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225 results about "Electric stress" patented technology

The dielectric or insulation has an electric field, equal to applied voltage, which causes a stress in it , described as volts / unit thickness. If this stress goes beyond its bearing capacity, there will be insulation breakdown or failure .

Thin film transistor and method of manufacturing the same

Provided are a coplanar structure thin film transistor that allows a threshold voltage to change only a little under electric stress, and a method of manufacturing the same. The thin film transistor includes on a substrate at least: a gate electrode; a gate insulating layer; an oxide semiconductor layer including a source electrode, a drain electrode, and a channel region; a channel protection layer; and an interlayer insulating layer. The channel protection layer includes one or more layers, the layer in contact with the oxide semiconductor layer among the one or more layers being made of an insulating material containing oxygen, ends of the channel protection layer are thinner than a central part of the channel protection layer, the interlayer insulating layer contains hydrogen, and regions of the oxide semiconductor layer that are in direct contact with the interlayer insulating layer form the source electrode and the drain electrode.
Owner:CANON KK

Gas-protective submerged-arc welding digitalized power supply system for dual ARM (Automated Route Management) control and control method thereof

The invention discloses a gas-protective submerged-arc welding digitalized power supply system for dual ARM (Automated Route Management) control and a control method thereof. The system comprises a case and a built-in circuit, wherein the built-in circuit comprises a main circuit unit and a main control unit; the main circuit unit is a full-bridge inverting main circuit of a limited bipolar soft switch; and an ARM9S3C2440 controller is used in the main control unit. In the control method, a corresponding welding mode is selected through the controller, the welding process is monitored by the main control unit and three-phase power frequency alternating current is converted by the main circuit unit to obtain the required smooth direct current with heavy flow and low voltage. The invention can provide two different welding processes of submerged-arc welding and gas-protective welding for one welding machine, realize the soft switch in all range, greatly reduce the switch loss and the electric stress, effectively reduce the electromagnetic interference of an inverting welding machine while improving the efficiency and saving energy and improve the electromagnetic compatibility and the reliability of the inverting welding machine.
Owner:GUANGDONG POWER ENG +1

Multi-stress limit determination method for intelligent ammeter

ActiveCN102707257AHardened test data is scarceMake up for the flaws in processing intensive test dataElectrical measurementsSmall sampleElectric stress
The invention discloses a multi-stress limit determination method for an intelligent ammeter. The method comprises the following steps: determining the sensitive stress of the intelligent ammeter through FMEA (Failure Mode and Effects Analysis); respectively setting the stepping reinforcement stress tests of both temperature and electric stress; testing the output characteristics of the intelligent ammeter; processing the test result; and determining the mechanism consistency condition. The method provided by the invention is specially for determining the mechanism consistency of the intelligent ammeter and makes up the blank that a matched method specially researched and developed for the intelligent ammeter is unavailable in the present market. The conventional reinforcement test data of the intelligent ammeter is less, and can not be analyzed more accurately by adopting a traditional data processing method. The grey theory method provided by the invention can be used under the small-sample poor-information condition, thereby compensating defects when the reinforcement testing data is processed by the traditional method.
Owner:JIBEI ELECTRIC POWER COMPANY LIMITED CENT OF METROLOGY

Thermal-electric-mechanical multi-stress ageing test platform of extra-high voltage converter transformer paper oil insulation materials and testing method thereof

InactiveCN108226726AAging effectFeatures miniaturizationTesting dielectric strengthTransformerTest chamber
The present invention discloses a thermal-electric-mechanical multi-stress ageing test platform of extra-high voltage converter transformer paper oil insulation materials and a testing method thereof.The test platform comprises three stress modules; a thermal stress module comprises a heating plate arranged at the outer wall of an ageing test chamber to allow paper oil insulation materials to reach an assigned temperature; an electric stress module is formed by a voltage source and an electrode and is configured to provide a direct current voltage, an alternating current voltage and an alternating current / direct current compound voltage for the paper oil insulation materials, wherein the direct current voltage and the alternating current voltage can reach an assigned voltage level; and amechanical stress module is formed by a vibration table, wherein the vibration table can provide mechanical vibration with assigned frequency and amplitude. When the thermal-electric-mechanical modules work at the same time, the thermal-electric-mechanical modules can provide various stress ageing conditions for the paper oil insulation materials to simulate the complex work conditions of the internal portion of a converter transformer and perform individual regulation of three stresses so as to facilitate analysis and obtain ageing effects of three different stresses for the paper oil insulation materials.
Owner:XI AN JIAOTONG UNIV

Evaluation method of thermal vacuum environmental adaptability of elements and components for spacecraft

