Automatic secondary degassing fixed-length mechanism of ultrathin heat pipes

Abstract

The invention discloses an automatic secondary degassing fixed-length mechanism of ultrathin heat pipes. The automatic secondary degassing fixed-length mechanism comprises an automatic lifting device A installed on a length adjustment sliding table, an automatic clamping device B, a length positioning and extension device C and a PLC. The automatic secondary degassing fixed-length mechanism is simple in structure, efficient, stable, suitable for secondary degassing fixed-length processing of heat pipes of different lengths and particularly suitable for processing ultrathin heat pipes prepared from thin-walled heat pipes through a flattening process; the automatic secondary degassing fixed-length mechanism is advanced in structural design, stable and efficient in production, and size positioning and automatic clamping in the secondary degassing fixed-length process of the heat pipes correspondingly through the automatic lifting device A and the automatic clamping device B; downwards component force applied to the thin-walled heat pipes in the die-opening-sealing process is released through the length positioning and extension device C, deformation of bending or partial sinking of pipe bodies of the thin-walled heat pipes in the secondary degassing fixed-length process is avoided, the yield of products and enterprise economic benefits are greatly increased, and problems existing in secondary degassing fixed-length processing of existing ultrathin heat pipes are solved.

Description

technical field [0001] The invention belongs to the technical field of mechanical manufacturing, and relates to a mobile phone heat pipe processing equipment, in particular to an automatic secondary degassing and length-fixing mechanism for an ultra-thin heat pipe. Background technique [0002] With the rapid development of Internet technology and electronic technology, the performance of smartphones has become increasingly powerful, so the problem of heat dissipation of mobile phones caused by equipment operation has become more and more prominent. Ultra-thin heat pipes for heat dissipation have the advantages of high thermal conductivity (up to tens to hundreds of times that of ordinary metals), good temperature uniformity, high reliability, and no need for additional energy drive. Therefore, ultra-thin heat pipes are used in smartphones for cooling , can effectively solve the heat dissipation problem of excessive temperature rise and local "hot spots" of smartphones. [...

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Problems solved by technology

Chinese patent application 201110446349.4 discloses "an ultra-thin heat pipe secondary degassing and length fixing mechanism", and Chinese patent applications 201410856094.2 and 201210177860.3 disclose "a fully automatic heat pipe degassing and sealing device" and "a heat pipe degassing and fixing device" respectively. The bottom of the heat pipe in these types of devices is rigidly supported, which is not suitable for processing thin-walled heat pipes, because during the mold sealing process, the thin-walled heat pipes will be subjected to downward force, such as figure 1 At A shown, under the action of the downward component force, the thin-walled heat pipe body will produce bending deformation, and at the same time figure 1 B will produce concave deformation

Utilizing the existing technology, there will be no obvious local depressions during the secondary degassing process of conventional heat pipes, because the wall thickness of conventional heat pipes is above 0.20mm, and the strength is high; When making ultra-thin heat pipes, during the secondary degassing process of thin-walled heat pipes, the thin-walled heat pipe body is prone to local depressions; at the same time, the clamping mechanism is also easy to clamp it flat, resulting in a greatly increased rate of defective products

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