Ring removing method of Taiko thinning process

Abstract

The invention discloses a ring removing method of a Taiko thinning process. The method includes: using the Taiko thinning process to thin the back of a wafer; completing a back process at the back of the wafer; attaching the wafer to a cutting rubber belt and fixing the same on a wafer ring; cutting at a position 2-10mm away from the inner side of the outer edge of the middle part of the wafer to form a buffer groove; using a ring cutting process to remove or flatly grind a support ring. By the method, wafer breaking rate during ring cutting can be lowered or wafer breaking during ring cutting can be prevented completely.

Description

technical field [0001] The invention relates to a semiconductor integrated circuit manufacturing process method, in particular to a ring-removing method of a Taiko thinning process. Background technique [0002] The Taiko thinning process is an ultra-thin thinning process developed by DISCO Corporation of Japan. The Taiko thinning process does not thin the entire plane of the wafer, that is, the silicon wafer, but only thins the middle part of the wafer. , the edge portion of the wafer is not ground and thinned, the width of the edge portion without thinning is about 2 mm to 5 mm, and the support ring is formed by the edge portion without thinning. [0003] Generally, when the silicon wafer is thin to a certain extent and has a large area, its mechanical strength will be greatly reduced. Taking an 8-inch silicon wafer as an example, when the thickness of the silicon wafer is less than 200 microns, the silicon wafer will be curled, so it cannot continue to be transported. tr...

AI Technical Summary

Problems solved by technology

In the existing ring cutting process steps, it is easy to produce edge chipping and cause the entire wafer to break, that is, the existing ring cutting process is extremely prone to fragmentation during ring removal, and the fragmentation rate of some products is even as high as 10%. about

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