53results about How to "No shrinkage deformation" patented technology

The invention provides a thermal deformation resistant polyethylene foamed plastic and a preparation method thereof. The polyethylene foamed plastic is prepared by performing molding foaming on the following raw materials: bisphenol A epoxy resin 4, polyvinyl butyral, diethylenetriamine, epoxy-modified organic silicon resin, potassium acetate, azodicarbonamide and low density polyethylene.

The invention belongs to the technical field of functional films, and particularly relates to a film drying method applied to a sol film coating technology. The invention develops a film heating and drying process applied to the sol film coating technology. The process is different from a whole surface uniform heating manner for a traditional sol film, directional thermal fields are exerted on the symmetrical left side and right side of the film, and quick temperature rising treatment is utilized, so that larger temperature gradient distribution can be formed on the surface of the film, and finally film formation from the edge to the center of the film gradually is realized. According to the process, shrinkage distortion in the film drying process can be effectively inhibited, the energy consumption is low, the preparation period is short, the process is simple and controllable, no expensive equipment is needed, meanwhile no special requirement is needed on the to-be-prepared film material, the size and the substrate types, and a new technology with low cost and short period and capable of realizing industrialized implementation is provided for the drying process in the sol film coating.

The invention discloses a plasticized wood injection molding material which is prepared from the following components in parts by weight: 10-20 parts of PVC (polyvinyl chloride) resin, 20-50 parts of wood meal, 5-12 parts of zinc borate, 10-15 parts of shock-resistant agent, 2-5 parts of butyl epoxy oleate, 0.1-0.3 part of phytosterin, 1-3 parts of chlorhexidine hydrochloride, 1-2 parts of sodium alginate, 0.5-0.7 part of expanded perlite, 3-5 parts of magnesium oxide, 20-30 parts of ligneous plant fiber and 3-5 parts of paraffin. By using the novel recyclable environment-friendly wood injection molding material harmless to the human body instead of the traditional injection molding material mainly composed of plastics, the wood injection molding material has the advantage of cheap and accessible raw materials (such as trees, leaves, wood dust, industrial board scraps and the like), thereby greatly reducing the plastic consumption and changing the singleness of the injection molding material; and the prepared product has the advantages of high stability and no shrinkage distortion, and can be repeatedly recycled and reused.

The invention discloses a buffer pad for hot pressing of printed circuit boards and a preparation method thereof. The printed circuit board hot-pressing buffer pad includes: high temperature and high pressure resistant fiber felt, high temperature and high pressure resistant fiber layer and high temperature resistant adhesive, the high temperature and high pressure resistant fiber felt is a hexahedron; the six high temperature and high pressure resistant fiber felt The surface is wrapped by the high temperature and high pressure resistant fiber layer through the high temperature resistant adhesive. The high temperature and high pressure resistant fiber felt of the present invention is wrapped with high temperature and high pressure resistant fiber cloth / paper on six sides, which can effectively reduce fiber drop when used as a cushion, improve the quality of PCB products, and greatly reduce the risk of product defects. In addition, the cushion pad has a great improvement in cushioning pressure and cushioning temperature. In addition, since the cushion pad is wrapped on all six sides, there is no large shrinkage deformation in the horizontal and vertical directions during the pressing process or after the pressure is removed. The invention is environmentally friendly and economical, and is convenient for automatic production of PCB manufacturers.

The invention discloses a novel injection molding material, which is composed of the following components in parts by weight: 10-20 parts by weight of polyvinyl chloride resin; 20-50 parts of wood powder; 5-12 parts of zinc borate; 10-15 parts of anti-impact agent; ~5; sodium molybdate 4~5; liquid paraffin 2~4; sodium metasilicate pentahydrate 0.4~0.6; magnesium oxide 3~5; lignified plant fiber 20~30; paraffin 3~5. The present invention adopts the novel wooden injection molding material that can be recycled, environmentally friendly, and has no harm to the human body to replace the traditional plastic-based injection molding material. Leftovers, etc.), can greatly reduce the use of plastics and change the singleness of injection molding materials. At the same time, the products made have strong stability, no shrinkage and deformation, and can be recycled repeatedly.

The invention discloses an injection molding pipeline. The pipeline is prepared from the following components in parts by weight: 30-70 parts of PVC resin, 10-15 parts of active light calcium carbonate, 1-3 parts of ethylene glycol butyl ether, 1-2 parts of lauryl alcohol polyoxyethylene ether, 0.5-0.7 part of potassium iodide, 5-12 parts of stearic acid, 5-10 parts of commercial paraffin and 10-20 parts of wood fibers. The novel wood injection molding material which is recyclable and environment-friendly and does not hurt human bodies is adopted to replace traditional injection molding materials which is mainly prepared from plastic, and is prepared from low-price and easily available raw materials, such as woods, leaves, wood shavings, scraps of industrial plates and the like, so that use of plastics can be greatly reduced, simplicity of plastic materials can be changed, and the prepared product has strong stability, no shrinkage strain and recycling availability.

The invention provides a thermal-deformation-resisting polyethylene foam plastic and a preparation method thereof .The polyethylene foam plastic is prepared from bisphenol-A epoxy resin 4, polyvinyl butyral, diethylenetriamine, epoxy-modified organosilicon resin, potassium acetate, azodicarbonamide and low-density polyethylene in a molding foaming mode.