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Method for cutting golden finger of flexible circuit board by ultraviolet laser

A flexible circuit and gold finger technology, applied in the field of UV laser cutting of flexible circuit board gold fingers, can solve problems such as hidden dangers, poor incision quality, short circuit of thin copper sheets of gold fingers, etc., to avoid thermal damage and improve cutting quality. Effect

Active Publication Date: 2011-09-14
武汉飞能达激光技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to cut off the gold finger, the conventional method is to use high energy density and low repetition rate laser ultraviolet pulse laser to cut directly from the surface of the gold finger with copper foil material, which will inevitably cause greater heat generation at the cutting edge of the PI substrate. Damage, such as carbonization and debris, leads to poor cut quality and will leave hidden dangers; in severe cases, it will cause a short circuit between the thin copper sheets of the gold finger and be scrapped

Method used

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  • Method for cutting golden finger of flexible circuit board by ultraviolet laser
  • Method for cutting golden finger of flexible circuit board by ultraviolet laser
  • Method for cutting golden finger of flexible circuit board by ultraviolet laser

Examples

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example 1

[0019] The present invention adopts the Awave-355-8W-25K all-solid-state Q-switched ultraviolet laser produced by American Lightwave Company, with an output wavelength of 355nm, pulse energy from 0 to 500μJ, and a frequency of 10 to 100kHz for cutting FPC gold fingers. The thickness of the PI base material of the FPC gold finger is 120 microns, and the thickness of the conductive copper foil is 18 microns. The processing parameters of the blind holes drilled by the ultraviolet laser are shown in Table 1. The cutting quality of the FPC golden finger obtained by adopting the invention achieves the effects of no heat damage, carbonization and debris in the PI cut.

[0020] Table I

[0021]

example 2

[0023] The present invention adopts the Awave-355-8W-25K all-solid-state Q-switched ultraviolet laser produced by American Lightwave Company, with an output wavelength of 355nm, pulse energy from 0 to 500μJ, and a frequency of 10 to 100kHz for cutting FPC gold fingers. The thickness of the PI base material of the FPC gold finger is 200 microns, and the thickness of the conductive copper foil is 20 microns. The processing parameters of the blind holes drilled by the ultraviolet laser are shown in Table 2. The cutting quality of the FPC golden finger obtained by adopting the invention achieves the effects of no heat damage, carbonization and debris in the PI cut.

[0024] Table II

[0025]

example 3

[0027] The present invention adopts the Awave-355-8W-25K all-solid-state Q-switched ultraviolet laser produced by American Lightwave Company, with an output wavelength of 355nm, pulse energy from 0 to 500μJ, and a frequency of 10 to 100kHz for cutting FPC gold fingers. The thickness of the PI base material of the FPC gold finger is 300 microns, and the thickness of the conductive copper foil is 25 microns. The processing parameters of the blind holes drilled by the ultraviolet laser are shown in Table 2. The cutting quality of the FPC golden finger obtained by adopting the invention achieves the effects of no heat damage, carbonization and debris in the PI cut.

[0028] Table three

[0029]

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Abstract

The invention discloses a method for cutting a golden finger of a flexible circuit board by ultraviolet laser. Ultraviolet pulse laser with 16-29j / cm2 of low-energy density and 60-90kHz of high repetition frequency is adopted to cut and process PI (polyimide) substrate at 100-400mm / s scanning speed, then ultraviolet pulse laser with 113-226j / cm2 of high-energy density and 20-30kHz of low repetition frequency is adopted to cut and process copper foil material at 50-200mm / s scanning speed, and the ultraviolet pulse laser is closed when no copper foil material exists, until the copper foil material is penetrated in a cutting manner, so as to carry out FPC (flexible circuit board) golden finger cutting and processing procedures. In the method, the method that the ultraviolet pulse laser with high-energy density and low repetition frequency only cuts the copper foil material and the method that the ultraviolet pulse laser with low-energy density and high repetition frequency only cuts the PI substrate are combined to cut the substrate of the FPC, so that heat damage, carbonization and chippings at the cutting edge of PI can be effectively avoided, the cutting quality of the golden finger is improved and the problems in the prior art are solved.

Description

technical field [0001] The invention belongs to the technical field of laser processing applications, and in particular relates to a method for cutting gold fingers of a flexible circuit board with an ultraviolet laser. Background technique [0002] Flexible circuit board (FPC for short) has the functions of free bending, folding and winding, and can move and stretch freely in three-dimensional space, and can realize light weight, miniaturization and thinning, so as to achieve the integration of component device and wire connection and can be installed in other parts. Many advantages, such as the drilling position that cannot be achieved by connecting cables, are widely used in inkjet printer heads, hard disk drives, MP3, MP4 players, portable CD players, household VCDs, DVDs, digital cameras, mobile phones and mobile phone batteries, medical , automotive and aerospace products. [0003] The interconnection between FPCs or the connection between FPCs and external circuits i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K101/36
Inventor 李重洋段军严军
Owner 武汉飞能达激光技术有限公司
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