support plate, an engaging portion formed on the outer circumference of the rod portion at the lower end thereof for engaging the outer edge of the workpiece, and a nozzle portion for discharging a fluid from the lower surface of the rod portion toward the holding surface to thereby float the workpiece from the holding surface.

A semiconductor device includes a memory transistor (10A) which is capable of being irreversibly changed from a semiconductor state where drain current Ids depends on gate voltage Vg to a resistor state where drain current Ids does not depend on gate voltage Vg. The memory transistor (10A) includes a gate electrode (3), a metal oxide layer (7), a gate insulating film (5), and source and drain electrodes. The drain electrode (9d) has a multilayer structure which includes a first drain metal layer (9d1) and a second drain metal layer (9d2), the first drain metal layer (9d1) being made of a first metal whose melting point is not less than 1200° C., the second drain metal layer (9d2) being made of a second metal whose melting point is lower than that of the first metal. Part P of the drain electrode 9d extends over both the metal oxide layer (7) and the gate electrode (3) when viewed in a direction normal to a surface of the substrate. The part (P) of the drain electrode (9d) includes the first drain metal layer (9d1) and does not include the second drain metal layer (9d2).

A transfer substrate for transferring a metal wiring material to a transfer target including a substrate, at least one metal wiring material formed on the substrate, at least one coating layer formed on a surface of the metal wiring material, and an underlying metal film formed between the substrate and the metal wiring material, in which the metal wiring material is a compact formed by sintering metal powder such as gold powder having a purity of 99.9 wt % or more and an average particle size of 0.01 μm to 1.0 μm, and the coating layer is a predetermined metal such as gold or an alloy having a different composition from that of the metal wiring material and has a total thickness of 1 μm or less, and the metal underlying film is made of a predetermined metal such as gold or an alloy. The transfer substrate can lower heating temperature on the transfer target side.

Provided is a semiconductor device including a substrate, and a first wiring layer, a second wiring layer, and a switch via formed on the substrate. The first wiring layer has first wiring formed therein and the second wiring layer has second wiring formed therein. The switch via connects the first wiring and the second wiring. The switch via includes at least at its bottom a switch element including a resistance change layer. A resistance value of the resistance change layer changes according to a history of an electric field applied thereto.

A rotating electrical machine for a vehicle includes a protective cover including a protruding portion projected to an opening side from a circumferential edge portion of a through hole formed in a bottom portion, a stud bolt that is inserted into the through hole to fix a rectifier to a portion of a casing at a position on one side in an axial direction, a mold resin including a projecting portion projected toward the protective cover, for electrically insulating the rectifier and the stud bolt from each other, and a fitting fixed to an extending portion of the stud bolt that extends from the through hole. A harness clamp is held by the fitting, and the projecting portion and the protruding portion are arranged at a position so that the projecting portion and the protruding portion are overlapped with each other in the axial direction of the stud bolt.

A wire harness is provided with an electrically conductive path, a tubular sheath member which accommodates the electrically conductive path in an inner part, and a sheet member positioned between at least a part of a circumferential direction of the electrically conductive path and an inner peripheral surface of the sheath member. The sheet member may be wound on the electrically conductive path so as to cover an entire area in the circumferential direction. The sheet member may be intermittently arranged in an axial direction of a tube of the sheath member.

A sheet including exfoliated clay minerals, having a density of 1.6 g / cm3 or less and a compression ratio of 20% or more.

A capacitive sensor having a bending portion and a flat portion and bendable in the bending portion includes a plurality of first transparent electrodes, a plurality of second transparent electrodes, a coupling member, and a bridge wiring member. The first transparent electrodes are arranged in a first direction. The second transparent electrodes are arranged in a second direction crossing the first direction. The coupling member is provided integrally with either the first transparent electrodes or the second transparent electrodes. The bridge wiring member is provided separately from the first transparent electrodes or the second transparent electrodes, to which the coupling member is not provided, in a portion where the bridge wiring member crosses the coupling member. A direction in which the coupling member extends in the bending portion is different from a direction in which the coupling member extends in the flat portion.