The invention belongs to the technical field of antennas, and provides a high-frequency micro-strip antenna with a substrate made of
high resistance silicon. The high-frequency micro-strip antenna comprises the substrate made of
high resistance silicon, right-square-
pyramid-
frustum-shaped grooves,
radiation patches, feeder lines of the
radiation patches and a ground lug, wherein the right-square-
pyramid-
frustum-shaped grooves are formed in the bottom of the substrate, and the
radiation patches are arranged on the upper surface of the substrate and provided with degeneration units. Due to the fact that air slots in the reverse side of the substrate made of
high resistance silicon are designed into the right-square-
pyramid-
frustum-shaped grooves, MEMS wet
etching can be adopted, the conical surfaces of the right-square-pyramid-frustum-shaped grooves are automatically etched into conical surfaces of which the angle is the same as the material
crystal orientation interfacial angle, a waste masking layer cannot be generated, and the
etching speed and flatness of the top surfaces of the grooves are respectively increased by about 10 times and 20 times of the
etching speed and flatness in the background technology. The high-frequency micro-strip antenna has the advantages that the structural design of the antenna is advanced, the production process is easy and convenient to conduct, production efficiency is high, the yield is high,
microwave losses are low, radiation efficiency is high, the performance of the antenna is excellent, the antenna is easily integrated to form an array type micro-strip antenna, production cost is low, and the requirements for large-scale production can be met.