The invention relates to the technical field of the evaluation of thermal vacuum environmental adaptability, and discloses an evaluation method of the thermal vacuum environmental adaptability of elements and components for a spacecraft. The method comprises the following steps: S1, performing stress analysis to the thermal vacuum environment of the elements and components for the spacecraft, so as to fix the vacuum stress, thermal stress and electric stress of thermal vacuum environmental ground tests, S2, fixing the cycle index of the thermal vacuum environmental ground tests, S3, performing thermal vacuum ground testing to the elements and components for the spacecraft according to test conditions fixed through S1 and S2, so as to judge whether samples of the elements and components for the spacecraft are qualified, and S4, evaluating that the thermal vacuum environmental adaptability of the elements and components meets task requirements if the quantity of unqualified samples is smaller than or equal to the acceptance number regulated in a sampling scheme, or evaluating that the thermal vacuum environmental adaptability of the elements and components does not meet the task requirements. The method can rapidly and accurately evaluate performances of the elements and components for the spacecraft under the thermal vacuum environment, and provides a basis for reasonably selecting the elements and components for the spacecraft.
Owner:BEIJING SHENGTAOPING TEST ENG TECH RES INST

Non-oriented electrical steel sheet, production method therefor, and motor core

In the production of a non-oriented electrical stress sheet by hot rolling a slab having a chemical composition comprising, by mass %, C: not more than 0.005, Si: 1.5-6.0, Mn: 0.05-2.0 and P: 0.03-0.15, subjecting to a hot band annealing, if necessary, cold rolling, finish annealing, and forming an insulation coating, the cooling from 700° C. to 500° C. in the finish annealing is conducted in an oxidizing atmosphere with an oxygen potential PH2O / PH2of not less than 0.001 for 1-300 seconds, whereby P is segregated into the surface of the steel sheet after the finish annealing to obtain a non-oriented electrical steel sheet enhancing a crystal grain growth properties in the stress relief annealing.
Owner:JFE STEEL CORP

Quick evaluation method for ultimate stress strength of integrated circuit for spaceflight

InactiveCN104596719AQuickly determine damage limitsQuickly identify jobsVibration testingStrength propertiesCombined testUltimate stress
The invention discloses a quick evaluation method for ultimate stress strength of an integrated circuit for spaceflight. The quick evaluation method includes temperature stepping stress test, quick temperature change stress test, vibration stepping stress test, and temperature and vibration comprehensive stress test. The whole process of each test tests the functions of a sample to be evaluated and records fault phenomenons. The other special stress can be exerted to the sample to be evaluated when exerting temperature or vibration stress, such as electric stress. According to the quick evaluation method for the ultimate stress strength of the integrated circuit for the spaceflight, through exerting a series of combined tests, the failure time of the product is reduced, and the evaluation test finishing time is reduced to one week from the original six months to one year; through the heat, power and electric stress combined test, a superimposed or coordination effect is formed, and the evaluation test completeness and precision are greatly improved. Multiple verification results prove that the product fault mode coverage rate discovered in the test evaluation can arrive at more than 98%.
Owner:北京自动测试技术研究所有限公司

Valuation method of dielectric breakdown lifetime of gate insulating film, valuation device of dielectric breakdown lifetime of gate insulating film and program for evaluating dielectric breakdown lifetime of gate insulating film

The present invention discloses a valuation method, a valuation device and a valuation program of dielectric breakdown lifetime of a gate insulating film, used for evaluating dielectric breakdown lifetime of the gate insulating film of a MOS type element. The valuation method includes the following steps of: deciding a Weibull slope of lifetime distribution until reaching a soft breakdown of the gate insulating film of the MOS type element; deciding a detection condition of the soft breakdown from the decided Weibull slope after the above step; and executing a dielectric breakdown test by using the decided detection condition. The valuation device includes: a voltage supply unit to supply a voltage for the MOS type element so as to apply an electric stress to the MOS type element; a current measuring unit to measure a leakage current across the gate insulating film; and a temperature holding unit to hold temperature of a testing element containing the MOS type element to below a room temperature. According to the valuation method, the valuation device and the valuation program, the dielectric breakdown lifetime can be determined suitably.
Owner:SONY CORP

In-wafer reliability screening method for GaN HEMT (High Electron Mobility Transistor) device

The invention discloses an in-wafer reliability screening method for a GaN HEMT (High Electron Mobility Transistor) device. The in-wafer reliability screening method is characterized by comprising the following steps that: firstly, in-wafer electroluminescence spectrum testing platform is established, a GaN heterojunction HEMT device wafer is placed on a probe platform in a darkroom, and then probes are respectively pressed on a grid electrode, a source electrode and a leakage electrode; and then, the source electrode is grounded, certain forward bias is applied to the leakage electrode, backward bias Vgs, which changes from pinch-off voltage Vp to 0V, is applied to the grid electrode, a change relationship between the luminous intensity of a GaN heterojunction HEMT device and grid voltage is tested by virtue of a spectrum testing system, the luminescence spectrum of the device is tested under the adopted bias point Vgsm with the largest luminous intensity, and then the spectrum is analyzed to evaluate the reliability of the device. The in-wafer reliability screening method has the advantages that in-wafer screening can be realized; a series of reliability screening preparation procedures, such as scribing and packaging, is eliminated without long-time electric stress; and the reliability screening time is shortened, costs are saved, and work efficiency is improved.
Owner:NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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