40results about How to "Reduced risk of warping" patented technology

The invention discloses a method for preparing a K418 nickel-based high temperature alloy charging turbine based on a selective laser melting forming technology, and belongs to the technical field ofnickel-based high temperature alloy laser additive manufacturing. The method for preparing the K418 nickel-based high temperature alloy charging turbine based on the selective laser melting forming technology solves the problems of many defects, high cost, long period and the like of a traditional casting process in the development stage of the charging turbine. According to the method, firstly, ato-be-formed material is pretreated, then proper forming powder is selected, a model of the K418 charging turbine is constructed, a program file before forming and machining process parameter settingare prepared and imported into SML equipment, under the argon atmosphere, the SML equipment conducts selective melting on the forming powder material on a workbench according to a scanning path and process parameters in a program, and then according to the set layer thickness, the workbench is lowered by one layer thickness, then the powder is laid, the forming powder continues to be subjected toselective melting, the action is repeated, and the charging turbine is formed through step-by-step stacking. By means of the method, the buckling deformation risk of a charging turbine blade is reduced, and part defects caused by stress shrinkage are avoided.

The invention discloses a composite polyamide material for a large-thickness-tolerance precision injection molded part. The composite polyamide material is prepared from, by weight, 80-85 parts of nylon 6, 3-7 parts of stainless steel fiber masterbatch, 0.5-2 parts of montanic calcium, 0.2-1 part of talcum powder, 2-4 parts of oleic acid, 1-2 part of a dendritic rheological modifier and 0.5-1 part of an anti-shrinking agent. The composite polyamide material uses stainless steel fiber masterbatch as the modifier, utilizes high heat conductivity of stainless steel fiber to makes temperature at all portions of the injection molded part in the molding and cooling process more uniform, and accordingly the warping risk is effectively reduced. The anti-shrinking agent, the montanic calcium and the talcum powder are adopted as compound nucleating agents, the crystallization rate of polyamide resin is improved, the grain size is decreased, and accordingly shrinkage of the fabricated part is effectively decreased. The oleic acid and the dendritic rheological modifier are adopted as composite rheological modifiers, so that the composite polyamide material has better liquidity in a molten state, and accordingly liquidity degradation caused by the added stainless steel fiber is effectively relieved.

The present invention provides a jig. The height of the heat dissipation substrate of the packaging structure can be limited, the risk of solder overflow in the reflow soldering process is reduced, and the yield of the packaging structure is improved. The jig comprises a base, a cover plate and a pressing plate. First limiting structures are arranged on the two sides, close to the first side edge and the second side edge, of the first face of the base correspondingly. Second limiting structures are arranged on the two sides, close to the third side edge and the fourth side edge, of the first face of the base correspondingly. Third limiting structures are arranged on the two sides, close to the third side edge and the fourth side edge, of the first face of the base respectively, each third limiting structure is provided with a step structure, and the step faces of the third limiting structures are used for supporting the second heat dissipation substrate. The cover plate covers the first surface of the base, and the cover plate is provided with a notch for exposing the second heat dissipation substrate; and the pressing plate is arranged on the face, away from the base, of the cover plate, a plurality of protruding blocks are arranged on the face, facing the base, of the pressing plate, and the protruding blocks can stretch into the notches and abut against the second heat dissipation substrate.

The invention discloses a display module and a manufacturing method thereof, a polaroid module and a manufacturing method thereof. The display module comprises a display panel; a first polaroid; a backlight module; a protective film covered on one side surface, far away from the display panel, of the first polaroid, wherein the distance between a first edge of the protective film and the first edge of a panel is greater than the distance between the first edge of the polaroid and the first edge of the panel; a first anti-upwarp adhesive tape, wherein the first anti-upwarp adhesive tape comprises a first adhesive tape part, a second adhesive tape part and a third adhesive tape part which are mutually and orderly arranged, the first adhesive tape part is located at one side, far away from the display panel, of the backlight module, the third adhesive type is covered at one side surface, far away from the display panel, of the first polaroid, and is located at a region between the first edge of a protective film and the first edge of the polaroid. Through the display module disclosed by the invention, the risk that the display panel upwarps from the backlight module in the display module can be reduced.

