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Release film for circuit board

A circuit board and release film technology, which is applied in applications, household appliances, electronic equipment, etc., can solve the problems of high production cost, copper foil removal, etc., and achieve improved mechanical properties, improved heat sealing performance, and small release force Effect

Active Publication Date: 2019-03-08
浙江海顺新材料有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the high production cost caused by the large amount of copper foil used in the existing copper clad laminates, and it is difficult to remove the copper foil from the board surface after the production is completed, thereby proposing a low-cost, A release film that can replace copper foil in copper clad laminates and is easy to peel off after production

Method used

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  • Release film for circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] This embodiment provides a release film for a circuit board, such as figure 1 As shown, it includes a support layer 1 , an adhesive layer 2 , an aluminum foil layer 3 and a release heat-sealing layer 4 which are stacked in sequence.

[0037] The support layer 1 is a biaxially stretched polyester film with a thickness of 18 μm. The support layer 1 has high strength, which is beneficial to the curing and molding of the release film.

[0038] The adhesive layer 2 includes 75 parts by weight of polyurethane, 12.5 parts by weight of polypropylene resin modified by maleic anhydride, 10 parts by weight of n-butyl isopropionate, 25 parts by weight of ethylene-ethyl methacrylate copolymer, N-phenyl -N`-cyclohexyl-p-phenylenediamine 1.5 parts by weight.

[0039] Wherein, in the ethylene-ethyl methacrylate copolymer, the content of ethylene is 22.5 wt %; the thickness of the adhesive layer 2 is 4 μm.

[0040] Adding maleic anhydride-modified polypropylene resin and ethylene-ethy...

Embodiment 2

[0051] This embodiment provides a release film for a circuit board, such as figure 1 As shown, it includes a support layer 1 , an adhesive layer 2 , an aluminum foil layer 3 and a release heat-sealing layer 4 which are stacked in sequence.

[0052] The support layer 1 is a biaxially stretched polyester film with a thickness of 12 μm.

[0053] The adhesive layer 2 comprises 80 parts by weight of polyurethane, 10 parts by weight of polypropylene resin modified by maleic anhydride, 15 parts by weight of n-butyl isopropionate, 30 parts by weight of ethylene-ethyl methacrylate copolymer, N-phenyl -1 part by weight of N'-cyclohexyl-p-phenylenediamine.

[0054] Wherein, in the ethylene-ethyl methacrylate copolymer, the content of ethylene is 25 wt %; the thickness of the adhesive layer is 3 μm.

[0055] The aluminum foil layer 3 is made of H-state aluminum foil with a thickness of 20 μm. The surface of the aluminum foil layer 3 facing the release heat-sealing layer 4 is a roughene...

Embodiment 3

[0062] This embodiment provides a release film for a circuit board, such as figure 1 As shown, it includes a support layer 1 , an adhesive layer 2 , an aluminum foil layer 3 and a release heat-sealing layer 4 which are stacked in sequence.

[0063] The supporting layer 1 is a biaxially stretched polyester film with a thickness of 25 μm.

[0064] The adhesive layer 2 comprises 70 parts by weight of polyurethane, 15 parts by weight of polypropylene resin modified by maleic anhydride, 5 parts by weight of n-butyl isopropionate, 20 parts by weight of ethylene-ethyl methacrylate copolymer, N-phenyl -N`-cyclohexyl-p-phenylenediamine 2 parts by weight.

[0065] Wherein, in the ethylene-ethyl methacrylate copolymer, the content of ethylene is 20 wt %; the thickness of the adhesive layer is 5 μm.

[0066] The aluminum foil layer 3 is made of H-state aluminum foil with a thickness of 30 μm. The surface of the aluminum foil layer 3 facing the release heat-sealing layer 4 is a roughene...

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Abstract

The invention belongs to the technical field of electronic materials, and particularly relates to a release film for a circuit board. The release film comprises a supporting layer, an adhesive layer,an aluminum foil layer and a release heat sealing layer. The release heat sealing layer comprises vinyl functionalized acrylic resin, allyl phenyl ether, polyvinyl alcohol, poly(3, 4-ethylene dioxythiophene), alumina coated superfine barium titanium, nano silicon dioxide, nano zirconium dioxide and curing agent. The release film has stable hot melting performance within a wide temperature range, thereby having high sealability with the circuit board; adhesion strength of the release heat sealing layer to the aluminum foil layer is higher than that of the same to the circuit board, so that stripping of the release heat sealing layer from the circuit board is facilitated, the release heat sealing layer cannot be transferred onto a circuit board material when being torn off, and appearance uniformity of the circuit board is ensured.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and in particular relates to a release film for a circuit board. Background technique [0002] Copper Clad Laminate (CCL) is a prepreg made of wood pulp paper or glass fiber cloth and other reinforcing materials impregnated with resin, and then covered with copper foil on one or both sides and hot-pressed. Shaped material, referred to as copper clad laminate. Copper-clad laminates are the basic materials of the electronics industry, mainly used for processing and manufacturing printed circuit boards (PCBs) for electronic products such as televisions, radios, computers, and mobile communications. [0003] During the production process of CCL, the copper foil is mainly used to support and shape the resin in a fluid state, and is not an integral part of the final product. Therefore, the copper foil needs to be removed after the production is completed. In the existing technology, it i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/06B32B27/36B32B15/20B32B15/09B32B15/082B32B27/30B32B27/20B32B27/26B32B7/12B32B33/00C08L33/04C08L29/04C08L65/00C08K9/10C08K3/24C08K3/36C08K3/22C09J175/04C09J151/06C09J123/08C09J11/06
CPCB32B7/12B32B15/082B32B15/09B32B15/20B32B27/06B32B27/20B32B27/26B32B27/308B32B27/36B32B2307/31B32B2307/558B32B2457/00C08K2003/2244C08K2201/011C08L33/04C08L2205/03C09J11/06C09J175/04C08L29/04C08L65/00C08K9/10C08K3/24C08K3/36C08K3/22C08L51/06C08L23/0869C08K5/18
Inventor 李俊林武辉伍秋涛
Owner 浙江海顺新材料有限公司
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