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3307results about "Inorganic non-surface-active detergent compositions" patented technology

Stable solid block detergent composition

The dimensionally stable alkaline solid block warewashing detergent uses an E-form binder forming a solid comprising a sodium carbonate source of alkalinity, a sequestrant, a surfactant package and other optional material. The solid block is dimensionally stable and highly effective in removing soil from the surfaces of dishware in the institutional and industrial environment. The E-form hydrate comprises an organic phosphonate and a hydrated carbonate.
Owner:ECOLAB USA INC

Stable solid block metal protecting warewashing detergent composition

The dimensionally stable alkaline solid block warewashing detergent uses an E-form binder forming a solid comprising a sodium carbonate source of alkalinity, a metal corrosion protecting alkali metal silicate composition, a sequestrant, a surfactant package and other optional material. The solid block is dimensionally stable and highly effective in removing soil from the surfaces of dishware in the institutional and industrial environment. The E-form hydrate comprises an organic phosphonate and a hydrated carbonate.
Owner:ECOLAB USA INC

Non-chlorinated concentrated all-in-one acid detergent and method for using the same

Non-chlorinated concentrated acid detergent compositions and methods for using the same are provided. More particularly, the acid detergents comprise a quantity of a fatty alkyl-1,3-diaminopropane or salt thereof and optionally alkylsulfonic acid. The detergents form the basis for an all-in-one cleaning, sanitizing, and descaling composition for use on soiled surfaces, particularly surfaces contaminated with milk soils and other food soils.
Owner:DELAVAL HLDG AB

Aqueous fluoride compositions for cleaning semiconductor devices

The present invention relates to dilute fluoride solutions and methods for cleaning plasma etch residue from semiconductor substrates including such dilute solutions. The compositions and methods according to the invention can advantageously provide both cleaning efficiency and material compatibility.
Owner:EKC TECH

Stabilized alkaline compositions for cleaning microelectronic substrates

The invention provides aqueous alkaline compositions useful in the microelectronics industry for stripping or cleaning semiconductor wafer substrates by removing photoresist residues and other unwanted contaminants. The compositions typically contain (a) one or more metal ion-free bases at sufficient amounts to produce a pH of about 10-13 and one or more bath stabilizing agents having at least one pKa in the range of 10-13 to maintain this pH during use; (b) optionally, about 0.01% to about 5% by weight (expressed as % SiO2) of a water-soluble metal ion-free silicate; (c) optionally, about 0.01% to about 10% by weight of one or more chelating agents; (d) optionally, about 0.01% to about 80% by weight of one or more water-soluble organic co-solvents; and (e) optionally, about 0.01% to about 1% by weight of a water-soluble surfactant.
Owner:AVANTOR PERFORMANCE MATERIALS LLC

Post clean treatment

A composition for removal of chemical residues from metal or dielectric surfaces or for chemical mechanical polishing of a copper or aluminum surface is an aqueous solution with a pH between about 3.5 and about 7. The composition contains a monofunctional, difunctional or trifunctional organic acid and a buffering amount of a quaternary amine, ammonium hydroxide, hydroxylamine, hydroxylamine salt, hydrazine or hydrazine salt base. A method in accordance with the invention for removal of chemical residues from a metal or dielectric surface comprises contacting the metal or dielectric surface with the above composition for a time sufficient to remove the chemical residues. A method in accordance with the invention for chemical mechanical polishing of a copper or aluminum surface comprises applying the above composition to the copper or aluminum surface, and polishing the surface in the presence of the composition.
Owner:DUPONT AIR PRODS NANOMATERIALS

Removing solution

The present invention provides a resist-removing solution for low-k film and a cleaning solution for via holes or capacitors, the solutions comprising hydrogen fluoride (HF) and at least one member selected from the group consisting of organic acids and organic solvents. The invention also provides a method of removing resist and a method of cleaning via holes or capacitors by the use of the solutions.
Owner:DAIKIN IND LTD

Alkaline, post plasma etch/ash residue removers and photoresist stripping compositions containing metal-halide corrosion inhibitors

The invention provides alkaline compositions useful in the microelectronics industry for stripping or cleaning semiconductor wafer substrates by removing photoresist residues and other unwanted contaminants. The compositions contain (a) one or more bases and (b) one or more metal corrosion inhibiting metal halides of the formula: WzMXy where M is a metal selected from the group Si, Ge, Sn, Pt, P, B, Au, Ir, Os, Cr, Ti, Zr, Rh, Ru, and Sb; X is a halide selected from F, Cl, Br and I; W is selected from H, to an alkali or alkaline earth metal, and a metal ion-free hydroxide base moiety; y is a numeral of from 4 to 6 depending on the metal halide; and z is a numeral of 1, 2 or 3.
Owner:AVANTOR PERFORMANCE MATERIALS INC

