Compositions suitable for use as wood adhesives are described, which compositions comprise: (a) a polymeric component selected from the group consisting of lignins, proteins, and mixtures thereof, (b) an adhesion
promoter comprising at least one component selected from the group consisting of (i) adducts of an
epoxide and a resin selected from the group consisting of
polyamine resins, polyamidoamine resins,
polyamide resins, and combinations thereof, and (ii) combinations of a curing agent and a compound having at least one amine,
amide,
imine,
imide, or
nitrogen-containing heterocyclic functional group capable of reacting with at least one functional group of the polymeric component; and (c) an additive selected from the group consisting of
urea, N-substituted ureas, N,N-disubstituted ureas, N,N′-disubstituted ureas, N,N,N′-trisubstituted ureas, N,N,N′,N′-tetrasubstituted ureas,
urea derivatives, and mixtures thereof.