The invention discloses a photosensitive
chip packaging part and a manufacturing method thereof and belongs to the technical field of
semiconductor packaging. The photosensitive
chip packaging part comprises a base island, pins, a
chip, a transparent
adhesive and a
plastic packaging material; the base island is provided with a groove and a box dam; the transparent
adhesive is arranged in the groove and the box dam; the pins are electrically connected with the chip; the plastic
package material wraps the upper part of the base island, the upper parts of the pins,
electrical connection parts andthe chip. According to the photosensitive chip packaging part and the manufacturing method thereof of the invention, half-
etching is performed on the upper part of a base material, so that the upperparts of the base island and the pins are formed; the upper part of the base island is treated, so that the groove and the box dam can be formed; the transparent
adhesive is added into the groove andthe box dam, so that the photosensitive area of the chip is attached to the transparent adhesive, and the chip is connected with the pins; the liquid transparent adhesive is cured, and
plastic packaging is performed by using the
plastic packaging material; and semi-
etching is carried out on the lower part of the base material, so that a photosensitive through hole can be formed. The invention aimsto solve the problem of failure to realize the photosensitive characteristic of the chip caused by the fact that the plastic packaging material can
stain the transparent adhesive can be solved; the transparent adhesive can be prevented from being stained; and the photosensitive characteristic of the chip can be realized.