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87results about How to "Improve signal output" patented technology

Sound system with individual playback zones

ActiveUS20130170668A1Audibility be then increaseOutput level of also decreaseGain controlLoudspeaker signals distributionPsychoacousticsLoudness
The invention relates to a sound system in a vehicle. The sound system comprises a first audio signal source providing a first audio signal and a second audio signal source providing a second audio signal. The sound system further comprises loudness determination unit is configured for determining a loudness of the first audio signal based on a psycho-acoustic model of a human hearing and a type information unit configured for establishing type information of the second audio signal. The sound system further comprises a control unit configured for individually selecting, for each of at least two playback zones, a mixing mode depending on the type of the second audio signal, wherein the mixing modes relate to a relation between signal output gains of the first and second audio signals. The control unit is further configured for individually mixing for playback, in each of the at least two playback zones, the first audio signal and the second audio signal based on the selected mixing mode and the determined loudness. The sound system further comprises a plurality of loudspeakers addressing individually the at least two playback zones.
Owner:HARMAN BECKER AUTOMOTIVE SYST

Multilayer piezoelectric thin film cantilever beam sensor and preparation method therefor

The invention provides a multilayer piezoelectric thin film cantilever beam sensor and a preparation method therefor. A sacrificial layer releasing process is adopted to release the sacrificial layer from the front surface to form a piezoelectric micro-cantilever beam structure; the commonly-adopted CMOS process is fully utilized, so that the process is simple and controllable; the compatibility between the piezoelectric cantilever beam sensor manufacturing process and an silicon integrated circuit process is improved; the problem of pollution existing in a process that the bulk-silicon substrate is etched by a wet etching method and the cantilever beam is released from the back surface is avoided; in addition, the multilayer piezoelectric thin film and a flexible supporting layer are adopted, so that the sensitivity of the sensor or the deformation amplitude of an actuator is improved, and the response of the cantilever beam to external excitation and the signal output are improved; in addition, due to the flexible supporting layer, the structure and the processing technology of the sensor are simplified; and the piezoelectric micro-sensor adopting the structure can be applied to objects of any sizes and any surface shapes, so that the application range of the micro-sensor is expanded.
Owner:SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT +1
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