Single phase color change agents

There is provided a color change composition that remains stable in a single phase and that contains an indicator that produces an observable color change after a period of time to show that sufficient cleaning has been done or to indicate the thoroughness of the cleaning. This use indicating color change is useful for, for example, in soap for teaching children to wash their hands for a sufficient period of time. This composition may be added to many different base materials to indicate time of use or as a way to introduce enjoyment to the activity.
Owner:KIMBERLY-CLARK WORLDWIDE INC

Compositions and method for removing coatings and preparation of surfaces for use in metal finishing, and manufacturing of electronic and microelectronic devices

Improved cleaning compositions for removing particles, organic contamination, photoresist, post-ash residue, coatings, and other materials from metal and silicon surfaces including substrates present during the manufacture of integrated circuits, liquid crystal displays, and photovoltaic devices. The cleaning and surface preparation compositions comprise one or more water soluble strongly basic components, one or more water soluble organic amines, one or more water soluble oxidizing agents, balance water. Optional components can include corrosion inhibitors, surfactants and chelating agents.
Owner:SURFACE CHEM DISCOVERIES

Warewashing composition for use in automatic dishwashing machines, and method for using

A warewashing composition includes a cleaning agent having a detersive amount of a surfactant, an alkaline source in an amount effective to provide a use composition having a pH of at least about 8 when the use composition is measured at a solids concentration of about 0.5 wt %, and a corrosion inhibitor in an amount sufficient for reducing corrosion of glass when the warewashing composition is combined with water of dilution at a dilution ratio of at least about 20:1 water of dilution to detergent composition o form a use composition. The corrosion inhibitor includes a salt of calcium, magnesium, or a mixture of calcium and magnesium. The salt has a water solubility of less than about 0.5 wt % in water at about 20° C. and atmospheric pressure so that the salt precipitates to form a protective layer on a substrate in contact with the use composition.
Owner:ECOLAB USA INC

Liquid cleaner for the removal of post-etch residues

Cleaning compositions and processes for cleaning post-plasma etch residue from a microelectronic device having said residue thereon. The composition achieves highly efficacious cleaning of the residue material, including titanium-containing, copper-containing, tungsten-containing, and / or cobalt-containing post-etch residue from the microelectronic device while simultaneously not damaging the interlevel dielectric, metal interconnect material, and / or capping layers also present thereon. In addition, the composition may be useful for the removal of titanium nitride layers from a microelectronic device having same thereon.
Owner:ENTEGRIS INC

Use of absorbent materials to separate water from lipophilic fluid

The present invention relates to the use of absorbent materials for separating water from an emulsion comprising water and lipophilic fluid. The methods, systems, and compositions of the present invention expose the emulsion to absorbent materials such that water is absorbed out of the emulsion in order to facilitate the recovery of the lipophilic fluid.
Owner:THE PROCTER & GAMBLE COMPANY

New cosmetic, personal care, cleaning agent, and nutritional supplement compositions and methods of making and using same

The present invention involves new cosmetic, personal care, cleaning agent, biocidal agent, functional food, and nutritional supplement compositions. These new compositions incorporate bioactive glass into cosmetics, personal care items, cleaning agents, biocidal agents, functional foods, and nutritional supplements. The present invention also involves methods of making and methods of using such compositions.
Owner:SCHOTT AG

High alkaline cleaners, cleaning systems and methods of use for cleaning zero trans fat soils

The present disclosure relates to high alkaline cleaners, cleaning systems and methods for removing polymerized zero trans fat soils. The high alkaline cleaner of the present invention generally includes one or more alkaline wetting and saponifying agent(s), a chelating / sequestering system and a surface modifying-threshold agent system. In various embodiments, the cleaners may include, at least one cleaning agent comprising a surfactant or surfactant system and / or a solvent or solvent system and / or a cleaning booster such as a peroxide or sulfite type additive. The cleaners may also include one or more components to modify the composition form and / or the application method in some embodiments. All components described above may also be optimized optionally, to provide emulsification of a composition (both as a usable product or a concentrate that can be diluted to form a usable product). The use of the high alkaline cleaner of the present invention has demonstrated enhanced cleaning characteristics especially at higher temperatures (100° F. to about 200° F.) but also shows enhanced cleaning at ambient temperatures.
Owner:ECOLAB USA INC

