35 results about "Solder station" patented technology

A soldering station of unitary construction includes a base member, a sidewall extending upwardly from a base member segment, and a horizontal support member extending from the sidewall. Alternative embodiments include a soldering iron holder and a second sidewall extending upwardly from a second base member segment and a second horizontal support member extending from the second sidewall.

The invention provides a touch soldering station and relates to a welding device. The touch soldering station comprises a handle, a casing, a control system arranged in the casing and a temperature controller. The casing comprises a top panel and a front side panel, and a temperature measurement mechanism is arranged in the handle. The touch soldering station is characterized in that a display device is arranged on the outer surface of the front side panel of the casing, and a touch screen is installed on the front surface of the display device. Compared with the prior art, the touch soldering station has the advantages that due to the fact that the touch screen is adopted to replace a mechanical button panel and is a smooth plane and the surface of the touch screen is not provided with other components, the touch soldering station is convenient to operate and simply and attractive in appearance, and due to the fact that a dial plate and a pointer are in a picture displayed by the display device, the problem that a temperature value seen by operators is deviated due to changes of view angles of the operators is solved.

The invention relates to a lead-free soldering station, comprising a first conductor (1), a second conductor (2), a third conductor (3), an electric heating element (4), a temperature sensing element (8), a working welding tip ( 5) an integrated soldering iron tip (9); a handle connected to the soldering iron tip; and a control circuit. Wherein, the electric heating element (4) is connected in series between the first conductor (1) and the second conductor (2) to form a heating circuit and connected to the control circuit; the temperature sensing element (8) is connected in series at the first A temperature measurement circuit is formed between a conductor (1) and a third conductor (3) and is connected to the control circuit; there is a cavity at the tail of the working welding tip (5), and the electric heating element (4) and the temperature sensor Elements (8) are located in said cavity. The external shape of the temperature sensing element (8) is a cone, and its conical surface is close to the bottom surface of the cavity of the working welding tip (5). It has the advantages of fast heating and replenishment, accurate temperature measurement, and convenient replacement and disassembly.

A board-to-board plug, comprising several plug terminals, a plug body holding the several plug terminals as a whole, a cable assembly located behind the plug body and connected to the plug terminals, and a A shielding shell, the plug body includes a base and an extension formed from the base, the extension includes a protruding portion protruding downwards and a soldering station at the top, the shielding shell includes a base that covers the plug The covering top plate on the top surface of the main body, the covering front wall formed by bending downwards from the front end of the covering top plate, the covering side walls formed by bending backwards from the lateral ends of the covering front wall, and the plug body is formed with a convex strip, and the covering top plate is provided with a slot that is limited to the convex strip. The application can effectively limit the plug body.

A lamp filament lamp base component continuous production apparatus is characterized by comprising a machine frame, a rotating disk arranged on the machine frame and driven by power, clamps arranged at the periphery of the rotating disk and used for clamping the lamp bases, a lamp base molding station, a molybdenum chip bonding station, an upper solder station, a lamp filament soldering station, and a blanking station. The lamp base molding station, the molybdenum chip bonding station, the upper solder station, the lamp filament soldering station, and the blanking station are arranged on the machine frame and arranged from the rotating disk to the periphery sequentially. Compared with prior arts, the lamp filament lamp base continuous production apparatus is advantaged by being high in production efficiency and low in manpower consumption. The lamp filament lamp base continuous production apparatus is also advantaged by being fully automatic.

The invention discloses a large-sized LED with a concealed extension electrode. The large-sized LED includes an epitaxial structure, a second electrode, and a first electrode composed of a solder padelectrode connected to a metal extension electrode. The epitaxial structure includes a substrate, a second type of conductive layer, an active layer and a first type of conductive layer. The second type of conductive layer is electrically connected to the second electrode. A groove is formed in the first type of conductive layer. The side walls of the groove form metal extension electrode layers.The metal extension electrode layers of the adjacent side walls are continuous with each other. The solder pad electrode is arranged in the groove. The solder pad electrode and the metal extension electrode layers are electrically connected to each other. The invention also discloses a manufacturing method of the LED. A special groove structure is provided to achieve an effect of uniformly expanding the current. The extension electrode has an extremely low thickness, and is arranged on the vertical surface on the side of the groove, which is equivalent to being invisible. The large-sized LED solves the problem that the bottom surface of a metal extension electrode in the prior art shields light, and realizes a wide range of light emitting area, thereby maintaining a superior current spreading effect.

A chip replacement method disclosed by the present invention is suitable for replacing a ball grid array (BGA) packaging chip, belongs to the mainboard maintenance technology field, and comprises thefollowing steps of providing a ball grid array soldering station; setting a temperature curve that the BGA soldering station works; fixing a mainboard on the BGA soldering station, and aligning a to-be-replaced chip on the mainboard at a wind inlet and a wind outlet of the BGA soldering station; starting the BGA soldering station, enabling the BGA soldering station to heat the to-be-replaced chipaccording to the temperature curve, and operating the BGA soldering station when the actual working temperature of the BGA soldering station and the highest temperature of the temperature curve have the preset temperature difference to enable the BGA soldering station to keep a current working temperature; taking out the to-be-replaced chip from the mainboard, and cleaning the soldering tin on a pad corresponding to the to-be-replaced chip; turning off the BGA soldering station, and placing a substituting chip on the pad; starting the BGA soldering station, and enabling the BGA soldering station to solder the substituting chip on the mainboard according to the temperature curve. The beneficial effects of the above technical scheme are that the BGA chip replacement time is short, the soldering yield is high, and the BGA chip replacement efficiency is improved.

The invention discloses a processing method for a temperature-measuring bracket of a sub-gun probe, which comprises the steps of: setting an injection mold; fixing a compensation wire; clamping a mold, punching and welding a stand; injection molding a bracket; and cooling and demoulding. This processing method can fix the positive electrode compensation wire and the negative electrode compensation wire while injecting the plastic bracket, and at the same time use the stamping force when the injection mold is closed to form a soldering platform. The height of the welding platform is at the same horizontal position, and the compensation wire fixing structure of the injection mold can ensure that the two compensation wires remain fixed during the stamping and injection molding process. The processing method of this scheme eliminates the assembly process of the plastic bracket and the compensation wire in the past, ensures that the height of the soldering platform of the compensation wire is consistent, ensures the stability and accuracy of the temperature measurement of the sub-gun probe temperature measurement bracket, and simplifies the processing technology and improves the efficiency. Processing efficiency. The invention also discloses a sub-gun probe temperature measuring bracket processed by the above-mentioned processing method.

The invention relates to the field of welding technology, and discloses an intelligent electric soldering system and an electric soldering production management method, wherein the system includes a soldering pen and a soldering station, the soldering pen includes a soldering iron tip, the soldering iron tip is connected with a temperature detection element, and the temperature detection element It is connected to the soldering station. The soldering station is equipped with a temperature control module and a timing module. The soldering station is also connected with a conductive piece. The conductive piece is used to connect with the circuit where the soldering point is located. The timing module is used to detect the connection between the conductive piece and the soldering iron. When the tip is turned on or when the real-time temperature drop rate of the soldering iron tip is detected to reach the preset rate, the first timing program is triggered, and the first timing program is ended when it is detected that the conductive part is disconnected from the soldering iron tip and the total time of preheating welding is output. . The intelligent electric soldering system and electric soldering production management method provided by the present invention can realize automatic and precise control of the welding temperature of the solder joints; can effectively realize the timing function for the welding process, accurately reflect the welding time, and help ensure the welding quality. Efficient and convenient.