The invention discloses a wafer temporary bonding method which comprises the steps of supplying and cleaning a device wafer and a glass slide; dripping liquid on the glass slide and / or the device wafer; forming a bonded member through the glass slide and the device wafer by means of surface tension of the liquid; performing back surface processing on the device wafer in the bonded member; and debonding the glass slide and the device wafer. According to the wafer temporary bonding method provided by the invention, the device wafer is temporarily bonded with the glass slide by means of a surface tension effect of the liquid, and processes such as high-temperature processing or drying are not required, thereby reducing processes in wafer temporary bonding, preventing wafer warpage caused by high-temperature processing or a drying process, and reducing a wafer warpage risk.

The invention relates to a PCB jointed board determination method and device, electronic equipment and a storage medium, and belongs to the technical field of electronics. The method is applied to the electronic equipment and comprises the following steps: acquiring basic information and design requirement parameters of a single board; according to a preset design rule, processing the obtained basic information of the single boards and the design requirement parameters, and determining multiple jointed board parameters of jointed boards formed by the single boards, wherein the preset design rule is obtained by processing the jointed board parameters of multiple PCB jointed boards meeting the industrial standard; and outputting the jointed board parameter corresponding to the jointed board with the maximum utilization rate. According to the method, the design rule considering the quality and the utilization rate of the jointed board is obtained by processing the jointed board parameters of the plurality of PCB jointed boards meeting the industrial standard, so the optimal jointed board scheme can be quickly obtained only by inputting the basic information and the design requirement parameters of the single board during the subsequent jointed board design.

The invention discloses a novel outdoor umbrella. Back umbrella ribs of the outdoor umbrella are lengthened, and side curtains are added at two sides of an umbrella surface, so the umbrella is integrally in a semi-surrounded tent shape, and the protection area is increased. The novel outdoor umbrella comprises the umbrella surface, an umbrella frame and a plurality of umbrella rib caps, wherein the umbrella frame is covered by the umbrella surface, the umbrella frame comprises a plurality of main umbrella ribs and a plurality of support ribs, the tail ends of the support ribs are hinged with the upper parts of the main umbrella ribs, the main umbrella ribs comprise a plurality of ordinary umbrella ribs and at least two lengthened umbrella ribs with extending ribs, the tail ends of the lengthened umbrella ribs are provided with hook parts used for fixing the extending ribs, the top ends of the extending ribs are hinged with the lower parts of the lengthened umbrella ribs, the tail ends of the extending ribs and the tail ends of the ordinary umbrella ribs are respectively connected with the edge of the umbrella surface through the umbrella rib caps, the left side of the umbrella surface is provided with a left side curtain, the right side of the umbrella surface is provided with a right side curtain, and the left side curtain, the right side curtain and the umbrella surface are surrounded to form a semi-surrounded space.

The invention discloses a wafer temporary bonding method which comprises the steps of supplying and cleaning a device wafer and a glass slide; dripping liquid on the glass slide and / or the device wafer; forming a bonded member through the glass slide and the device wafer by means of surface tension of the liquid; performing back surface processing on the device wafer in the bonded member; and debonding the glass slide and the device wafer. According to the wafer temporary bonding method provided by the invention, the device wafer is temporarily bonded with the glass slide by means of a surface tension effect of the liquid, and processes such as high-temperature processing or drying are not required, thereby reducing processes in wafer temporary bonding, preventing wafer warpage caused by high-temperature processing or a drying process, and reducing a wafer warpage risk.

