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724results about "Anticorrosion compositions" patented technology

Stabilized alkaline compositions for cleaning microelectronic substrates

The invention provides aqueous alkaline compositions useful in the microelectronics industry for stripping or cleaning semiconductor wafer substrates by removing photoresist residues and other unwanted contaminants. The compositions typically contain (a) one or more metal ion-free bases at sufficient amounts to produce a pH of about 10-13 and one or more bath stabilizing agents having at least one pKa in the range of 10-13 to maintain this pH during use; (b) optionally, about 0.01% to about 5% by weight (expressed as % SiO2) of a water-soluble metal ion-free silicate; (c) optionally, about 0.01% to about 10% by weight of one or more chelating agents; (d) optionally, about 0.01% to about 80% by weight of one or more water-soluble organic co-solvents; and (e) optionally, about 0.01% to about 1% by weight of a water-soluble surfactant.
Owner:AVANTOR PERFORMANCE MATERIALS LLC

Alkaline, post plasma etch/ash residue removers and photoresist stripping compositions containing metal-halide corrosion inhibitors

The invention provides alkaline compositions useful in the microelectronics industry for stripping or cleaning semiconductor wafer substrates by removing photoresist residues and other unwanted contaminants. The compositions contain (a) one or more bases and (b) one or more metal corrosion inhibiting metal halides of the formula: WzMXy where M is a metal selected from the group Si, Ge, Sn, Pt, P, B, Au, Ir, Os, Cr, Ti, Zr, Rh, Ru, and Sb; X is a halide selected from F, Cl, Br and I; W is selected from H, to an alkali or alkaline earth metal, and a metal ion-free hydroxide base moiety; y is a numeral of from 4 to 6 depending on the metal halide; and z is a numeral of 1, 2 or 3.
Owner:AVANTOR PERFORMANCE MATERIALS INC

Liquid cleaner for the removal of post-etch residues

Cleaning compositions and processes for cleaning post-plasma etch residue from a microelectronic device having said residue thereon. The composition achieves highly efficacious cleaning of the residue material, including titanium-containing, copper-containing, tungsten-containing, and / or cobalt-containing post-etch residue from the microelectronic device while simultaneously not damaging the interlevel dielectric, metal interconnect material, and / or capping layers also present thereon. In addition, the composition may be useful for the removal of titanium nitride layers from a microelectronic device having same thereon.
Owner:ENTEGRIS INC

Composition for removal of residue comprising cationic salts and methods using same

The present invention relates to an aqueous cleaning composition used to remove unwanted organic and inorganic residues and contaminants from a substrate such as, for example, a semiconductor substrate. The cleaning composition comprises from about 0.01% to about 40% by weight of a salt selected from a guanidinium salt, an acetamidinium salt, a formamidinium salt, and mixtures thereof; water; and optionally a water soluble organic solvent. Compositions according to the present invention are free of an oxidizer and abrasive particles and are capable of removing residues from a substrate and, particularly, a substrate having silicon-containing BARC and / or photoresist residue.
Owner:VERSUM MATERIALS US LLC

Formulations for removing cooper-containing post-etch residue from microelectronic devices

A method and composition for removing copper-containing post-etch and / or post-ash residue from patterned microelectronic devices is described. The removal composition includes a diluent, a solvent and a copper corrosion inhibitor, wherein the diluent may be a dense fluid or a liquid solvent. The removal compositions effectively remove the copper-containing post-etch residue from the microelectronic device without damaging exposed low-k dielectric and metal interconnect materials.
Owner:ADVANCED TECH MATERIALS INC

Formulations for cleaning memory device structures

A removal composition and process for removing silicon-containing layers from a microelectronic device having said layers thereon. The removal composition selectively removes layers including, but not limited to, silicon oxide, plasma enhanced tetraethyl orthosilicate (P-TEOS), borophosphosilicate glass (BPSG), plasma enhanced oxide (PEOX), high density plasma oxide (HDP), phosphosilicate glass (PSG), spin-on-dielectrics (SOD), thermal oxide, updoped silicate glass, sacrificial oxides, silicon-containing organic polymers, silicon-containing hybrid organic / inorganic materials, organosilicate glass (OSG), TEOS, fluorinated silicate glass (FSG), hemispherical grain (HSQ), carbon-doped oxide (CDO) glass, and combinations thereof, relative to lower electrode, device substrate, and / or etch stop layer materials.
Owner:ADVANCED TECH MATERIALS INC

Dishwasher detergent with improved protection against glass corrosion

A dishwasher detergent containing a builder and one or more magnesium and / or zinc salt(s) of at least one monomeric and / or polymeric organic acid, excluding zinc ricinoleate, zinc abietate, and zinc oxalate. A method of inhibiting glass corrosion by treatment with one or more salts of magnesium and / or zinc with organic acids, excluding formic acid, acetic acid, gluconic acid, and oxalic acid.
Owner:HENKEL KGAA

