The invention discloses a solder paste laser-induced forward transfer device and method. The solder paste laser-induced forward transfer device comprises a laser, a light beam shaping module, a lightpath adjusting module, a solder paste transfer module and a computer control system, the laser is connected with the light beam shaping module and is close to the light path adjusting module, and thesolder paste transfer module is located below the light path adjusting module; the light beam shaping module comprises a beam-expanding lens, an aperture, a flat-topped light beam shaper and a space light modulator; the light path adjusting module comprises a two-dimensional galvanometer and an f-theta lens meter; the solder paste transfer module is composed of a transparent substrate, a tin pastefilm, a clamp, a Z-axis lifting table, a receiving substrate, and an XYZ precise moving platform; and the computer control system consists of a computer and drivers of other devices. Non-contact high-precision solder paste transferring without masking can be achieved; and the production cycle can be greatly shortened, and the production cost can be lowered.