Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Hiro

976results about How to "Prevent material" patented technology

Electric power tool

An electric power tool includes a housing, a motor arranged within the housing, a power transmission unit arranged within the housing for transferring rotation of the motor to a work tool, a motor control unit arranged within the housing for controlling the rotation of the motor, and a trigger switch retractably provided to the housing for instructing the motor control unit to control the rotation of the motor. The electric power tool further includes a wireless communication device arranged within the housing for wirelessly communicating the work information on the content of works. The wireless communication device includes an antenna unit. The wireless communication device is covered with a shock-absorbing material. The antenna unit is arranged to lie higher than the trigger switch when the electric power tool is stored in a specified storage state.
Owner:PANASONIC ELECTRIC WORKS POWER TOOLS

Flip-chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding

Light emitting device die having a mesa configuration on a substrate and an electrode on the mesa are attached to a submount in a flip-chip configuration by forming predefined pattern of conductive die attach material on at least one of the electrode and the submount and mounting the light emitting device die to the submount. The predefined pattern of conductive die attach material is selected so as to prevent the conductive die attach material from contacting regions of having opposite conductivity types when the light emitting device die is mounted to the submount. The predefined pattern of conductive die attach material may provide a volume of die attach material that is less than a volume defined by an area of the electrode and a distance between the electrode and the submount. Light emitting device dies having predefined patterns of conductive die attach material are also provided. Light emitting devices having a gallium nitride based light emitting region on a substrate, such as a silicon carbide substrate, may also be mounted in a flip-chip configuration by mounting an electrode of the gallium nitride based light emitting region to a submount utilizing a B-stage curable die epoxy. Light emitting device dies having a B-stage curable die epoxy are also provided.
Owner:CREELED INC +1
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products