The invention discloses a method for
cutting a golden finger of a flexible circuit board by
ultraviolet laser.
Ultraviolet pulse
laser with 16-29j / cm2 of low-
energy density and 60-90kHz of high repetition frequency is adopted to
cut and process PI (
polyimide) substrate at 100-400mm / s scanning speed, then
ultraviolet pulse
laser with 113-226j / cm2 of high-
energy density and 20-30kHz of low repetition frequency is adopted to
cut and process
copper foil material at 50-200mm / s scanning speed, and the
ultraviolet pulse laser is closed when no
copper foil material exists, until the
copper foil material is penetrated in a
cutting manner, so as to carry out FPC (flexible circuit board) golden finger
cutting and
processing procedures. In the method, the method that the ultraviolet pulse laser with high-
energy density and low repetition frequency only cuts the
copper foil material and the method that the ultraviolet pulse laser with low-energy density and high repetition frequency only cuts the PI substrate are combined to
cut the substrate of the FPC, so that heat damage,
carbonization and chippings at the cutting edge of PI can be effectively avoided, the cutting quality of the golden finger is improved and the problems in the prior art are solved.