109results about How to "Avoid processing defects" patented technology

A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a drying / development processing block, and an interface block. An exposure device is arranged adjacent to the interface block. The drying / development processing block comprises a drying processing group. The interface block comprises an interface transport mechanism. A substrate is subjected to exposure processing by the exposure device, and subsequently transported to the drying processing group by the interface transport mechanism. The substrate is cleaned and dried by the drying processing group.

A processor includes a microarchitecture for working around a processing flaw, the microarchitecture including: at least one detector adapted for detecting a predetermined state associated with the processing flaw; and at least one mechanism to modify default processor processing behavior; and upon modification of processing behavior, the processing of an instruction involving the processing flaw can be completed by avoiding the processing flaw.

A substrate held by a spin chuck is supplied with a chemical solution by a chemical solution nozzle and a processing of the substrate is performed. At this time, the chemical solution supplied to the substrate scatters around and adheres to members (processing cup and splash guard) residing near the substrate. In the process of the substrate, a first cleaning liquid having the same ingredients as those of the chemical solution is supplied to an outer wall face of the splash guard from the guard cleaning nozzles without being in contact with the substrate. Thus, the outer wall face of the splash guard and the inner wall face of the processing cup are cleaned by the clean first cleaning liquid. The chemical solution supplied to the substrate and the first cleaning liquid supplied to the outer wall face of the splash guard are reused.

A liquid crystal display includes a first substrate including pixels, each having a transmissive area and a reflective area, a second substrate, and a liquid crystal layer disposed between the first and second substrates. Each of the pixels includes first and second thin film transistors which output a data signal in response to a first gate signal, a transmissive pixel electrode disposed in the transmissive area and electrically connected to the first thin film transistor to charge a first pixel voltage based on the data signal, a reflective pixel electrode disposed in the reflective area and electrically connected to the second thin film transistor to charge a second pixel voltage based on the data signal, and a voltage controller which controls the first pixel voltage and the second pixel voltage in response to a second gate signal, which is generated after the first gate signal.

A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure device is arranged adjacent to an interface block. The interface block comprises a drying processing group including two drying processing units and an interface transport mechanism. After a substrate is subjected to exposure processing by the exposure device, the substrate is transported to the drying processing units in the drying processing group by the interface transport mechanism, where the substrate is subjected to cleaning and drying processings.

A method of processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device and includes first, second and third processing units, includes the steps of forming a film made of a photosensitive material on the substrate by said first processing unit before exposure processing by said exposure device. The method also includes applying drying processing to the substrate by said second processing unit after the exposure processing by said exposure device and applying development processing to the substrate by said third processing unit after the drying processing by said second processing unit

In a tapered roller bearing assembly, a crowning profile formed portion of the roller rolling surface is made up of a contact area crowned portion, which is held in contact with an inner ring raceway surface, and a non-contact area crowned portion which is held in non-contact with the inner ring raceway surface. The contact area crowned portion and the non-contact area crowned portion have their generatrices extending in an axial direction of a roller, which generatrices are represented by corresponding continuous lines represented by different functions and continued smoothly at a point of connection, and the curvature of the generatrix of the non-contact area crowned portion in the vicinity of the connection point is chosen to be smaller than the curvature of the generatrix of the contact area crowned portion.

The invention discloses a high-performance carbon nano tube yarn and a preparation method thereof. The preparation method includes introducing at least two carbon nano tube fibers into a through hole,and pulling the carbon nano tube fibers along the length direction to thread the through hole with the carbon nano tube fibers continuously, thereby straightening the carbon nano tube fibers by pulling, and squeezing to allow the carbon nano tube fibers to shrink by the through hole; meanwhile, fully soaking the carbon nano tube fibers with a functional polymer solution, so as to obtain an integral yarn. Without adoption of the conventional yarn twisting method, strength loss of the carbon nano tube fibers in the early stage and unevenness of the yarn structure both caused by twisting are avoided, and weak links of strength of the yarn are decreased; the yarn prepared by the method has the advantages that interference bonding strength of fibers of the yarn is enhanced, breakage simultaneity of the fibers is improved, utilization rate of fiber strength is increased, and the yarn has high strength and good flexibility, thermal stability and wear-resistance performance.

The present invention relates to an adhesive film, to an encapsulated product of an organic electronic device using same and to a method for encapsulating an organic electronic device using same. More particularly, an adhesive film for encapsulating an organic electronic device comprises: a protective film layer, a first adhesive layer, a second adhesive layer and a release film layer sequentially arranged. The peel strength (A) between the first adhesive layer and the protective film layer is lower than the peel strength (B) between the second adhesive layer and the release film layer, and the peel strength (B) between the second adhesive layer and the release film layer is lower than the peel strength (C) between the first adhesive layer and an encapsulation substrate, thus improving faults during a peeling process.