The invention belongs to the technical field of electronic materials, and particularly relates to a release film for a circuit board. The release film comprises a supporting layer, an adhesive layer,an aluminum foil layer and a release heat sealing layer. The release heat sealing layer comprises vinyl functionalized acrylic resin, allyl phenyl ether, polyvinyl alcohol, poly(3, 4-ethylene dioxythiophene), alumina coated superfine barium titanium, nano silicon dioxide, nano zirconium dioxide and curing agent. The release film has stable hot melting performance within a wide temperature range, thereby having high sealability with the circuit board; adhesion strength of the release heat sealing layer to the aluminum foil layer is higher than that of the same to the circuit board, so that stripping of the release heat sealing layer from the circuit board is facilitated, the release heat sealing layer cannot be transferred onto a circuit board material when being torn off, and appearance uniformity of the circuit board is ensured.