The invention relates to a method for producing tungsten on a semiconductor wafer. According to the method, tungsten is deposited on a first surface of a semiconductor wafer through chemical vapor deposition, a second surface, opposite to the first surface, of the semiconductor wafer, namely the back face is attached to a base, and at least one time of thermal annealing operation is inserted in the body growth stage. By means of the thermal annealing operation, the stress accumulated by tungsten deposited on the semiconductor wafer can be relieved, the warping risk of the semiconductor wafer is reduced, damage of process gas of chemical vapor deposition to the back face of the semiconductor wafer is reduced, and the purpose of protecting the back face of the wafer is achieved.

In a connection assembly of a turbine housing to a bearing housing of an exhaust gas turbocharger and to an exhaust gas turbocharger, wherein the turbine housing and the bearing housing are centered relative to each other and connected to each other in the region of a connection joint including a sealing assembly with a heat shield disposed between the turbine housing and the bearing housing, at least one cutout is provided in the heat shield for accommodating a centering means by way of which the turbine housing and the bearing housing are directly centered relative to one another.

The invention provides a semiconductor packaging method and a semiconductor packaging structure. The semiconductor packaging method comprises the following steps: forming an encapsulation structure, wherein the encapsulation structure comprises an encapsulation layer and a chip, a plurality of welding pads are arranged on the front surface of the chip, and the encapsulation layer at least covers the side surface of the chip; forming a rewiring layer on one side, close to the front surface of the chip, of the packaging structure, wherein the rewiring layer leads out the welding pads of the chip; forming a dielectric layer, wherein the dielectric layer covers the rewiring layer, and a through hole for exposing the rewiring layer is formed in the dielectric layer; and forming a pin layer on one side, deviating from the chip, of the dielectric layer, wherein the pin layer is electrically connected with the rewiring layer through the through hole.

The invention discloses a pull force self-coordination type multi-line suspension plate node structure. The pull force self-coordination type multi-line suspension plate node structure comprises a fixed part and a movable part and is characterized in that the fixed part is fixed to a lower part structure through embedding, bolts or welding and is provided with a projection part; the projection part is in a cylinder shape or in a barrel shape and forms a suspension line supporting structure; the movable part is sleeved onto the projection part of the fixed part and forms a relatively rotatable connection structure; a plurality of suspension line units extend from the outer side wall of the movable part and are radially arranged and located on the same plane; a plurality of radial screwing through holes are formed on the outer side wall of the movable part; and the movable part is connected with the fixed part by a locking bolt through the screwing through holes after suspension lines are mounted. The pull force self-coordination type multi-line suspension plate node structure is simple in structure; and with the adoption of the pull force self-coordination type multi-line suspension plate node structure, the resultant force of a plurality of pull lines finally acting on the fixed part is minimal, the torque effect cannot be generated, and a supporting frame is more stable.

The invention provides a method for manufacturing a terminal member and the terminal member. The method for manufacturing the terminal member includes the steps that a substrate is processed to form a preliminary structural member; a cylinder for generating a buckling structure is welded to the preliminary structural member in a friction stir welding mode; the welded cylinder is processed to generate the buckling structure; and a bearing part is matched with the buckling structure through screws and fixedly connected with the preliminary structural member in a hot melting adhesive dispensing mode to form the terminal member. According to the scheme, the processed substrate (the preliminary structural member) and the buckling structure (formed by processing the cylinder) are connected together in the friction stir welding mode, and then the bearing part is matched with the buckling structure through the screws and fixedly connected with the preliminary structural member in the hot melting adhesive dispensing mode to finally form the terminal member. The process is greatly simplified, the production efficiency, the material utilization rate and whole terminal strength are improved, and production cost and warping risks of the terminal member due to terminal dropping or distortion are reduced.