Stable solution of zinc ions and bicarbonate and/or carbonate ions

A storage stable aqueous solution or aqueous gel of zinc ions in the presence of bicarbonate ions is disclosed. The solution comprises: (a) a source of zinc ion, (b) a source of a stabilizing anion which can stabilize soluble zinc and bicarbonate and / or carbonate in solution; (c) a source of bicarbonate ion; and (d) a solvent therefor. The solvent comprises a major proportion of water. The zinc salt is present in an amount suitable for the intended purpose; the stabilizing anion in an amount B of at least 1.2 equivalents per equivalent of zinc ion; and the bicarbonate ion cannot exceed certain levels which are related to the level of the stabilizing anion.
Owner:CHURCH & DWIGHT CO INC

Supercritical fluid cleaning of semiconductor substrates

Chemical formulations and methods for removing unwanted material, such as unexposed photoresist, metal oxides, CMP residue, and the like, from semiconductor wafers or other substrates. The formulations utilize a supercritical fluid-based cleaning composition, which may further include (I) co-solvent(s), (II) surfactant(s), (III) chelating agent(s), and / or (IV) chemical reactant(s).
Owner:ADVANCED TECH MATERIALS INC

Process for preparing detergent particles having coating or partial coating layers

A process for preparing a detergent particle having a coating layer of a water-soluble material is provided. The process comprises providing a particle core of a detergent active material and the particle core is then at least partially covered by a particle coating layer of a water soluble coating material including double salt combinations of alkali metal carbonates and sulfates that reduces the surface area of the particle.
Owner:THE PROCTER & GAMBLE COMPANY

Cleaning submicron structures on a semiconductor wafer surface

Cleaning solutions and cleaning methods targeted to particular substrates and structures in semiconductor fabrication are described. A method of cleaning fragile structures having a dimension less than 0.15 um with a cleaning solution formed of a solvent having a surface tension less than water while applying acoustic energy to the substrate on which the structures are formed is described. Also, a method of cleaning copper with several different cleaning solutions, and in particular an aqueous sulfuric acid and HF cleaning solution, is described. Also, methods of cleaning both sides of a substrate at the same time with different cleaning solutions applied to the top and the bottom are described.
Owner:APPLIED MATERIALS INC

Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrate

A composition and process for removing photoresist and / or sacrificial anti-reflective coating (SARC) materials from a substrate having such material(s) thereon. The composition includes a base component, such as a quaternary ammonium base in combination with an alkali or alkaline earth base, or alternatively a strong base in combination with an oxidant. The composition may be utilized in aqueous medium, e.g., with chelator, surfactant, and / or co-solvent species, to achieve high-efficiency removal of photoresist and / or SARC materials in the manufacture of integrated circuitry, without adverse effect on metal species on the substrate, such as copper, aluminum and / or cobalt alloys, and without damage to SiOC-based dielectric materials employed in the semiconductor architecture.
Owner:ENTEGRIS INC

Methods of simultaneously cleaning and disinfecting industrial water systems

On-Line and Off-Line methods of simultaneously cleaning and disinfecting an industrial water system are described and claimed. The methods involve the addition to the water of the industrial water system of a Compound selected from the group consisting of the alkali salts of chlorite and chlorate and mixtures thereof; and an acid, followed by allowing the water in the industrial water system to circulate for several hours. The reaction of the alkali salts of chlorite and chlorate and acid produces chlorine dioxide in-situ in the water of the industrial water system. The chlorine dioxide kills microorganisms and the acid acts to remove deposits upon the water-contact surfaces of the equipment. An alternative method involves the use of a chelating agent and a biocide. Other possible cleaning and disinfection reagents may be added as needed including corrosion inhibitors, chelating agents, biocides, surfactants and reducing agents. These cleaning and disinfecting methods work in a variety of industrial water systems including cooling water and boiler water systems.
Owner:ECOLAB USA INC

Cleaning formulation for removing residues on surfaces

The present disclosure provides a non-corrosive cleaning composition that is useful for removing residues from a semiconductor substrate. The composition can comprise water, at least one hydrazinocarboxylic acid ester, at least one water soluble carboxylic acid, optionally, at least one fluoride-containing compound, and, optionally, at least one corrosion inhibitor not containing a carboxyl group. The present disclosure also provides a method of cleaning residues from a semiconductor substrate using the non-corrosive cleaning composition.
Owner:FUJIFILM ELECTRONICS MATERIALS US
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