Method for selectively growing nickel
A selective, seed layer technology, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems of difficult selective nickel plating, organic contamination and so on
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[0025] The specific embodiment of the present invention will be further described below in conjunction with accompanying drawing:
[0026] figure 1 It is a schematic flow sheet of a method for selectively growing nickel of the present invention; as figure 1 Shown, a kind of method of selective growth nickel of the present invention:
[0027] First, a silicon region consisting of a gate region and a source-drain region is prepared on a wafer, and a silicon oxide region and / or a silicon nitride region is prepared at the same time; wherein, at least one of the silicon oxide region and the silicon nitride region contains One; wherein the silicon oxide region includes sidewalls and shallow trench regions.
[0028] Then, immerse the wafer in a certain concentration of dilute hydrofluoric acid solution containing nickel ions to perform selective nickel plating to form a nickel seed layer on the silicon region; When in the solution for 5s to 600s, nickel ions will be deposited on t...
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