The invention discloses a flat
polishing machine for
wafer processing. The flat
polishing machine structurally comprises a
workbench, a
polishing seat, a top plate and a button, the bottom of the polishing seat is embedded and fixed on the upper surface of the
workbench, the top plate is arranged right above the
workbench, and the button is embedded and fixed on the upper surface of the top plate.The flat polishing
machine has the beneficial effects that a
cut wafer is placed on the polishing seat, a rotating block is rotated to drive a screw rod to rotate, so that a polishing knife polishesthe flat of a
wafer, an air exhauster is started to upwards suck burrs removed and discharged in the polishing process into a storage
barrel, when the air exhauster stops working, a baffle is closed to prevent the burrs from falling out to influence the environment near the polishing machine, the air exhauster is started to drive a rotating rod to rotate, the rotating rod drives a polishing blockto rotate, so that a
brush rubs with the surface of the wafer to remove the burrs on the plat of the wafer, polish and
grind the burrs, meanwhile, the
cut burrs are shoveled up by an inclined scraper,so that the burrs are sucked into an isolation cavity conveniently, and are prevented from splashing everywhere due to the fact that the polishing block throws out the burrs.