Compositions And Methods For Removing Scale And Inhibiting Formation Thereof

Compositions for removing scale and / or inhibiting formation thereof include an alkaline agent, a primary scale inhibitor, a secondary scale inhibitor and a solvent. The primary scale inhibitor may include phosphonic acid, salts of phosphonic acids and combinations thereof. Suitable secondary scale inhibitor may include aminocarboxylic acids, salts of aminocarboxylic acids, carboxylic acids, salts of carboxylic acids, polycarboxylic acids, salts of polycarboxylic acids, gluconic acids, salts of gluconic acids, steroids, tetrapyrrols, ionophores, 2,2′-bipyridine, dimercaptopropanol, ortho-phenanthroline and combinations thereof. The compositions may be prepared as a stable concentrates that have pH values greater than or equal to 11. The compositions may also be prepared on site as a use solution. Methods of using the compositions to extend system operating times and to remove scale from and / or inhibit formation of scale on an article are also disclosed.
Owner:DELAVAL HLDG AB

Stripping and cleaning compositions for microelectronics

Aqueous, silicate free, cleaning compositions of about pH 9 or below and method of using the cleaning compositions for cleaning microelectronic substrates, which compositions are able to essentially completely clean such substrates and produce essentially no metal corrosion of the metal elements of such substrates. The aqueous cleaning compositions of this invention have (a) water, (b) at least one of ammonium and quaternary ammonium ions and (c) at least one of hypophosphite (H2PO2−) and / or phosphite (HPO32−) ions. The cleaning compositions also may contain fluoride ions. Optionally, the composition may contain other components such as organic solvents, oxidizing agent, surfactants, corrosion inhibitors and metal complexing agents.
Owner:AVANTOR PERFORMANCE MATERIALS LLC

Compositions for the removal of organic and inorganic residues

A composition and method using same for removing photoresist and / or processing residue from a substrate are described herein. In one aspect, there is provided a composition for removing residue consisting essentially of: an acidic buffer solution having an acid selected from a carboxylic acid or a polybasic acid and an ammonium salt of the acid in a molar ratio of acid to ammonium salt ranging from 10:1 to 1:10; an organic polar solvent that is miscible in all proportions in water; a fluoride, and water wherein the composition has a pH ranging from about 3 to about 7.
Owner:VERSUM MATERIALS US LLC

Antioxidants for post-cmp cleaning formulations

An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
Owner:ENTEGRIS INC

Warewashing composition for use in automatic dishwashing machines, and methods for manufacturing and using

A warewashing detergent composition is provided according to the invention. The warewashing detergent composition includes a cleaning agent, an alkaline source, and a corrosion inhibitor. The cleaning agent comprises a detersive amount of a surfactant. The alkaline source is provided in an amount effective to provide a use composition having a pH of at least about 8. The corrosion inhibitor includes a source of aluminum ion and a source of zinc ion. The relative amounts of the source of zinc ion and the source of aluminum ion can be controlled to reduce visible filming when the warewashing detergent composition is used in the presence of hard water. Methods for using and manufacturing a warewashing detergent composition are provided.
Owner:ECOLAB USA INC

Methods of protecting glassware surfaces from corrosion using detergent compositions containing polyvalent metal compounds and high levels of low foaming, nonionic surfactants

Methods of protecting glassware surfaces from corrosion and improving cleaning performance using automatic dishwashing detergent compositions and compositions of matter, having polyvalent metal compounds and high levels of low-foaming, nonionic surfactants, are provided.
Owner:THE PROCTER & GAMBLE COMPANY

Textured decorative plating on plastic components

A relatively inexpensive process for making plastic components having textured chrome finishes that may have fine, crisp, clean lines and intricate details includes steps of electroplating a layer of etchable metal on a surface of a plastic article, typically preserving the surface of the etchable metal, etching a desired relief pattern on the layer of etchable metal, typically cleaning and activating the surface of the relief patterned etched metal layer, and electroplating a layer of decorative metal on the relief patterned etched metal layer.
Owner:LACKS ENTERPRISES

Oilfield cleaner and corrosion inhibitor

Disclosed herein are cleaner / corrosion inhibiting compositions useful in applications relating to the production, transportation, storage, and separation of crude oil and natural gas. Also disclosed herein are methods of using the compositions as cleaners / corrosion inhibitors, particularly in applications relating to the production, transportation, storage, and separation of crude oil and natural gas.
Owner:CHAMPIONX USA INC

Stabilized hydrochlorofluoroolefins and hydrofluoroolefins

ActiveUS20100181524A1Low ozone depletionLower global warming potentialOther chemical processesNon-surface-active detergent compositionsScavengerOzone depletion potential
Disclosed is a combination of hydrofluoroolefins and / or hydrochlorofluoroolefins with stabilizers wherein the stabilizers minimize the degradation of the hydrofluoroolefins and hydrochlorofluoroolefins during storage, handling and use yet allow for atmospheric degradation. The combinations exhibit low or zero ozone depletion potential and lower global warming potential making them of interest as replacements for chlorofluorocarbons and hydrfluorocarbons. The combinations of the present invention comprise hydrofluoroolefins and / or hydrochlorofluoroolefins in combination with a stabilizer or stabilizers selected from free radical scavengers, acid scavengers, oxygen scavengers, polymerization inhibitors and combinations thereof.
Owner:ARKEMA INC

