176 results about "Simultaneity" patented technology

The invention discloses a submodule topology for a modular multi-level transverter. The submodule topology comprises a first switching module, a second switching module, a direct current capacitor and a third switching module, wherein the first switching module and the second switching module are connected in series, the negative end of the first switching module is connected with the positive end of the second switching module, and the first switching module and the second switching module are formed by connecting full-controlled devices and diodes in an antiparallel mode. The positive electrode and the negative electrode of the direct current capacitor are connected with the positive end of the first switching module and the negative end of the second switching module. The third switching module is electrically connected with the first switching module and the second switching module, so that a full-controlled device of the third switching module applies trigger pulses all the time during normal operation and is in a conducting state all the time, and currents of direct current faults can be blocked by locking the trigger pulses of the third switching module when direct current faults happen. The invention further comprises the transverter comprising a submodule and application of the transverter. By means of the submodule topology for the modular multi-level transverter and application of the modular multi-level transverter, a function of isolating the direct current faults is achieved, quantity and switching losses of switching devices in the submodule are decreased, and requirements on trigger simultaneity are reduced.

A back-illuminated type MOS (metal-oxide semiconductor) solid-state image pickup device 32 in which micro pads 34, 37 are formed on the wiring layer side and a signal processing chip 33 having micro pads 35, 38 formed on the wiring layer at the positions corresponding to the micro pads 34, 37 of the MOS solid-state image pickup device 32 are connected by micro bumps 36, 39. In a semiconductor module including the MOS type solid-state image pickup device, at the same time an image processing speed can be increased, simultaneity within the picture can be realized and image quality can be improved, a manufacturing process can be facilitated, and a yield can be improved. Also, it becomes possible to decrease a power consumption required when all pixels or a large number of pixels is driven at the same time.

A method for unlocking a mobile device is disclosed. When the mobile device is in the lock mode, the touch panel screen on the mobile device detects a multi-touch action simultaneously performed by users. The users perform the multi-touch action on a plurality of the touch points displayed on the touch panel screen. If the multi-touch action satisfies a predetermined unlock condition of the mobile device, the mobile device switches from a lock mode to an unlock mode. The simultaneous multi-touch action is provided to users for unlocking the mobile device. Thus, the simultaneity of the action is utilized to shortening the operating time of the unlock process.