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754 results about "Thin line" patented technology

Non-lethal electrical discharge weapon having a slim profile

InactiveUS20060120009A1Easy to placeAssure effectivenessElectrical apparatusSmallarmsPower flowPush off
An electrical discharge weapon configured as a lightweight, slim profile gun-shaped weapon which is less than one inch thick along the cartridge receiving chamber so that it can be readily placed in a police officer's uniform pocket or in a slim-line holster for easy deployment. All of the major internal components, including battery and transformer, are positioned above or behind the trigger aperture so that even with the dart cartridge in the chamber, the weapon's center of gravity is through the hand so that it is balanced and easily aimed at the target. The invention employs a specially configured chamber to receive a unique cartridge with widely separated darts. As a result, the electrodes may be also widely separated so that current will not jump the electrode gap even when the impacted darts leave a substantial gap to a suspect's skin. Thus, the present invention is more likely to be effective against suspect's wearing thick outerwear. The spent cartridge may be expelled by a spring-activated release for quick ejection and rapid reload. A bottom rail permits connection of another non-lethal device such as a mace canister for use as a secondary weapon or the attachment of tactical lighting or laser aiming devices. A push-on/push-off trigger switch is combined with a mechanical safety device to assure weapon effectiveness and safety for the police officer. Quick disconnect battery clip allows for rapid battery replacement.
Owner:LAW ENFORCEMENT ASSOC

Preparation method of high-brittleness transparent rock material test piece

InactiveCN103773056AHigh transparencyHigh brittlenessMass ratioThin line
The invention discloses a preparation method of a high-brittleness transparent rock material test piece. The preparation method comprises the steps of resin material selection, selection of materials for forming three-dimensional prefabricated built-in elliptical cracks, molding and space location. Raw materials comprise CY-39 type resin and YS-T31 type curing agent, wherein the mass ratio of the CY-39 type resin to the YS-T31 type curing agent is 100: 34, or and the volume ratio of the CY-39 type resin to the YS-T31 type curing agent is 100: 41. The preparation method comprises the following general steps: (1) weighing the materials; (2) mixing the materials; and (3) casting, molding and maintaining. Mica plates with the thickness of 0.12mm are used for forming the prefabricated cracks, and an elliptical steel mold with the corresponding size is used for cutting the mica plates into the required accurate size. The preparation method is characterized in that different parts of a left side face plate and a right side face place of the mold are drilled, a thin line is used for pulling, fixing and connecting the prefabricated cracks, the two ends of the thin line are fixed in holes of the two side face plates so as to play a role of accurate location, and three-dimensional crack test pieces with different numbers of cracks at different angles and different opposite locations are manufactured. The test piece prepared by the method has the characteristics of good brittleness, high transparency, easiness for molding and observing crack extension process and the like.
Owner:SHANDONG UNIV

Manufacturing process for step circuit of PCB (Printed Circuit Board)

InactiveCN102651946AReduce copper thickness dropEliminate poor quality defectsConductive material chemical/electrolytical removalProduction scheduleEngineering
The invention discloses a manufacturing process for a step circuit of a PCB (Printed Circuit Board). According to the manufacturing process, different film patterns are adopted twice for manufacturing the circuit, during the primary film pattern circuit manufacture, a positive film circuit pattern is adopted, compensation is carried out a film substrate circuit at different positions according to copper thickness so as to manufacture a special circuit, and sunk copper plate electrification is carried out on the special circuit, so that the copper thickness meets the requirement; then board grinding is carried out by a twice board grinding mode so as to reduce the copper thickness difference of step positions; a dry film is enabled to be fully combined with the step positions by virtue of a film attaching and air compressing mode; and finally, normal circuit pattern manufacturing is carried out by utilizing a high-precision LDI (Laser Direct Imaging) exposure machine. Compared with the prior art, the manufacturing process for the step circuit can be used for eliminating the defects of open circuit at the position of the step circuit, notches, large deckle edges, serious lateral erosion, halfway etching and poor quality of thin lines and the like existing in the step circuit manufacturing process, improving the production efficiency and the production quality, quickening the production schedule and lowering the production cost.
Owner:SHENZHEN SUNTAK MULTILAYER PCB

Image processing apparatus

An image processing apparatus includes a first sensor having a plurality of reading elements arranged in the primary scanning direction, a second sensor disposed in parallel with the first sensor and by a predetermined lines in the secondary scanning direction, an integral correction portion for correcting a time difference of data output due to a position difference between the first sensor and the second sensor by a line unit, and a fractional correction portion for correcting a time difference of data output due to a position difference between the first sensor and the second sensor by a sub line unit. Thus, the correction of the phase shift between element arrays can be performed as precisely as possible and the reproducibility of a black fine line is increased.
Owner:MINOLTA CO LTD
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