Corrosion inhibitor system for mildly acidic to ph neutral halogen bleach-containing cleaning compositions

A cleaning composition with a corrosion inhibitor system and an active halogen-based bleaching system and aqueous solution is described for inhibiting corrosion of metal surfaces to which the composition is applied, especially when the cleaning composition is not rinsed from the treated metal surface prior to drying of the composition on the metal surface. The corrosion inhibitor is at least an alkyl phosphonate compound, wherein the alkyl group has 6 or more carbon atoms, and salts thereof. The bleaching system includes one or more sources of hypohalous acid or hypohalite ion, such as a stabilized hypochlorite solution, in particular a mixture of N-chlorosulfamate salts.
Owner:SC JOHNSON & SON INC

Corrosion-inhibiting cleaning compositions for metal layers and patterns on semiconductor substrates

A corrosion-inhibiting cleaning composition for semiconductor wafer processing includes an aqueous admixture of at least water, a surfactant and a corrosion-inhibiting compound selected from a group consisting of amino phosphonates, polyamines and polycarboxylic acids. The quantity of the corrosion-inhibiting compound in the admixture is preferably in a range from about 0.0001 wt % to about 0.1 wt % and the quantity of the surfactant is preferably in a range from about 0.001 wt % to about 1.0 wt %. The aqueous admixture may also include sulfuric acid and a fluoride, which act as oxide etchants, and a peroxide, which acts as a metal etchant.
Owner:SAMSUNG ELECTRONICS CO LTD +1

Pressed, self-solidifying, solid cleaning compositions and methods of making them

The present invention relates to a method of making a solid cleaning composition. The method can include pressing and / or vibrating a flowable solid of a self-solidifying cleaning composition. For a self-solidifying cleaning composition, pressing and / or vibrating a flowable solid determines the shape and density of the solid but is not required for forming a solid. The method can employ a concrete block machine for pressing and / or vibrating. The present invention also relates to a solid cleaning composition made by the method and to solid cleaning compositions including particles bound together by a binding agent.
Owner:ECOLAB USA INC

Stripping composition

InactiveUS6869921B2Excels in ability to removeExcellent stripping compositionSurface-active detergent compositionsDetergent mixture composition preparationAlcoholPreservative
A stripping composition comprising at least one of alcohols having an ether-bond in the molecule thereof as component (a), and an anticorrosive as component (b). Furfuryl alcohol or tetrahydrofurfuryl alcohol is preferable as component (a).
Owner:KANTO CHEM CO INC +1

Method of dissolving and/or inhibiting the deposition of scale on a surface of a system

A method of dissolving and / or inhibiting the deposition of scale on a surface of a system comprises the step of bringing the surface of the system into contact with a composition. The composition can comprise from about 3 to about 15 parts by weight of a chelating component. The chelating component is selected from the group of MGDA, NTA, HEDTA, GLDA, EDTA, DTPA, and mixtures thereof. The composition can further comprise from about 3 to about 15 parts by weight of an acidic component, which is different than the chelating component. The composition can further comprise at least about 60 parts by weight of water. Each of the parts by weight ranges above are based on 100 parts by weight of the composition. The composition may further comprise a surfactant component and / or a corrosion inhibitor.
Owner:BASF AG

Cleaning and Corrosion Inhibition System and Composition for Surfaces of Aluminum or Colored Metals and Alloys Thereof Under Alkaline Conditions

InactiveUS20080108539A1Inhibit and reduce of surfaceReliably inhibit reduce corrosionInorganic/elemental detergent compounding agentsOrganic detergent compounding agentsAlkaline earth metalPharmaceutical industry
The present invention relates to corrosion inhibitor systems, in particular to cleaning and corrosion inhibiting compositions for surfaces of aluminum or colored metals and alloys thereof under alkaline conditions, especially in the food and pharmaceutical industries. The cleaning and corrosion inhibiting compositions comprise as a corrosion inhibitor at least one alkyleneoxy alkylphosphate di- or triester having the general formula (I) where Z is either —O—M or —O—(AO)n2— Alkyl wherein M is an ammonium, alkali metal or alkaline earth metal cation, Alkyl is a C5-C22 alkyl or alkylaryl group, AO is a C2-4-alkylene oxide unit and n1, n2 and n3 each are integers from 2 to 10.
Owner:JOHNSONDIVERSEY INC

High molecular weight polyacrylates for aluminum protection in warewash applications

A warewashing detergent composition is provided for use for in cleaning of alkaline sensitive metals such as aluminum or aluminum containing alloys. The compositions include alternatives to sodium tripolyphosphate and / or other phosphorous containing raw materials, while retaining cleaning performance and corrosion prevention. According to the invention, high molecular weight polyacrylates (polyacrylic acid homopolymers) with a molecular weight of at least about 5000 are used as corrosion inhibitors and can be included for aluminum protection in a number of different detergent compositions.
Owner:ECOLAB USA INC
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