The invention discloses a display module and a display device. The display module includes: a display panel, a backlight module, and an adhesive tape for fixing the display panel and the backlight module; wherein, the adhesive tape has a first bending axis and a second bending axis extending in a first direction and parallel to each other. A bending axis and a second bending axis divide the adhesive tape into the first part, the second part and the third part which are sequentially connected; when the adhesive tape is unfolded into a flat state, the adhesive tape includes multiple auxiliary functions which are superimposed on each other in the third direction Layers, at least one auxiliary function layer includes a plurality of auxiliary units extending along a first direction and arranged sequentially along a second direction, and the third direction is respectively perpendicular to the first direction and the second direction. The display module and the display device provided by the present invention reduce the risk of the adhesive tape lifting from the surface of the display panel, thereby reducing the risk of poor display of the display module, and improving the performance reliability of the display module and the display device.

The invention discloses a novel aluminum alloy transformer cooling fin clamping mechanism and a technological process. The novel aluminum alloy transformer cooling fin clamping mechanism comprises fixed supports, a rotating support is installed on each fixed support and connected with a turning mechanism, a transformer cooling fin is installed on each rotating mechanism and connected with a main circulation pipeline, the transformer cooling fins are welded through a six-degree-of-freedom welding robot, and the six-degree-of-freedom welding robot conducts welding on the transformer cooling fins simultaneously; oil chambers are directly connected with the main circulation pipeline by omitting a connecting plate, and the risk of welding bending deformation of oil chambers is reduced; by means of design of the transformer cooling fin clamping mechanism, the problem that due to the fact that clamping and positioning are poor, bending deformation of the oil chambers and / or the cooling fins occurs in the welding process of the transformer cooling fins is solved; by means of the six-degree-of-freedom welding robot, the speed and precision of welding are increased; by means of design of the technological process of the transformer cooling fins, machining of the transformer cooling fins is easier and more reliable.

Embodiments of the present invention provide a stretchable display panel and a stretchable display device, which relate to the field of display technology and improve the warping phenomenon of the stretchable display panel. The stretchable display panel includes: a stretchable substrate, the stretchable substrate is composed of an island structure and a bridge structure, and two adjacent island structures are connected by a bridge structure; the island structure includes a first carrier substrate and a bridge structure. The first display film layer, the first display film layer includes pixel units, the bridge structure includes a second carrier substrate and the second display film layer, the second display film layer includes signal lines; the bridge structure has a first section, the first section Vertical to the plane where the second carrier substrate is located, and the first section is perpendicular to the extension direction of the bridge-like structure, the maximum width of the first section in the first direction is W1, and the maximum thickness of the bridge-shaped structure in the direction perpendicular to the plane where the second carrier substrate is located H1, H1≥W1, the first direction is parallel to the plane where the second carrier substrate is located, and is perpendicular to the extending direction of the bridge-shaped structure.

A method of manufacturing a shaped article comprising a long fiber thermoplastic composite sheet (1) and short fiber filled thermoplastic components (2,3), thermoforming them, wherein the thermoplastic component is preferably injected across the surface of the composite sheet .

The invention relates to the technical field of rolling equipment, in particular to a locking device for a roller bearing seat of a pipe mill. The locking device for the roller bearing seat of the pipe mill is used for locking the roller bearing seat, and comprises a base, a locking device, a locking device and a locking device, and the base is provided with a bearing seat accommodating groove and two through holes; cylinder bodies of the two hydraulic cylinders are fixed to the base and located at the tops of the two through holes respectively, output rods of the hydraulic cylinders penetrate through the through holes and stretch out of the bottom ends of the through holes, and locking blocks are arranged on the stretching-out parts; the roller bearing seat is arranged on the roller bearing in a sleeving mode and embedded into the bearing seat containing groove, two step faces are oppositely arranged on the peripheral face of the roller bearing seat, each step face is formed by a first plane and a second plane, and the first plane is perpendicular to the axis of the through hole; when the output rods of the hydraulic cylinders are located at the upper end of the moving stroke, the locking blocks are driven to be pressed on the corresponding first planes, the two locking blocks are matched, and the roller bearing seat is pressed and fixed in the bearing seat containing groove.